====================================================================== IBIS INTERCONNECT MODELING TASK GROUP MEETING MINUTES AND AGENDA http://www.eda.org/ibis/adhoc/interconnect/ Mailing list: ibis-interconn@xxxxxxxxxxxxx ====================================================================== Next Meeting Wednesday, August 11, 2010 9 AM US Pacific Time Telephone Bridge Passcode 916-356-2663 4 988-0825 (for international and alternate US numbers, contact Michael Mirmak) LiveMeeting: https://webjoin.intel.com/?passcode=9880825 Agenda: - Attendees - Call for patents - Opens - New Coverage Plan - MCP Status Update - IBIS-ISS Draft 0.5 review ====================================================================== Minutes from July 28: Attendees: ---------- (* denotes present) Agilent - Radek Biernacki, John Moore, Ken Wong Ansoft - Denis Soldo Cadence Design Systems - Terry Jernberg, Brad Griffin Cisco Systems - Mike LaBonte Green Streak Programs - Lynne Green Hewlett-Packard - Rob Elliott IBM - Greg Edlund Intel - Michael Mirmak* Mentor Graphics Corp. - John Angulo*, Vladimir Dmitriev-Zdorov Micron Technology - Randy Wolff*, Justin Butterfield* Sigrity - Sam Chitwood, Raymond Y. Chen, Tao Su, Brad Brim* SiSoft - Walter Katz* Teraspeed Consulting Group - Bob Ross* ======================================================================== No patents were declared. No opens were raised. Michael Mirmak began the meeting by noting that three questions were asked on MCP at the last meeting: * what features of the MCP definition need to be standardized? * will MCP be a separate specification or part of an existing specification? * what links, if any, will exist between MCP and other IBIS standards (IBIS-ISS, ICM, Touchstone, IBIS)? On question 1, Brad Brim noted that names for ports are required, and that he was willing to remove attributes for power/ground/signal if that was a barrier to standardization. Walter responded that the format seemed complete and asked why the team would change a format that's already in-use in industry. Brad noted that several EDA vendors already support something like this. Walter Katz stated that several IC vendors are already generating this information and inquired whether the same was true for packages. Certainly something MCP-like was already of interest for DIMMs. Walter asked whether companies such as memory vendors would be interested, particularly to make decisions about on-die caps, package design, etc. Brad responded that they would and that CMP is the current name for the format in-use. It involves PWL current sources. He suggested IBIS-ISS or encrypted SPICE variants can also be used for the same purpose. SSO analysis is also a key interest, of the kind covered by IBIS ISSO keywords, but these are not yet being used widely. Bob Ross suggested using the existing documents for MCP as-written. Brad added that the final approach should avoid "flipping" of models, as package vs. IC approaches can differ if not handled correctly. John Angulo noted that, while he needed further review of the documents, the package-to-board connection portions looked good. In terms of integration into existing docs, Walter stated that he believed IBIS is already a simple version of model connection, while MCP is really "PI-MCP" (power integrity). Brad noted that MCP can be used as part of Touchstone electrical node mapping. In addition, the MCP file can include an x/y coordinate map and arbitrary strings as well. Walter suggested limiting IBIS-ISS to SPICE structures, while using MCP for Touchstone. Bob Ross disagreed, suggesting that a universal approach would be desirable. Bob noted that the attractions of MCP include standardization from comments, so that more data would be human-readable. A skeleton MCP structure plus public-domain documents for MCP would be made available for discussion at a future meeting. ------------------------------------------------------------------ The IBIS Ad Hoc Interconnect Task Group Mailing List Archives are available at: http://www.freelists.org/archives/ibis-interconn TO UNSUBSCRIBE: Send a message to "ibis-interconn-request@xxxxxxxxxxxxx" with a subject of "unsubscribe" To administer your subscription status from the web, visit: http://www.freelists.org/list/ibis-interconn