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IBIS INTERCONNECT TASK GROUP
http://www.ibis.org/interconnect_wip/  
Mailing list: ibis-interconnect@freelists.org  
Archives at http://www.freelists.org/archive/ibis-interconn/  
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Attendees from January 13 Meeting (* means attended at least using audio)
ANSYS                                                                Curtis Clark*
Cadence Design Systems                              Bradley Brim
Cisco                                                                   David Siadat
Intel Corp.                                                         Michael Mirmak*
Keysight Technologies                                   Radek Biernacki*
Mentor Graphics                                             Arpad Muranyi*
Micron Technology                                         Justin Butterfield*, Randy Wolff*
SAE ITC                                                               Maureen Lemankiewicz, Logen Johnson
Signal Integrity Software                               Walter Katz*, Mike LaBonte
Teraspeed Labs                                                Bob Ross*
University of Aveiro in Portugal                  Wael Dghais
 
Michael Mirmak convened the meeting.  No patents were declared.   During the minutes review, Michael noted that the date for the meeting should have read “Jan. 13”, not “Jan. 12”.  Bob Ross moved to approve the minutes as amended.   Arpad Muranyi seconded the motion.  The minutes were approved without objection.
 
Bob noted that Walter Katz cannot meet after 8:30 US Pacific on Wednesday; the team may need.  Walter wrote up a presentation for DesignCon, which is a modification of material from the Asia and EPEPS summits.  Mike LaBonte might be able to summarize the slides on Walter’s behalf until he can join.  Some editorial feedback was provided offline by Randy and others.
 
Bob also has a presentation on Interconnect but it may be “digging into the weeds” or otherwise overkill on the subject.  Michael noted that the last opportunity to review the material is now.  Bob believes both are good presentations, but that his might be “jumping ahead” and therefore difficult to follow, as the attendees can’t see the details of what we are considering.  Adding the second presentation to the agenda for the summit is up to the Board.
 
Walter, after joining, noted that there is no need to review presentations in this meeting, including the new Pin Mapping presentation.
 
Michael reviewed Interconnect proposal Draft 28.  Most comments on the document were preserved in-line, in that document.  Bob suggested that the use of asterisks for in-line interconnect data be replaced with filled-out columns.  Arpad suggested listing the actual IBIS file name in the column.  Randy Wolff noted that this is a problem if someone changes the IBIS file itself after receipt.  Fixing this requires additional editing.  Other choices include “*.ibs” or “NA”.  Arpad asked whether the .ict extension is required for the interconnect file.   
 
Arpad noted that the format for the [Begin Interconnect Model] section is different than elsewhere in the specification (see Manufacturing rules).  There was some discussion on the in-document arrangement of definitions and examples, particularly on whether the examples should appear immediately after “Other Notes”, etc., as used elsewhere in the document.  Michael accepted the AR to update the document to include Walter’s latest [Die Supply Pads] text.
 
The review will continue in the next meeting.  Michael reminded the attendees that there was no meeting scheduled for the following week, due to DesignCon.  No objections were raised to having the next meeting held on January 27. 
 
Arpad moved to adjourn.  Bob seconded the motion.  The meeting adjourned.