****************************************************************************** ****************************************************************************** BIRD ID#: 43 ISSUE TITLE: Component Test Point Subparameters REQUESTER: Bob Ross, Interconnectix DATE SUBMITTED: May 23, 1997 DATE ACCEPTED BY IBIS OPEN FORUM: June 12, 1997 ****************************************************************************** ****************************************************************************** STATEMENT OF THE ISSUE: Signal Integrity and Timing measurement locations have been assumed to be at the external pin location of the part where physical measurements are available. Some parts, such as ASICs specify these parameters for the Die itself. So the measurement locations need to be stated to be consistent with the specified data. ****************************************************************************** STATEMENT OF THE RESOLVED SPECIFICATIONS: Add to the [Component] keyword two optional subparameters 'Si_location' and 'Timing_location' as shown by the |* lines. |============================================================================== | Keyword: [Component] | Required: Yes | Description: Marks the beginning of the IBIS description of the integrated | circuit named after the keyword. |* Sub-Params: Si_location, Timing_location | Usage Rules: If the .ibs file contains data for more than one component, | each section must begin with a new [Component] keyword. The | length of the Component Name must not exceed 40 characters, | and blank characters are allowed. | | NOTE: Blank characters are not recommended due to usability | issues. | |* Si_location and Timing_location are optional and specify |* where the Signal Integity and Timing measurements are made |* for the component. The default location is at the 'Pin'. |* However, the 'Die' location is also available for either or |* and both subparameters. |* |------------------------------------------------------------------------------ [Component] 7403398 MC452 | Si_location Pin | Optional subparameters to give measurement Timing_locaton Die | location positions | ****************************************************************************** ANALYSIS PATH/DATA THAT LED TO SPECIFICATION: The Threshold values Vinl and Vinh and the timing test load values based on Vmeas, Rref, Cref, and Vref have historically been ASSUMED to be at the Pin location of the part because these are associated with external, measureable specifications. Some ASICs specify these parameters at the die. Therefore, optional subparameters to [Component] are proposed to provide this specification flexability so that the measurement location is consistent with the source data. The easiest way is to include this detail on a Component-wide basis so that simulators can detect automatically where measurements are to be taken. ****************************************************************************** ANY OTHER BACKGROUND INFORMATION: