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IBIS INTERCONNECT TASK GROUP
Mailing list: ibis-interconnect@freelists.org 

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Attendees from October 4, 2023 Meeting (* means attended at least using audio)

ANSYS                                Curtis Clark
Broadcom                             James Church
Intel Corp.                          Michael Mirmak*
                                     Michael Brownell
Keysight Technologies                Ming Yan
Marvell                              Steve Parker
MathWorks                            Walter Katz*
Micron Technology                    Justin Butterfield
Siemens EDA                          Weston Beal*, Arpad Muranyi*, Randy Wolff*
ST Microelectronics                  Aurora Sanna
Teraspeed Labs                       Bob Ross*
University of Illinois               Jose Schutt-Aine
Zuken USA                            Lance Wang*

Michael Mirmak called meeting to order and took minutes.  No patents 
were declared.

Minutes for the previous meeting were not available for review.

Lance Wang noted during Opens that the EDICon conference happening concurrently 
with the meeting.

During AR review, Michael noted that his two ARs were still open.
He was awaiting responses from Sam Chitwood on port referencing and loop 
inductances, and from Pete Pupulaikis on S-parameter compression algorithms.

The team reviewed Michael's first draft of the Touchstone 2.1 specification,
including suggestions for changes and questions raised by Arpad Muranyi and
Randy Wolff in updates circulated on the reflector.  The team made edits 
"live" in the document during the meeting.  Review completed on approximately 
one-third of the document.  The remaining portion of the review will be 
completed during the next meeting.

Bob Ross reviewed his presentation on matrix mathematics used in Touchstone
as intended for inclusion in the Shanghai IBIS Summit.  The material summarizes
existing conversion approaches with an emphasis on normalization.  The team made
a few suggestions regarding font usage and changing some formatting for
better clarity.

Walter Katz stated that he sent a note to the Interconnect reflector 
summarizing coverage of the Touchstone versions.

Walter moved to adjourn; both Arpad and Randy seconded.  
The meeting adjourned.

The next meeting will be held Wednesday, October 11, 2023.


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Bin List:
1)	[Complete draft Touchstone document separating version 1.0 and 2.0 into their own chapters] - REMOVED
2)	Create structures to encapsulate Touchstone 1.0 data in Touchstone 2+ specifications - TABLED
3)	Complete draft Touchstone 2.0 document containing TSIRD3 and TSIRD4 draft (Muranyi) – COMPLETED IN DRAFT 10
4)	Complete pole-residue format BIRD draft (Muranyi) 
5)	Complete port naming proposal (Katz) 
6)	Create alternatives to the Touchstone 1.0 option line before the "R" character - TABLED
7)	Complete ISS-IRD 1 Draft - Enable Cascading of S-parameters Through W-element (Mirmak) - TABLED
8)	Complete/revise Touchstone 3.0 draft outline (Mirmak) – dependent on several items above



Tabled ARs:
- Arpad to give an example of the physical connectivity needed for EMD automation.