EIA IBIS Open Forum Meeting Date: August 29, 2008 VOTING MEMBERS AND 2008 PARTICIPANTS Actel (Prabhu Mohan) Agilent Sanjeev Gupta, Radek Biernacki, Amolak Badesha Fangyi Rao, [Ian Dodd], Yutao Hu, Vuk Borich Nobutaka Arai, Ludwig Eichingner AMD Nam Nguyen* Ansoft Corporation Steve Pytel, Ricardo Teliuteuesh, Dan Dvorscak Apple Computer (Bill Cornelius) Applied Simulation Technology (Fred Balistreri) ARM (Nirav Patel) Cadence Design Systems Terry Jernberg*, Hemant Shah, Ambrish Varma [C. Kumar], Brad Griffin, Zhen Mu Cisco Systems Syed Huq, Mike LaBonte*, AbdulRahman (Abbey) Rafiq Huyen Pham, Emily Yao, Susmita Mutsuddy John Fisher, Paul Ruddy, Jun Li, Jianmin Zhang Luis Boluna, Kelvin Qiu, Jane Lim, Ilyoung Park Rick Brooks, Chris Padilla, Ehsan Kabir Ericsson Anders Ekholm* Freescale Jon Burnett Green Streak Programs Lynne Green Hitachi ULSI Systems Kazuyoshi Shoji Huawei Technologies Tao Guan*, Xiaoqing Dong IBM Adge Hawes* Infineon Technologies AG Christian Sporrer Intel Corporation Michael Mirmak*, Rich Mellitz, Wei-hsing Huang Vishram Pandit LSI [Frank Gasparik], Brian Burdick*, [Kim Helliwell] Marvell Semiconductor (Itzik Peleg) Mentor Graphics Arpad Muranyi*, John Angulo Micron Technology Randy Wolff Nokia Siemens Networks GmbH Eckhard Lenski*, Klaus Huebner, Katja Koller Samtec Jim Nadolny, Justin McCalister Signal Integrity Software Mike Steinberger, Walter Katz, Todd Westerhoff* Doug Burns, Mike Mayer, Barry Katz Sigrity Sam Chitwood, Brad Brim, Ben Franklin Kristopher Stytte, Raymond Chen Synopsys Ted Mido Teraspeed Consulting Group Bob Ross*, Tom Dagostino, Al Neves Texas Instruments Richard Ward, Pavani Jella* Toshiba Yasumasa Kondo, Noriyasu Yoshikawa Xilinx David Banas*, Ajay Shah, Suzanne Yiu Mustansir Fanaswalla Zuken Michael Schaeder, Ralf Bruening ZTE (Ying Xiong) OTHER PARTICIPANTS IN 2008 Aeroflex Metelics David Nguyen Aica Kogyo Akihiro Tanaka Altera Ravindra Gali, Jing Wu, John Oh, Hui Fu Avago Technologies Minh Quach, Sari Tocco Bayside Design Elliot Nahas, Kevin Roselle Celestica Ihsan Erdin ECL Advantage Thomas Iddings EFM Ekkehard Miersch Elma Bustronic Michael Munroe Exar Helen Nguyen Flextronics Hasnain Syed GEIA (Chris Denham) Golden Bridge Networks Saman Sadigh ICT Solutions Steven Wong Interface Technologies Dan Waterloo IO Methodology Lance Wang, Zhi (Benny) Yan, Li (Kathy) Chen JEITA Atsushi Ishikawa Magma DA Anand Ramalingam NEC Takeshi Watanabe NetLogic Microsystems Eric Hsu North Carolina State University Paul Franzon Nokia Ali Arsian Nuova Systems Zhiping Yang Prentice Hall Bernard Goodwin Physware Marc Kowalski Politecnio di Torino Igor Stievano Qimonda AG Md Morshed Alam Heial, Suhas Jawale Siemens AG Manfred Maurer, Annika Woehner Simberian Yuriy Shlepnev SimLab Software GmbH Heiko Grubrich Tektronix Steve Corey TietoEnator GmbH Heinz-Hartmut Ibowski Tyco Electronics Chad Morgan Vertical Circuits Mark Egbers Xsigo Systems Robert Bada Independent Guy de Burgh, Ardy Forouhar, Dave Galloi Kazuhiko Kusunoki In the list above, attendees at the meeting are indicated by . Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS The bridge numbers for future IBIS teleconferences are as follows: Date Telephone Number Meeting ID September 19, 2008 1-866-432-9903 1-2119-1267 All meetings are 8:00 AM to 9:55 AM US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. When calling into the meeting, press 1 to attend the meeting, then follow the prompts to enter the meeting ID. For new, local international dial-in numbers, please reference the bridge numbers provided by Cisco Systems at the following link: http://www.cisco.com/web/about/doing_business/conferencing/index.html NOTE: "AR" = Action Required. ---------------------------------------------------------------------------- --------------------------------------------------- INTRODUCTIONS AND MEETING QUORUM No new members. CALL FOR PATENTS Michael Mirmak called for any patents or pending patents related to the IBIS Version 3.2, 4.0, 4.1, 4.2, or ICM 1.1 