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IBIS INTERCONNECT TASK GROUP
http://www.ibis.org/interconnect_wip/ 
Mailing list: ibis-interconnect@freelists.org 
Archives at http://www.freelists.org/archive/ibis-interconn/ 

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Attendees from March 15 Meeting (* means attended at least using audio)

ANSYS                                Curtis Clark
Cadence Design Systems               Bradley Brim
Cisco                                David Siadat
Intel Corp.                          Michael Mirmak*
Keysight Technologies                Radek Biernacki, Ming Yan
Mentor Graphics                      Arpad Muranyi*
Micron Technology                    Justin Butterfield*, Randy Wolff*
SAE ITC                              Maureen Lemankiewicz, Logen Johnson
Signal Integrity Software            Walter Katz*, Mike LaBonte*
Teraspeed Labs                       Bob Ross*
University of Aveiro in Portugal     Wael Dghais


Michael Mirmak convened the meeting.  No patents were declared. 
Justin Butterfield took minutes.


Review of Minutes:
- Michael called for review of the minutes from the February 22 meeting.  Mike
  LaBonte moved to approve the minutes.  Bob Ross seconded.  The minutes were
  approved without objection.


Review of ARs:
- None

Opens: 
- None


BIRD189.1 Draft 2:
Michael stated the main remaining topic for BIRD189.1 is the figures to be
included in the document.  He shared drawings Randy Wolff sent out that show
package and on-die interconnect.  Walter Katz brought up the issue of whether
the on-die interconnect should be included in the buffer model or in the
package model.  He stated that the issue comes down to what is included in the
IBIS model data extraction.  Bob noted that in the past the on-die interconnect
was considered as ideal or negligible.  Walter commented that the industry is
now at a point where the on-die interconnect is no longer negligible. 

Michael stated that the goals of the figures in question are to illustrate the
boundaries between package and on-die interconnect, illustrate crosstalk, and
show the rail terminals.  Michael noted he also sent out a picture which also
shows the on-die interconnect in detail.  He asked if we could replace all
three of the existing figures in the document with Randy's drawings.

Mike asked if Randy's drawings could be used to show the rail terminals, since
it is technically showing signals only.  Walter pointed out that it does not
show a many to one or one to many pins to buffer mapping for supply.  Michael
asked if we could come up with anything specific for a rail that shows many to
one.  Bob expressed concerned that if we use this drawing to demonstrate the
rail terminals, then it may be misleading, since it shows a one to one pin to
buffer mapping.

Mike suggested to add a label to the package interconnect similar to the on-die
interconnect label in Randy's drawings.  Michael suggested to use this for the
crosstalk and boundary illustrations, and possibly use a conceptual diagram
from his IBIS Summit presentation to demonstrate the rail terminals.  He asked
Randy if he could come up with another drawing which demonstrates the many to
one connections for rail terminals.  Randy replied that these drawings can get
complicated, and he has not found anything that clearly shows the concept yet.
He said he would look for a new drawing that better shows the concept.  Randy
hoped to have something to review next week if possible.

Michael suggested to reconvene this meeting for the next few weeks to review
diagrams.

Michael asked how to handle to submitting BIRD189.1 to the IBIS Open Forum.
Bob suggested to wait to give people additional time to review the document.
Michael stated that he has not yet received any comments outside of this task
group on BIRD189.

Walter asked about Bob Miller's proposal and its interaction with BIRD189.
Bob Miller's BIRD158 proposal is to say that the buffer model can include the
buffer plus the on-die interconnect.  Arpad Muranyi noted that the question is
whether to include the on-die interconnect in the touchstone file. This is
possible for touchstone models, but for [Model], we only have C_comp. Michael
asked if any changes are required to BIRD189 based on BIRD158.  Walter and Bob
agreed that no changes are required.  Arpad said he brought up the issue due to
the terminology for the interface used in BIRD158 and wanting to use the same
terminology as defined in BIRD189.  Walter commented that using a TS4 file is
just like using [External Model], and he suggested that we should make the TS4
terminology consistent with [External Model].

Walter suggested to look into adding some text in the IBIS specification to
address the on-die interconnect boundary for the buffer.  Arpad commented that
BIRD189 is very clear in the separation between buffer terminal and pad, and he
suggested to look at other areas where the pads and buffer terminals are
assumed to be the same.  Walter suggested that we need to scrub the IBIS
Specification for these issues when we include BIRD189.

Mike moved to adjourn.  Bob seconded.  The meeting adjourned without
objection.