EIA IBIS Open Forum Minutes Meeting Date: September 21, 2007 GEIA STANDARDS BALLOT VOTING STATUS See last page of the minutes for the voting status of all member companies. VOTING MEMBERS AND 2007 PARTICIPANTS Agilent Ian Dodd, Radek Biernacki, Saliou Dieye, Riccardo Giacometti, Quanli Li, Mike Resso, Chengming Ren, Dong Wei, Tim Wu, Xindong Xue, Nianmin Zhang, Jianping Zhu, Takahiro Sato AMD Nam Nguyen*, Tadashi Arai Ansoft Corporation Haiqiang Ding, Baolong Li, Ying Liu Applied Simulation Technology (Fred Balistreri) Apple Computer (Bill Cornelius) Cadence Design Systems [Lance Wang], C. Kumar, Hemant Shah, Patrick dos Santos, Ambrish Varma, Shangli Wu, Lanbing Chen, Jianwei Hu, Jacob Lai, Yubao Meng, Jian Peng, Ke (Coco) Xu, Liu Zheng, Norikazu Takada, Yukio Masuko Cisco Systems Syed Huq*, Tram Bui, AbdulRahman Rafiq, Huyen Pham, Darja Padilla, Mike LaBonte*, Paul Ruddy, Gurpreet Hundal, Luis Boluna, Ehsan Kabir, Jehyoung Lee, Susmita Mutsuddy, Eddie Wu, Bill (Qinghua) Chen Ericsson Anders Ekholm*, Ole Segtum, Peng Fu Freescale Jon Burnett Green Streak Programs Lynne Green Hitachi ULSI Systems Kazuyoshi Shoji, Shinmei Hirano Intel Corporation Michael Mirmak*, [Arpad Muranyi], Lili Deng, Haifeng (Bill) Gong, Tao Hu, Karen Kang, Fanghui Li, Maoxin Yin, James Zhou IO Methodology Lance Wang, Esther Gao, Nancy Peng, Benny Yan, Xinjun Zhang, Wei Zhu LSI Frank Gasparik*, Kim Helliwell, Dinh Tran, Praveen Soora, Brian Burdick* Mentor Graphics John Angulo, Arpad Muranyi, [Ian Dodd], Eric Rongere, Stephane Rousseau, Bill Hargin, Patrick Carrier, Vivian Pan, Tao Wang, Lifu You, Kenji Kushima, Masahiro Nakajima Micron Technology Randy Wolff*, Pavani Jella Nokia Siemens Networks GmbH[1] Eckhard Lenski*, Flavio Maggioni, Roberto Preatoni, Umberto Gatti, Massimo Ceppi Panasonic Atsuji Ito Samtec (Corey Kimble) Signal Integrity Software Barry Katz, Douglas Burns, Mike Steinberger, Walter Katz, Todd Westerhoff Sigrity Sam Chitwood, Sandy Dung, Raymond Chen, Xianfeng Li, Tao (Helen) Xu STMicroelectronics Antonio Girardi, Giacomo Bernardi, Roberto Izzi, Akhilesh Chandra Synopsys Ted Mido, Xuefeng Chen, Changlei Zhang Teraspeed Consulting Group Bob Ross*, Tom Dagostino Texas Instruments Otis Gorley, Richard Ward, Bonnie Baker Toshiba Yoshihiro Hamaji, Yasumasa Kondo, Atshshi Osaki Nonyasu Yoshikawa, Toshihiro Tsajimura Xilinx Bruce Bandeli, David Banas* ZTE Songrui Chen, Xianhui Hu, Wei Jia, Dongfeng Sun Changjun Wang, Ying Xiong, Shenglong Yang Yanfeng Yu, Xiaojun Zhou, Shunlin Zhu Zuken Michael Schaeder, Ralf Bruening, John Berrie, Hayashi, Hirohiko Matsuwawa OTHER PARTICIPANTS IN 2007 74ze Engineering Linc Jepson AcconSys David Lan, Suny Li, Jianfeng Tan, Jiangtao Wu, Frank Xiao Agere (Nirav Patel) Alcatel Shanghai Bell Wei Li, Lifan Sun Altera Hui Liu, Zhe Lin, Ravindra Gali, Salman Jiva Apache Design Solutions (Ji Zheng) Applied Telisis, Inc. (ATI) Vladimar Mandrusov ATE Service Corporation Yutaka Honda Canon Seiji Hayashi, Shoji Matsumoto, Tatsuo Nishino, Sakuragi Takamasa, Haruka Watanabe, Nobuaki Yamashita Cavium Networks Johann Nittmann CEC Huada Electronic Design Weiwei Liu China Integrated Circuit Jingcheng Luo ChipX Jay Hidy, Oren Dvir Cybernet Systems [Kazuhiki Kusunoki], Masahito Kobayashi, Junko Kuriyama Dangtang Mobile Fanjie Meng, Hongying Li, Hongwei Wang EDN China Frank Yao EE Times Japan Norihiro Satsukawa EFM Ekkehard Miersch EMC Technology Michael Liu, Feng Lu, Changzheng Yang Enterasys Robert Haller Extreme Networks Kevin Ko Fluent (Chetan Desai) Force10 Networks Robert Badal Free Electron Software Al Davis Fujitsu Limited Kouichiro Asoh, Tetsuya Inoue, Toshiro Sato, Fujimori Shogo, Wasaki Tosaka GEIA (Chris Denham) Gnovo Technologies Harris Ma Hangzhou H3C Technologies Chunbao Yan Hewlett Packard Shafiq Rahman Huawei 3Com Junjun Cui, Zhenyu Liu, Jun Mao, Bao Wang, Kai Xie, Haitao