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IBIS INTERCONNECT TASK GROUP
http://www.eda.org/ibis/interconnect_wip/
Mailing list: ibis-interconnect@freelists.org
Archives at http://www.freelists.org/archive/ibis-interconn/
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Attendees from November 4 Meeting (* means attended)
ANSYS                                                        Curtis Clark
Cadence Design Systems                          Bradley Brim
Cisco                                                         David Siadat
Intel Corp.                                                Michael Mirmak*                      
Keysight Technologies                             Radek Biernacki
Mentor Graphics                                     Arpad Muranyi*
Micron Technology                                 Justin Butterfield*, Randy Wolff*
Signal Integrity Software                        Walter Katz*, Mike LaBonte
Teraspeed Labs                                       Bob Ross*
University of Aveiro in Portugal             Wael Dghais      
 
No patents were declared.
 
Arpad Muranyi moved to approve the minutes of the October 21 meeting.  Randy Wolff seconded.  No objections were raised.  The motion carried and minutes were approved  Mike LaBonte was given the action, in absentia, to post the minutes.
 
During opens, Arpad Muranyi noted that an EPEPS presenter, Daniel de Zutter, a professor at the University of Ghent, talked about transmission line algorithms for situations where copper is routed over silicon substrates.  His presentation gave details on the equations, which are different from the usual equations when the plane is not a good conductor.   Arpad asked if this will have an impact on the Interconnect proposal?  He noted that he assumes not, due to the proposal addressing the interconnect model structure instead of behavioral model calculations.
Michael Mirmak asked for clarification – is a semiconductor material being used here as a return plane or as an insulating material?  Arpad replied that it was used as a return path, or reference plane. 
 
Walter Katz noted that, if one can model the structure using SPICE, particularly recent commercial versions, this is not a problem.  Arpad agreed, noting that the model format simply has to be a part of SPICE, not necessarily a W-element. 
 
Arpad agreed to send note to Professor de Zutter regarding modeling in SPICE.   Bob Ross asked how the return path is modeled and what terminals/nodes are used in Professor de Zutter’s paper. 
 
Walter observed that the only concern for the Interconnect proposal would be its potential use of a new SPICE element that is not supported by IBIS-ISS.
 
The meeting concluded early, as Draft 25 of the Interconnect proposal was not ready, and Summit activities prevented further work being done since the last meeting.
 
Bob moved to adjourn. Arpad seconded.