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IBIS INTERCONNECT MODELING AD HOC TASK GROUP MEETING MINUTES AND AGENDA

http://www.eda.org/ibis/adhoc/interconnect/ 

Mailing list: ibis-interconn@xxxxxxxxxxxxx

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Next Meeting
Wednesday, July 28, 2010
9 AM US Pacific Time

               Telephone     Bridge   Passcode
              916-356-2663     4      279-2319

(for international and alternate US numbers, contact Michael Mirmak)

LiveMeeting: https://webjoin.intel.com/?passcode=2792319 

Agenda:
- Attendees
- Call for patents
- Opens
- MCP Discussion:
  * what features of the MCP definition need to be standardized? 
  * will MCP be a separate specification or part of an existing specification?
  * what links, if any, will exist between MCP and other IBIS
    standards (IBIS-ISS, ICM, Touchstone, IBIS)?
  * Create a skeleton for the MCP draft standard
- 3 TSIRDs for Touchstone 2.x Binary formatting

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Minutes from July 21:

Attendees:
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(* denotes present)
Agilent                    - Radek Biernacki*, John Moore, Ken Wong
Ansoft                     - Denis Soldo
Cadence Design Systems     - Terry Jernberg, Brad Griffin
Cisco Systems              - Mike LaBonte
Green Streak Programs      - Lynne Green
Hewlett-Packard            - Rob Elliott
IBM                          - Greg Edlund
Intel                      - Michael Mirmak*
Mentor Graphics Corp.      - John Angulo*, Vladimir Dmitriev-Zdorov
Micron Technology          - Randy Wolff*, Justin Butterfield
Sigrity                    - Sam Chitwood, Raymond Y. Chen, Tao Su, Brad Brim*
SiSoft                     - Walter Katz*
Teraspeed Consulting Group - Bob Ross*

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No patents were declared.

During Opens, Bob Ross suggested a change to TSIRD 2.1: for readability, 
a blank line should be inserted on either side of the commented text in
the example.  This will be raised at the next Open Forum meeting before
any vote.

Brad Brim provided a brief overview of the MCP proposal for standardization,
based upon a public implementation from Sigrity.  Slides will be made
available through the IBIS Interconnect Task Group website.

The objective of MCP is to define how to connect different devices/boards/
packages etc.  This does not assume an arbitrary circuit simulator.  
The definitions are based on the physical topologies seen across physical 
chip/package/board interconnects.  MCP also assumes that electrical and 
physical connectivity are different and distinct: the farther users get from 
their familiar or desired area of interest, the less resolution or detail 
is important to them.  MCP supports this distinction, making pins a physical, 
representation, with nodes being electrical.

The actual format of MCP is publicly available and allows connection definitions
and physical placement information to be combined for the purposes of
simulation.  Specifics are shown, along with examples, in the overview
slide set.

For the next meeting, the team will discuss what portions of MCP require
standardization and develop a skeleton or outline of what the document
will include.

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