Zhang Huawei Technologies ChunXing Huang, Bob He, Tao Guan, Peng Hu, Xiangzhong Jiang, Meidan Liu, Haiyan Yu IBM Michael Sorna, Adge Hawes, Kevin Kramer, Wei Wang IMECAS Yunfeng Wang IVIS Co. Hiroyuki Mashima Infineon Christian Sporrer Integrated Circuit Systems (ICS) (Dan Clementi) Japan Aviation Electronics Hiroaki Ikeda Industries JEITA Atsushi Ishikawa Juniper Networks Raul Lozano Kawasaki Microlelectronics Hiroyuki Sato, Takashi Kawahara Leventhal Design Roy Leventhal LHWT Microelectronics Jiahui Wang Lynguent Andrew Levy Motorola Hong Chen, Haiying Jiang, Daniel Tang National Institute of Applied Etienne Sicard Science (INSA) National Instruments Lee Maixman Netlogic Eric Hsu NEC Electronics Corporation Takeshi Watanabe, Hock Seow, Huy Tran, Itsuki Yamada NESA Edward Sayre Northrop Grumman Dusan Radosevic Nortel Networks Jingxin Bian, Feng Shi Nuova Systems Zhiping Yang, Lin Shen NVIDA Corporation Jing (Jane) Zhang NXP H N Sudarshan Optimal Corporation Marc Kowalski Politecnico di Torino Igor Stievano, Michelangelo Bandinu Renesas Technology Takuji Komeda Samsung Sang-Soo Park Sedona International Joe Socha Sharp Tetsuo Iwaki Shizu Technology Zuofu Qi Siemens AG [1] [Eckhard Lenski], Manfred Maurer Silego (Joe Froniewski) Sony Corporation Toshiro Honda, Keisuke Matsunami Shu Zi Tai He Chunyu Zhao Sun Microelectronics Leon Yang Tiburon Design Automation Patrick O’Halloran Via Technologies Jimmy Hsu White Electronics Designs John Perez Xyratex Paul Levin, Joseph Chan Zuken Support and Service Seikou Go, Tomotaka Unose In the list above, attendees at the meeting are indicated by *. Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS The bridge numbers for future IBIS teleconferences are as follows: Date Telephone Number Bridge # Passcode October 12, 2007 1-916-356-2663 4 795-9610 All meetings are 8:00 AM to 9:55 AM US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. When calling into the meeting, provide the bridge number and passcode at the automated prompts. If asked by an operator, please request to join the IBIS Open Forum hosted by Michael Mirmak. For international dial-in numbers, please contact Michael Mirmak. NOTE: "AR" = Action Required. ---------------------------------------------------------------------------- --------------------------------------------------- INTRODUCTIONS AND MEETING QUORUM None. CALL FOR PATENTS Michael Mirmak called for any patents or pending patents related to the IBIS Version 3.2, 4.0, 4.1, 4.2, or ICM 1.1 specifications. No patents were declared. MEMBERSHIP UPDATE AND TREASURER'S REPORT Michael Mirmak reported that we stand at 29 paid members. The budget is in the black, and he is expecting additional membership joins and is working to clarify a couple of financial questions with GEIA. REVIEW OF MINUTES AND ARS Michael Mirmak called for comment regarding the minutes of the August 24, 2007 IBIS Open Forum teleconference. The minutes were approved without change. WEB PAGE UPDATES Syed Huq reported that he made changes to the events page reflecting changes to the Asian Summit status. MAILING LIST ADMINISTRATION Bob Ross reported that everything is running normally. Michael Mirmak reported that he is noticing a lot more SPAM emails getting bounced by the list. MODEL LIBRARY UPDATE No update. PRESS UPDATE No update. MISCELLANY/ANNOUNCEMENTS None. OPENS FOR NEW ISSUES None. INTERNATIONAL/EXTERNAL PROGRESS Upcoming conferences of interest to IBIS members are listed below. The 6th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2007) is to be held November 28-30, 2007, in Torino, Italy. There will be some sessions mentioning IBIS. More information can be found at: http://www.emccompo07.polito.it/ Michael Mirmak noted that there was a DASC meeting yesterday. A PAR (Project Authorization Request) is being submitted to IEEE related to a