specifications. No patents were declared. MEMBERSHIP UPDATE AND TREASURER'S REPORT Michael Mirmak reported that two additional membership renewals had been confirmed since the last meeting, making a combined membership of 31. Bob Ross confirmed that revenue targets have been met for the year, and that any surplus was likely to be applied to an IBIS 5.0 parser contract. [After the meeting, Zuken’s membership was confirmed, bringing the total membership to 32. This is reflected in the attendee list above and the voting status listing below.] REVIEW OF MINUTES AND ARS Michael Mirmak called for comments regarding the minutes of the August 8, 2008 IBIS Open Forum teleconference. The minutes were approved without changes. WEB PAGE UPDATES Syed Huq reported that changes have been made to the membership poster to reflect membership renewals and updated logos. More updates are coming. MAILING LIST ADMINISTRATION Bob Ross reported that everything is working normally. MODEL LIBRARY UPDATE No update. PRESS UPDATE Bob Ross noted that a recent Cadence Design Systems product announcement mentioned IBIS-AMI support. MISCELLANY/ANNOUNCEMENTS No update. OPENS FOR NEW ISSUES Several opens were discussed at the end of the meeting (see below). INTERNATIONAL/EXTERNAL PROGRESS - DASC Michael Mirmak noted that meeting of the DASC had been recently held, but that no information relevant to IBIS had been discussed. The DASC file and e-mail archive may be found at: http://www.dasc.org/ - P1735 Encryption No update. The IEEE DASC Study Group on Encryption web reflector archives are found at: http://www.eda-stds.org/ip-encrypt/hm/ IEC APPROVAL ACTIVITIES Michael Mirmak reported that he and Randy Wolff met with Chris Denham of the GEIA, and that the full IBIS board met with Victor Berman of DASC and TC93. Victor will be checking into the process necessary to move IBIS 4.2 through the IEC approval process, but that no action on IBIS 4.2 was likely at the Singapore IEC meeting on September 9. Chris Denham will also be confirming the IEC approval process and will confer with Victor. Chris suggested that IEC rules may enable the IEC to change the specification from the submitted version before approval, without the permission of the submitting group. SUMMIT STATUS - Asian Summits Planning Michael Mirmak noted that the Japan summit will be held at JEITA headquarters November 14, 2008. Two official announcements have been sent out for both Asian Summits. Bob Ross or Kazuyoshi Shoji should be contacted if planning to attend the Japan summit. The China summit contacts are Bob Ross and Lance Wang. The China summit will be held November 11, 2008 in Shanghai, at the Shanghai Mart Convention Center. - DesignCon Planning Michael Mirmak mentioned that the DesignCon event is scheduled for February 2-5, 2009 at the Santa Clara Convention Center in Santa Clara, California. Thursday, February 5, 2009 is tentatively scheduled for the summit. Michael repeated an earlier call to members to provide updated IBIS booth logo plaques, as the current plaques may be damaged or out-of-date. Mike LaBonte suggested that a photograph of the booth from the 2007 DesignCon show floor be sent out, so that members can assess the condition of their plaques. Sponsorship opportunities for all upcoming IBIS summits are available, with sponsors receiving free mentions in the minutes, agenda, and other announcements. Contact the IBIS Board for further details. IBIS QUALITY TASK GROUP Mike LaBonte reported that the Task Group has completed all I-V table discussions, and will move to V-T table discussions next. In response to a question from Michael Mirmak, Mike noted that the team will complete and release the 1.1 quality document before analyzing new IBIS features. At present, the checklists contain very few version-specific items. Bob Ross added that no multilingual checks have been discussed yet. The Quality Task Group checklist and other documentation can be found at: http://www.eda-stds.org/ibis/quality_wip/ IBIS MODEL REVIEW TASK GROUP No update. ADVANCED TECHNOLOGY MODELING TASK GROUP Arpad Muranyi reported that group discussion is continuing on SPICE-like interconnect format proposals, including Walter Katz’s IBIS-SPICE. The team is now discussing requesting that a subset of a popular, proprietary SPICE be integrated into the eventual specification, along with the relevant user manual contents, with the permission of the vendor. This would be considered a donation for the purposes of standardizing common SPICE functions, and would not limit either vendors or the development of the new specification thereafter. With SPICE variants being widely used in industry, Arpad encouraged participation in this effort from IBIS members and attendees. Task group material can be found at: http://www.eda-stds.org/ibis/macromodel_wip/ AD HOC TASK GROUPS (INTERCONNECT) Michael Mirmak reported that the group is meeting weekly and is reviewing Touchstone 2.0 draft language. Mixed-mode support is essentially complete in the current draft, with only minor syntax and editorial fixes needed. The group will turn to the grouping of ports for interconnect purposes next, and then prepare the resulting document for an approval vote. Task group material can be found at: http://www.eda.org/ibis/adhoc/interconnect/ NEW ISSUES None. BIRD111: EXTENDED USAGE OF EXTERNAL SERIES COMPONENTS IN EBDS Bob Ross stated that no new progress has been made on BIRD111, but that he is working with Michael Schaeder on improvements. Differential support continues to be the most pressing concern with the current BIRD. IBIS 5.0 DRAFT REVIEW AND VOTE Michel Mirmak issued a call for comments regarding the draft document. No comments were received. Bob Ross moved, with Mike LaBonte seconding, that the IBIS 5.0 specification be approved by a vote of the membership. A vote was held, with the following results: AMD Yes Cadence Design Systems Yes Cisco Systems Yes Ericsson Yes Huawei Technologies Yes IBM Yes Intel Corporation Yes LSI Yes Mentor Graphics Yes Micron Technology Yes* Nokia Siemens Networks GmbH Yes Signal Integrity Software Yes Teraspeed Consulting Group Yes Texas Instruments Yes * vote via e-mail received before the meeting [Xilinx joined the meeting after the vote was completed] The text of the specification is available at the following link: http://www.eda.org/pub/ibis/ver5.0/ Arpad Muranyi suggested that hyperlinks in the final PDF* version of the document be restored, to make document viewing easier. Bob and Michael will work offline to ensure this. Michael noted that a press release draft had been prepared and shared the draft with the participants. Todd Westerhoff volunteered to provide editorial comments offline. The final release will be reviewed by the IBIS board before presentation to the GEIA for distribution. The attendees discussed IBISCHK5 parser development. A bid packet, including a parser specification or statement of work, will be prepared, with open bidding as was done for IBIS 4.1. Arpad inquired whether the developer of the previous revision was available. Michael responded that he was not. Bob Ross suggested the formation of a small team to review the bid materials and decide on the winner. This team may consist of some or all of the members of the IBIS board. He volunteered to act as technical coordinator for the selected developer, to answer specification interpretation questions. IBISCHK4 BUG STATUS BUG99 and BUG101 are still open and will be fixed in the next revision of the parser. The BUG report list is available at the link below: http://www.eda.org/ibis/bugs/ibischk/ ICMCHK1 BUG STATUS No update. NEW ISSUES Arpad Muranyi raised the issue of min/max conditions for clamps as relates to corners. This topic had been briefly mentioned in the previous teleconference. A reflector question recently highlighted confusion about how to pair diode corner information with driver corner. Diodes typically use a bipolar process, where most drivers use a CMOS