A simple .ebd file [Begin Board Description] 16Meg X 8 SIMM Module [Manufacturer] IMCP.inc [Number Of Pins] 7 [Pin List] signal_name A1 GND A2 data1 A3 data2 A4 POWER5 | This pin connects to 5 V A5 NC | a no connect pin A22 POWER3.3 | This pin connects to 3.3 V B1 casa [Path Description] DATA_1 Pin A2 Len = 0.5 L=8.35n C=3.34p R=0.01 / Node u21.15 Len = 0.5 L=8.35n C=3.34p R=0.01 / Node u22.15 Len = 0.5 L=8.35n C=3.34p R=0.01 / Node u23.15 [Reference Designator Map] u21 imcp_mem.ibs IMCP_MEM u22 imcp_mem.ibs IMCP_MEM u23 imcp_mem.ibs IMCP_MEM [End Board Description] This same .ebd file converted into a possible .emd format [Begin Module Description] 16Meg X 8 SIMM Module [Manufacturer] IMCP.inc [Number Of Pins] 7 [Pin List] signal_name A1 GND A2 data1 A3 data2 A4 POWER5 | This pin connects to 5 V A5 NC | a no connect pin A22 POWER3.3 | This pin connects to 3.3 V B1 casa [ISS Description] DATA_1 .subckt DATA_1 A2 u21.15 u22.15 u23.15 t1 A2 0 u21.15 0 Td=300p Zo=50. t2 u21.15 0 u22.15 0 Td=300p Zo=50. t3 u22.15 0 u23.15 0 Td=300p Zo=50. .ends DATA_1 [Reference Designator Map] u21 imcp_mem.ibs IMCP_MEM u22 imcp_mem.ibs IMCP_MEM u23 imcp_mem.ibs IMCP_MEM [End Module Description] The same subckt as it may appear as a standard SPICE subckt using MCP. *[Begin IBIS-MCP] *[Version] 1.0 *[Source] IMCP, Inc *[Model Type] ISS *[Structure Type] Package * *[Reference Designator Map] *J Connector *u21 imcp_mem.ibs IMCP_MEM *u22 imcp_mem.ibs IMCP_MEM *u23 imcp_mem.ibs IMCP_MEM * *[Pin Schema] pinNumber signalName netName modelNodeName * *[Connection] PCB 1 J *[Pin] A2 data1 DATA_1 DimmPin *[Connection] IBIS 1 U21 *[Pin] 21 D1 DATA_1 Data_A *[Connection] IBIS 1 U22 *[Pin] 21 D1 DATA_1 Data_B *[Connection] IBIS 1 U23 *[Pin] 21 D1 DATA_1 Data_C *[End IBIS-MCP] .subckt Subckt_Data_1 DimmPin Data_A Data_B Data_C t1 DimmPin 0 Data_A 0 Td=300p Zo=50. t2 Data_A 0 Data_B 0 Td=300p Zo=50. t3 Data_B 0 Data_C 0 Td=300p Zo=50. .ends Subckt_Data_1