quality report for design IP. There is a presentation available. There has been no additional meeting on encryption since the first one last month. Our participation is encouraged in the quality or encryption meetings, but we do not have a “defined” role in these committees. Syed Huq asked how to find out about future meetings. Michael said to check the meeting minutes for the schedule. The next meetings are October 18 and November 15. Mike LaBonte asked how to find more information about the quality initiative. Michael suggested contacting Kathy Werner, the presentation author. The IEEE DASC Study Group on Encryption we site is found at: http://www.eda-stds.org/ip-encrypt/hm/ IEC APPROVAL ACTIVITIES Randy Wolff noted that there was a meeting of the IEC TC93 committee September 4-5 in Washington, D.C. Dennis Brophy, the co-convener of TC93 WG2 invited us in August to attend, however with the timing of the Asian IBIS Summits; no one was able to attend. TC93 WG2 is the group that standardized IBIS 3.2 originally. Bob Ross suggested that Dennis be re- contacted to initiate the IEC approval. SUMMITS - Asian IBIS Summit (China) Review The Asian IBIS Summit (China) was held Tuesday, September 11 at The Park Plaza Science Park hotel in Beijing. Michael reported that there were 101 attendees from about 34 organizations. There was a full agenda with good discussions, although little time for questions. Surveys came back very positive. There is already discussion about potential locations including Shenzhen for next year. There were 15 presentations. 13 were presented and two others were included in the booklet. 8 presentations were given by Asian presenters. Official sponsors were Huawei Technologies, Agilent, Ansoft, Cadence, Intel, Mentor Graphics, Sigrity, SiSoft, Synopsys and ZTE Corporation. - Asian IBIS Summit (Japan) Review The Asian IBIS Summit (Japan) was held Friday, September 14 at JEITA headquarters in Tokyo. Sponsors included Agilent Technologies, ATE Service Corporation (Sigrity), Cadence Design Systems, Cybernet Systems, IVIS (SiSoft), Mentor Graphics and Zuken. The other official sponsor of the Japan summit was JEITA. Michael reported that 54 people from 29 organizations attended. It was a very full event. Some presentations were shared between the Japan and China events. Many US visitors went to both events. There was a little time for good discussion. 14 total presentations were given. 4 presentations were from Japan, with 6 total from Asia counting two others written in China. Both events were successful in getting local participation. Michael thanked all the sponsors for making these events possible. He also thanked all the presenters and participants. He also mentioned that all the presentations are available on our website at the link: http://www.vhdl.org/pub/ibis/summits/ - Design Con Planning DesignCon 2008 will be held February 4-7, 2008 at the Santa Clara convention center. The IBIS Summit is tentatively scheduled for Thursday, February 7, 2008. Syed Huq will be the main contact for the event. Michael mentioned that we have confirmed having insurance through the GEIA, so we will be able to have the booth this year. Anyone working the booth will need to have workers compensation insurance through their employers. Sponsorship opportunities for the DesignCon IBIS summit are available, with sponsors receiving free mentions in the minutes, agenda, and other announcements. Contact the IBIS Board for further details. IBIS QUALITY TASK GROUP Mike LaBonte reported that progress has been a little slow, with certain checks needing repeated reviews. He received from JEITA some suggestions of changes to make to the quality document. There was a presentation related to IBIS Quality presented in Tokyo that the group will review. Some comments from JEITA relate to the inability to