process for their buffer transistors. This means that the temperature conditions for slow, weak diodes are the same as for strong, fast driver transistors. Further, SPICE models of diodes are often inaccurate. As a result, IBIS models may not include a true “worst-case” collection of total buffer behaviors for either the max or min corners. Michael Mirmak noted that this should not be different than C_comp association by numerical size rather than corner, and that tools could enable users to associate the correct data with the correct conditions. Arpad responded that this was not necessarily a “mix-and-match” problem, but it was more of a data extraction conditions problem. Mike LaBonte noted that clamp subtraction may cause the resulting [Pullup] and [Pulldown] tables in an I/O model to be incorrect. Bob Ross proposed that the specification and associated documentation simply note that all data given for a particular “corner” (typ, min, max) simply be consistent with the conditions for that corner, with the exception of C_comp. The problem will be discussed in future meetings. Michael Mirmak noted that a draft BIRD is being discussed to add enhanced buffer capacitance descriptions to IBIS. Some proposals have circulated privately, though none are ready for submission as BIRDs for approval. The proposals involve adding R-C circuits in parallel to the existing C_comp, using voltage-based tables of R and C. Individual tables would be used for the R and C values of each circuit branch. This enhancement would help model voltage- and frequency-dependent buffer impedances, for I/O, input- only and output-only buffer types at least. The problem has been addressed in IBIS summit presentations in 2002 and 2004. Bob Ross raised the issue of the current IBIS logo. As discussed in a previous meeting, the current logo contains references to GEIA and EIA, neither of which may be appropriate as the IBIS parent organizations have changed. ITAA may have the capacity to generate an IBIS logo for official use. At present, the word “IBIS” in italic serif font, in blue and black, is used for DesignCon and other events. Mike LaBonte suggested that a new logo should involve square brackets, such as “[IBIS]”. NEXT MEETING The next IBIS Open Forum teleconference will be held September 19, 2008 from 8:00 AM to 10:00 AM US Pacific Time. ======================================================================== NOTES IBIS CHAIR: Michael Mirmak (916) 356-4261, Fax: (916) 377-3788 michael.mirmak@intel.com Server Platform Technical Marketing Engineer, Intel Corporation FM5-239 1900 Prairie City Rd. Folsom, CA 95630 VICE CHAIR: Syed Huq (408) 525-3399, Fax: (408) 526-5504 shuq@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA 95134-1706 SECRETARY: Randy Wolff (208) 363-1764, Fax: (208) 368-3475 rrwolff@micron.com SI Modeling Manager, Micron Technology, Inc. 8000 S. Federal Way Mail Stop: 01-711 Boise, ID 83707-0006 LIBRARIAN: Lance Wang (978) 633-3388 lwang@iometh.com President / CEO, IO Methodology, Inc. PO Box 2099 Acton, MA 01720 WEBMASTER: Syed Huq (408) 525-3399, Fax: (408) 526-5504 shuq@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA 95134-1706 POSTMASTER: Bob Ross (503) 246-8048, Fax : (503) 239-4400 bob@teraspeed.com Staff Scientist, Teraspeed Consulting Group 10238 SW Lancaster Road Portland, OR 97219 This meeting was conducted in accordance with the GEIA Legal Guides and GEIA Manual of Organization and Procedure. The following e-mail addresses are used: majordomo@eda.org In the body, for the IBIS Open Forum Reflector: subscribe ibis In the body, for the IBIS Users' Group Reflector: subscribe ibis-users Help and other commands: help ibis-request@eda.org To join, change, or drop from either or both: IBIS Open Forum Reflector (ibis@eda.org) IBIS Users' Group Reflector (ibis-users@eda.org) State your request. ibis-info@eda.org To obtain general information about IBIS, to ask specific questions for individual response, and to inquire about joining the