================================================================================ IBIS INTERCONNECT TASK GROUP http://www.ibis.org/interconnect_wip/ Mailing list: ibis-interconnect@freelists.org Archives at http://www.freelists.org/archive/ibis-interconn/ ================================================================================ Attendees from May 29, 2019 Meeting (* means attended at least using audio) ANSYS Curtis Clark Cadence Design Systems Bradley Brim Intel Corp. Michael Mirmak* Keysight Technologies Radek Biernacki Mentor, A Siemens Business Arpad Muranyi* Micron Technology Justin Butterfield*, Randy Wolff* SiSoft Walter Katz*, Mike LaBonte Teraspeed Labs Bob Ross* Michael Mirmak convened the meeting. No patents were declared. Justin Butterfield took minutes. Review of Minutes: - Michael called for review of the minutes from the May 22, 2019 meeting. Bob Ross moved to approve the minutes. Arpad Muranyi seconded. The minutes were approved without objection. Review of ARs: - Mike to send the survey data out the reflector. - Michael reported this has not been done. Mike did not receive a response from Eric Bogatin on the SI Journal article. Walter Katz asked if he can get a copy of the data in spreadsheet format. Michael agreed this should be possible. Opens: - Michael commented he may not be able to host the meeting next week. - Michael stated Monday, June 3rd is the DAC face to face meeting of IEEE 2401, and we expect draft 4 of the LPB specification to be issued. He has asked if we can get some examples of the LPB files. The meeting is closed, but per IEEE policy, people can participate as a guest one time only. EMD Draft 3 Status: Bob noted he made some changes. One change is to clean up some of the terminology, including changing "model" to "electrical path". He moved some keyword definitions to Section 4, where we deal with all the file formats. He changed [Pin List] to [EMD Pin List]. The signal_name column should be the databook signal name, but the EBD convention did not follow this. He noted an issue regarding how to connect to the EMD interfaces. Bob deleted the sentence: "It is legal for a reference designator to point to a component that is contained in the calling .emd file." Walter stated we do want to include this case, as we support this for EBD. Bob commented this is confusing because the word "component" is used. Walter stated this is an editorial issue to be resolved later. Walter will research this, as the text was copied from the EBD section. Walter suggested to discuss the technical issues. Michael stated we have a list of issues at the bottom of the meeting minutes. Regarding the task to change top level keywords to distinguish between EMD and Interconnect Models, Bob commented that most keywords have been changed. Bob also removed the descriptions for some repetitive keywords such as [Disclaimer] and [Copyright], which are documented elsewhere. Michael asked if the keywords are up to date in the hierarchy tree. Bob replied this is done. Walter commented that this resolves the keyword naming issue. Regarding the [Reference Designator Map] issue, Walter noted, on page 182 of IBIS 7.0, it is legal for EBD to point to a component inside the EBD. Walter suggested to remove this sentence from EMD. Randy Wolff agreed with removing this sentence. Bob noted that the wording is confusing, as the word "component" is used. He also, agreed with removing the sentence EMD. Michael asked if we need to go back and make any clarification to the sentence in EBD. Arpad stated it is a poorly written sentence, but it does not say the [Component] keyword can be used inside the EBD. Bob noted he also removed another sentence: "By default the .ibs or .emd files are assumed to exist in the same directory as the calling .emd file." Walter would like to keep this sentence. Bob noted that we can now have file references paths. Walter suggested to make this sentence consistent with IBIS 7.0. Bob stated we can resolve this. Michael asked about the bin list item to add Touchstone to the introduction. Bob stated this has been done and "S-parameter" has been changed to "Touchstone". Michael asked about the meaning of signal_type. Bob asked if this is useful and if this would use the datasheet name. Randy stated they would use this and match the signal_name to the datasheet name. Bob noted the confusion is how signal_type is defined. Walter noted that bus_label is another issue, but bus_label is a component level connection mechanism that should not be included at the module level. Bob noted there is no one to one pin name requirement for EMD. He added that there is a bus_label at the pin of the component. Walter commented we are making the connections at the pin of the component to the EMD interface. Arpad commented that we can only see the pins of the chip, and we don't know what is inside of the chip. Walter suggested for Bob to create a presentation on the issue and the changes he would like to see. Michael asked Bob to prepare a presentation of the EMD bus_label issue for next time [AR]. Next Meeting: The next meeting will TBD. Randy moved to adjourn. Arpad seconded. The meeting adjourned without objection. ================================================================================ Bin List: EMD Comments to be Resolved: 1. Clarify the meaning of signal_type 2. File format structure 3. Number of [Module] keywords allowed per EMD file. 4. Should bus_labels be allowed? IBIS-ISS Parser: - IBIS-ISS parser scope document