understand the specification due to it being too vague. The Quality Task Group checklist and other documentation can be found at: http://www.eda-stds.org/ibis/quality_wip/ IBIS MODEL REVIEW TASK GROUP No update. ADVANCED TECHNOLOGY MODELING TASK GROUP Michael Mirmak reported that the last meeting was on Tuesday. There was a proposal on additional differential treatment, to figure out how the algorithmic model should apply to differential pins. Some proposals are in the works. The group is expecting to see a BIRD submission in the near future. Task group material can be found at: http://www.eda-stds.org/ibis/macromodel_wip/ AD HOC TASK GROUPS (INTERCONNECT) Michael Mirmak had no update since the last meeting. Additional discussion about the ICM to IBIS links is planned. The next meeting is Wednesday of next week. Task group material can be found at: http://www.eda.org/ibis/adhoc/interconnect/ NEW ISSUES None. IBISCHK4 BUG STATUS There are no open BUGs at this time. Currently at version 4.2.2. Mike LaBonte mentioned seeing a misspelling of “hysteresis” in a parser output. Michael suggested sending an email to put this on file, and then to add this to a future BUG submission. ICMCHK1 BUG STATUS Michael Mirmak reported that there is one BUG, but it will not be fixed until the next version of the parser. The next release of the parser will come out once IIRD9 is closed. BIRD98.2: GATE MODULATION EFFECT (TABLE MODEL) Bob Ross reported that he has been helping to edit the “Other Notes” section of the BIRD. There is contradictory text describing the algorithm related to whether voltages are relative or absolute. Also, some terms are introduced in the description that may be confusing to some readers. He is working with the STMicroelectronics authors to re-write the text. He is also looking to include a suggested algorithm in the description. NEW TECHNICAL ISSUES None. OPEN ISSUES None. NEXT MEETING The next IBIS Open Forum teleconference will be held October 12, 2007 from 8:00 AM to 10:00 AM US Pacific Time. ======================================================================== NOTES IBIS CHAIR: Michael Mirmak (916) 356-4261, Fax: (916) 377-3788 michael.mirmak@intel.com Server Platform Technical Marketing Engineer, Intel Corporation FM5-239 1900 Prairie City Rd. Folsom, CA 95630 VICE CHAIR: Syed Huq (408) 525-3399, Fax: (408) 526-5504 shuq@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA 95134-1706 SECRETARY: Randy Wolff (208) 363-1764, Fax: (208) 368-3475 rrwolff@micron.com SI Modeling Manager, Micron Technology, Inc. 8000 S. Federal Way Mail Stop: 01-711 Boise, ID 83707-0006 LIBRARIAN: Lance Wang (978) 633-3388 lwang@iometh.com President / CEO, IO Methodology, Inc. PO Box 2099 Acton, MA 01720 WEBMASTER: Syed Huq (408) 525-3399, Fax: (408) 526-5504 shuq@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA 95134-1706 POSTMASTER: Bob Ross (503) 246-8048, Fax : (503) 239-4400 bob@teraspeed.com Staff Scientist, Teraspeed Consulting Group 10238 SW Lancaster Road Portland, OR 97219 This meeting was conducted in accordance with the GEIA Legal Guides and GEIA Manual of Organization and Procedure. The following e-mail addresses are used: majordomo@eda-stds.org In the body, for the IBIS Open Forum Reflector: subscribe ibis In the body, for the IBIS Users' Group Reflector: subscribe ibis-users Help and other commands: help ibis-request@eda-stds.org To join, change, or drop from either or both: IBIS Open Forum Reflector (ibis@eda-stds.org) IBIS Users' Group Reflector (ibis-users@eda-stds.org) State your request. ibis-info@eda-stds.org To obtain general information about IBIS, to ask specific questions for individual response, and to inquire about joining the EIA-IBIS Open Forum as a full Member. ibis@eda-stds.org To send a message to the general IBIS Open Forum Reflector. This is used mostly for