EIA-IBIS Open Forum as a full Member. ibis@eda.org To send a message to the general IBIS Open Forum Reflector. This is used mostly for IBIS Standardization business and future IBIS technical enhancements. Job posting information is not permitted. ibis-users@eda.org To send a message to the IBIS Users' Group Reflector. This is used mostly for IBIS clarification, current modeling issues, and general user concerns. Job posting information is not permitted. ibis-bug@eda.org To report ibischk parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/bugs/ibischk/ http://www.eda.org/ibis/bugs/ibischk/bugform.txt icm-bug@eda.org To report icmchk1 parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/icm_bugs/ http://www.eda.org/ibis/icm_bugs/icm_bugform.txt To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which reside at: http://www.eda.org/ibis/bugs/s2ibis/bugs2i.txt http://www.eda.org/ibis/bugs/s2ibis2/bugs2i2.txt http://www.eda.org/ibis/bugs/s2iplt/bugsplt.txt Information on IBIS technical contents, IBIS participants and actual IBIS models are available on the IBIS Home page: http://www.eigroup.org/ibis/ibis.htm Check the IBIS file directory on eda.org for more information on previous discussions and results: http://www.eda.org/ibis/directory.html All eda.org documents can be accessed using a mirror: http://www.ibis-information.org Note that the "/ibis" text should be removed from directory names when this URL mirror is used. Other trademarks, brands and names are the property of their respective owners. GEIA STANDARDS BALLOT VOTING STATUS I/O Buffer Information Specification Committee (IBIS) |Organization |Interest |Standard|June 27,|July |August |August | | |Category |s Ballot|2008 |18, |8, 2008|29, | | | |Voting | |2008 | |2008 | | | |Status | | | | | |Actel |Producer |Inactive| | | | | |Advanced Micro |Producer |Active | | |( |( | |Devices | | | | | | | |Agilent |User |Inactive| | | | | |Technologies | | | | | | | |Ansoft |User |Inactive| | | | | |Apple Computer |User |Inactive| | | | | |Applied |User |Inactive| | | | | |Simulation | | | | | | | |Technology | | | | | | | |ARM |Producer |Inactive| | | | | |Cadence Design |User |Active |( | |( |( | |Systems | | | | | | | |Cisco Systems |User |Active |( |( |( |( | |Ericsson |Producer |Inactive|( | | |( | |Freescale |Producer |Inactive| | | | | |Green Streak |General |Inactive| | | | | |Programs |Interest | | | | | | |Hitachi ULSI |Producer |Inactive| | | | | |Systems | | | | | | | |Huawei |User |Active |( | |( |( | |IBM |Producer |Active |( | |( |( | |Infineon |Producer |Inactive| | | | | |Technologies AG | | | | | | | |Intel Corp. |Producer |Active |( |( |( |( | |LSI |Producer |Active |( |( |( |( | |Marvell |Producer |Inactive| | | | | |Semiconductor | | | | | | | |Mentor Graphics |User |Active |( |( |( |( | |Micron |Producer |Active | |( |( | | |Technology | | | | | | | |Nokia Siemens |Producer |Active |( | |( |( | |Networks | | | | | | | |Samtec |Producer |Inactive| | | | | |Signal Integrity|User |Active |( |( | |( | |Software | | | | | | | |Sigrity |User |Active |( |( |( |( | |Synopsys |User |Inactive| | | | | |Teraspeed |General |Active |( |( |( |( | |Consulting |Interest | | | | | | |Texas |Producer |Active | | |( |( | |Instruments | | | | | | | |Toshiba |Producer |Inactive| | | | | |Xilinx |Producer |Active | |( | |( | |ZTE |User |Inactive| | | | | |Zuken |User |Inactive| | | | | Criteria for Member in good standing: • Must attend two consecutive meetings to establish voting membership • Membership dues current • Must not miss two consecutive Meetings Interest categories associated with GEIA ballot voting are: • Users - Members that utilize electronic equipment to provide services to an end user. • Producers - Members that supply electronic equipment. • General Interest - Members are neither producers nor users. This category includes, but is not limited to, Government, regulatory agencies (state and federal), researchers, other organizations and associations, and/or consumers.