EIA IBIS Open Forum Minutes Meeting Date: November 11, 2008 GEIA STANDARDS BALLOT VOTING STATUS See last page of the minutes for the voting status of all member companies. VOTING MEMBERS AND 2008 PARTICIPANTS Actel (Prabhu Mohan) Agilent Technologies Sanjeev Gupta, Radek Biernacki, Amolak Badesha Fangyi Rao, [Ian Dodd], Yutao Hu, Vuk Borich Nobutaka Arai, Ludwig Eichingner, Cheng-ming Ren*, Xuliang Yuan*, Jianping Zhu* AMD Nam Nguyen Ansoft Corporation Steve Pytel, Ricardo Teliuteuesh, Dan Dvorscak, Steele Deng*, Donny Hou*, Baolong Li*, Davis Yan*, Long Yang*, Song Zheng* Apple Computer (Bill Cornelius) Applied Simulation Technology (Fred Balistreri) ARM (Nirav Patel) Cadence Design Systems Terry Jernberg, Hemant Shah, Ambrish Varma [C. Kumar], Brad Griffin, Zhen Mu, Lanbing Chen*, Wenliang Dai*, Feng Li*, Shirley Li*, Jinbai Liu*, Ping Liu*, Yabao Meng*, Jian (John) Peng*, Jain Shan*, Hui Wang*, Yitong Wen*, Yitong Wu*, Dingru Xiao*, Ke (Coco) Xu*, Feng Yu*, Rong Zhang*, Wenjiang Zhang*, Alex Zhao*, George Zhou* Cisco Systems Syed Huq, Mike LaBonte, AbdulRahman (Abbey) Rafiq Huyen Pham, Emily Yao, Susmita Mutsuddy John Fisher, Paul Ruddy, Jun Li, Jianmin Zhang Luis Boluna, Kelvin Qiu, Jane Lim, Ilyoung Park Rick Brooks, Chris Padilla, Ehsan Kabir, Jin (Leo) Hu*, Weifeng Shu*, Xinghai (Sean) Tang*, Huihui (Iris) Zhao* Ericsson Anders Ekholm* Freescale Jon Burnett Green Streak Programs Lynne Green Hitachi ULSI Systems Kazuyoshi Shoji Huawei Technologies Tao Guan*, Xiaoqing Dong, Yu Chen*, Jing Fu*, Peng Huang*, Jinjun Li*, Bo Liu*, Mongfang Lv*, Shaokun Shen*, Victor Wang*, Shisheng Wu*, Qilin Xu*, Zhenlong Xu*, Hang Ya*, Zhou Yang*, Wen Yu*, Cheng Zhang*, Gezhi Zhang*, Yuehui Zhu* IBM Adge Hawes Infineon Technologies AG Christian Sporrer Intel Corporation Michael Mirmak*, Rich Mellitz, Wei-hsing Huang Vishram Pandit, Lili Deng*, Haifeng Gong*, Fanghui Li*, Wenjie Mao*, Yang Qu*, Yiunglei Ren*, Wayne Tsuchimoto*, Yang Wu*, Maoxin Yin*, Xinjun Zhang*, James Zhou* LSI [Frank Gasparik], Brian Burdick, [Kim Helliwell] Marvell Semiconductor Jane Liu*, Michael Wang*, Yuyang Wang*, Mentor Graphics Arpad Muranyi, John Angulo, Minggang Hou*, Jane Liao*, Xuefeng Liu* Micron Technology Randy Wolff* Nokia Siemens Networks GmbH Eckhard Lenski, Klaus Huebner, Katja Koller, Xianyun Wang* Samtec Jim Nadolny, Justin McCalister Signal Integrity Software Mike Steinberger, Walter Katz, Todd Westerhoff* Doug Burns, Mike Mayer, Barry Katz Sigrity Sam Chitwood, Brad Brim, Ben Franklin Kristopher Stytte, Raymond Chen*, Jiangsong Hu*, Xianfeng Li*, Tao (Helen) Xu* Synopsys Ted Mido, Xuefeng Chen*, Wenyun Gu*, Jinghua Huang*, Deng Shi* Teraspeed Consulting Group Bob Ross*, Tom Dagostino, Al Neves Texas Instruments Richard Ward, Pavani Jella Toshiba Yasumasa Kondo, Noriyasu Yoshikawa Xilinx David Banas*, Ajay Shah, Suzanne Yiu Mustansir Fanaswalla Zuken Michael Schaeder, Ralf Bruening ZTE Huifeng Chen*, Xiaolin Chen*, Jinku Guan*, Hui Jiang*, Nan Jiang*, Shiju Sui*, Zhiwei Yang*, Shunlin Zhu* OTHER PARTICIPANTS IN 2008 3M Kylin Chen*, Shiang Yao* Aeroflex Metelics David Nguyen Aica Kogyo Akihiro Tanaka Alcatel-Lucent Haibo Wang* Alcatel-Shell Weiping Chen*, Feng Ji* Altera Ravindra Gali, Jing Wu, John Oh, Hui Fu Avago Technologies Minh Quach, Sari Tocco Bayside Design Elliot Nahas, Kevin Roselle Celestica Ihsan Erdin, Shuxu Bao*, Ricky Liu*, Gloria Wang*, Shengyu Wu*, Molly Xu*, Harrison Xue*, Camilla Zhang*, Van Zhu* Cybernet Systems Golden Qian*, Bill Wang*, James Wang*, David Xu* ECL Advantage Thomas Iddings EFM Ekkehard Miersch Elma Bustronic Michael Munroe Exar Helen Nguyen Feng Hao