IBIS Standardization business and future IBIS technical enhancements. Job posting information is not permitted. ibis-users@eda-stds.org To send a message to the IBIS Users' Group Reflector. This is used mostly for IBIS clarification, current modeling issues, and general user concerns. Job posting information is not permitted. ibis-bug@eda-stds.org To report ibischk parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda-stds.org/ibis/bugs/ibischk/ http://www.eda-stds.org/ibis/bugs/ibischk/bugform.txt icm-bug@eda-stds.org To report icmchk1 parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda-stds.org/ibis/icm_bugs/ http://www.eda-stds.org/ibis/icm_bugs/icm_bugform.txt To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which reside at: http://www.eda-stds.org/ibis/bugs/s2ibis/bugs2i.txt http://www.eda-stds.org/ibis/bugs/s2ibis2/bugs2i2.txt http://www.eda-stds.org/ibis/bugs/s2iplt/bugsplt.txt Information on IBIS technical contents, IBIS participants and actual IBIS models are available on the IBIS Home page: http://www.eigroup.org/ibis/ibis.htm Check the IBIS file directory on eda.org for more information on previous discussions and results: http://www.eda-stds.org/ibis/directory.html All eda.org documents can be accessed using a mirror: http://www.ibis-information.org Note that the "/ibis" text should be removed from directory names when this URL mirror is used. * Other trademarks, brands and names are the property of their respective owners. GEIA STANDARDS BALLOT VOTING STATUS I/O Buffer Information Specification Committee (IBIS) |Organization |Interest |Standard|August |Septemb|Septembe|Septemb| | |Category |s Ballot|24, |er 11, |r 14, |er 21, | | | |Voting |2007 |2007 |2007 |2007 | | | |Status | | | | | |Advanced Micro |Producer |Active | | |( |( | |Devices | | | | | | | |Agilent |User |Active | |( |( | | |Technologies | | | | | | | |Ansoft |User |Inactive| |( | | | |Apple Computer |User |Inactive| | | | | |Applied |User |Inactive| | | | | |Simulation | | | | | | | |Technology | | | | | | | |Cadence Design |User |Active |( |( |( | | |Systems | | | | | | | |Cisco Systems |User |Active |( |( |( |( | |Ericsson |Producer |Active |( |( |( |( | |Freescale |Producer |Inactive| | | | | |Green Streak |General |Inactive| | | | | |Programs |Interest | | | | | | |Hitachi ULSI |Producer |Active | |( |( | | |Systems | | | | | | | |Intel Corp. |Producer |Active |( |( |( |( | |IO Methodology |User |Active | |( |( | | |LSI Logic |Producer |Inactive|( | | |( | |Mentor Graphics |User |Active |( |( |( | | |Micron |Producer |Inactive| | | |( | |Technology | | | | | | | |Nokia Siemens |Producer |Inactive| | | |( | |Networks | | | | | | | |Panasonic |Producer |Inactive| | |( | | |Samtec |Producer |Inactive| | | | | |Signal Integrity|User |Active |( |( |( | | |Software | | | | | | | |Sigrity |User |Active |( |( |( | | |STMicroelectroni|Producer |Inactive| | |( | | |cs | | | | | | | |Synopsys |User |Inactive| |( | | | |Teraspeed |General |Active |( |( |( |( | |Consulting |Interest | | | | | | |Texas |Producer |Inactive| | | | | |Instruments | | | | | | | |Toshiba |Producer |Inactive| | |( | | |Xilinx |Producer |Active | | |( |( | |ZTE |User |Inactive| |( | | | |Zuken GmbH |User |Inactive| | |( | | Criteria for Member in good standing: • Must attend two consecutive meetings to establish voting membership • Membership dues current • Must not miss two consecutive Meetings Interest categories associated with GEIA ballot voting are: • Users - Members that utilize electronic equipment to provide services to an end user. • Producers - Members that supply electronic equipment. • General Interest - Members are neither producers nor users. This category includes, but is not limited to, Government, regulatory agencies (state and federal), researchers, other organizations and associations, and/or consumers.