[IBIS] RE: [ibis-macro] Re: IBIS-ISS Package Modeling Next Steps

Walter,

I would also like to comment on the multiple corners idea you
show on slide 21 in your presentation.

This example basically parameterizes the file name and the
subcircuit name using your string substitution syntax. While
I think the string substitution syntax is pretty cool, I am a
little worried about adding this capability to IBIS just yet.
If this was the only way to achieve what you want to do with
corners, I would be less hesitant, but it seems to me that
there are other (easy) ways to get the same results. I am
concerned about adding too many new features to the
specification all at once...

First, I would think that most of the corners would probably not
need a separate subcircuit and/or file to model. In those cases
we can just pass parameters into the subcircuit and be done. The
parameterization of subcircuits is a pretty powerful feature as
described in BIRD 118.

On the other hand, if it was absolutely necessary to parameterize
the name of the file or subcircuit, this could also be done without
string substitution. We could allow the usage of a string parameter
for the full file name or full subcircuit name. This string parameter
could participate in Dependency Tables also which would make them even
more powerful and track other parameters as well.

Thanks,

Arpad
=======================================================================

From: ibis-macro-bounce@freelists.org<mailto:ibis-macro-bounce@freelists.org> [mailto:ibis-macro-bounce@freelists.org]<mailto:[mailto:ibis-macro-bounce@freelists.org]> On Behalf Of Walter Katz
Sent: Tuesday, August 07, 2012 6:40 PM
To: IBIS-ATM
Subject: [ibis-macro] IBIS-ISS Package Modeling Next Steps

All,

At the next IBIS-ATM I would like to answer any questions about the presentation I gave today. Posted at:

http://tinyurl.com/cvykehz

or the full URL:

http://www.eda.org/pub/ibis/macromodel_wip/archive/20120806/walterkatz/IBIS-ISS%20Package%20Modeling/IBIS_ISS_Package_Modeling_120807.pdf

If you do have any questions, please either e-mail to this reflector or me directly.

More importantly, questions to the IC Vendor members:

1. Does the functionality described in this presentation satisfy your needs to generate package and on-die models using that your customers require?

2. If not, what additional functionality do you need?

3. Please e-mail answers to question 2 to this reflector or me directly in advance of the next IBIS-ATM meeting.

Finally, we need to decide whether to pursue this methodology, or use the methodology describes in BIRDs 125 and 145:

http://www.vhdl.org/pub/ibis/macromodel_wip/archive/20120724/arpadmuranyi/Package%20Modeling%20in%20IBIS/PackageModeling_with_BIRD125_145.pdf

Make IBIS-ISS Available for IBIS Package Modeling<http://www.eda.org/ibis/birds/bird125.1.txt>

Cascading IBIS I/O buffers with [External Circuit]s using the [Model Call] keyword<http://www.eda.org/ibis/birds/bird145.2.txt>

Walter

Walter Katz
wkatz@sisoft.com<mailto:wkatz@sisoft.com>
Phone 303.449-2308
Mobile 303.335-6156

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