Re: Help with package measurement

From: Will Hobbs <Will_Hobbs@ccm2.jf.intel.com>
Date: Mon Jul 25 1994 - 09:35:07 PDT

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Greetings,

I took up the invitation to join the si-list reflector, and this mail appeared
there. I thought it would be a good discussion to have on the ibis reflector,
too. Steve, I hope you don't mind my cross-posting this, and would like to
know if you are interested in getting onto the IBIS reflectors?

Regards,

Will Hobbs
Intel Corp.

I am on a team that has been developing IC package models
at Harris for about a year. We have established a methodology
for generating models with EM simulation that we are very
comfortable with. Up to now we have been verifying the package
models by measuring key parameters with a Tektronix TDR based
system. We are now looking for alternative measurement methods
so that we can also establish a standard methodology for model
verification.

I was wondering first of all if this is possible. That is, are
some measurement methods better suited for particular package
styles or particular ranges of frequency, so that more than one
system is needed for good coverage. Any advice would be greatly
appreciated. If you have any experience you would like to share,
that would be great. If your work is proprietary, just some
vendor contacts or references would be very helpful.

We are currently interested in a system that results in lumped
element SPICE models for:

   < 64 lead packages for high performance analog or RF applications
   (100 MHz - 5 GHz)

-------------------------------------------------------------
Steve S. Majors | Harris Semiconductor
Internet: ssm@mlb.semi.harris.com | PO Box 883 MS 62B-022
Phone: (407) 724-7432 | Melbourne, Fla. 32902
-------------------------------------------------------------

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Subject: Help with package measurement
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