Shanghai Information Zhengchang Gu* Fiberhome Telecommunications Qian (Andy) Liao*, Juan Liu*, Elliotte Wan*, Qi Zheng* Flextronics Hasnain Syed GEIA (Chris Denham) Golden Bridge Networks Saman Sadigh Hisense Electronic Haishi Hu* Huawei-3Com Wei Yang* ICT Solutions Steven Wong IDT Newave Zhiguang Li* Interface Technologies Dan Waterloo Inventec Corporation Leonardo Huang*, Zhong Peng* IO Methodology Lance Wang*, Zhi (Benny) Yan*, Li (Kathy) Chen*, Seana Tong*, Salvia Yu*, Zhangmin Zhong*, Edwin Zhu* JEITA Atsushi Ishikawa Magma DA Anand Ramalingam Meds IC Solutions Xinhua Zhang* Nanjing Nari-Relays Tao Wang*, Yu Xia* NEC Takeshi Watanabe NetLogic Microsystems Eric Hsu North Carolina State University Paul Franzon Nokia Ali Arsian Nuova Systems Zhiping Yang Nvidia Corporation Baal Yang*, Tibet Zhao* Prentice Hall Bernard Goodwin Physware Marc Kowalski Politecnio di Torino Igor Stievano Qimonda AG Md Morshed Alam Heial, Suhas Jawale Radisys Ling Li*, Guo Tang* Shanghai University Shipeng Liu* Siemens AG Manfred Maurer, Annika Woehner Simberian Yuriy Shlepnev SimLab Software GmbH Heiko Grubrich Tektronix Steve Corey, Xin Wu* TietoEnator GmbH Heinz-Hartmut Ibowski Trident Multimedia Technologies Xiagin Cao*, Jeffery He* Tyco Electronics Chad Morgan Universal Scientific Industrial Lurker Li*, Spenser Tang* VeriSilicon Microelectronics Qiang Chen*, Steven Gou*, Zhiying Yuan* Vertical Circuits Mark Egbers Winwin Corporation Haiphe Lau*, Linfa Liu* Xsigo Systems Robert Bada Independent Guy de Burgh, Ardy Forouhar, Dave Galloi Kazuhiko Kusunoki In the list above, attendees at the meeting are indicated by *. Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS The bridge numbers for future IBIS summits teleconferences are as follows: Date Telephone Number Bridge # Passcode November 14, 2008 ASIAN IBIS SUMMIT (JAPAN) NO TELECONFERENCE November 21, 2008 1-866-432-9903 121522040 All meetings are 8:00 AM to 9:55 AM US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. When calling into the meeting, provide the bridge number and passcode at the automated prompts. If asked by an operator, please request to join the IBIS Open Forum hosted by Michael Mirmak. For international dial-in numbers, please contact Michael Mirmak. NOTE: "AR" = Action Required. ---------------------------------------------------------------------------- --------------------------------------------------- WELCOME AND KEYNOTE COMMENTS The IBIS Open Forum Summit was held in Shanghai, PRC at the Shanghai Mart. About 142 people representing 39 organizations attended. The notes below capture some of the content and discussions. The meeting presentations and other documents are available at: http://www.eda.org/pub/ibis/summits/nov08a/ Jinjun Li of Huawei Technologies began the meeting shortly after 9 AM. Mr. Lance Wang assisted with translations. Jinjun expressed appreciation to the IBIS group and sponsors of the event. He mentioned that IBIS Summits have been happening since 2005, and there have been excellent paper presentations at the summits. He welcomed all to Shanghai. Michael Mirmak made brief remarks and opened the meeting. He recognized the IBIS committee members present at the meeting. He mentioned the importance of technology in our lives and the importance of specifications such as IBIS in developing new technology. He thanked all the sponsors of the event including Huawei Technologies, Agilent Technologies, Ansoft, Cadence Design, Cybernet Systems, Intel, Mentor Graphics, SiSoft, Sigrity, Synopsys and ZTE Corporation. He also thanked the summit organizers. LOOK INTO IBIS BUFFER CURVES Lance Wang, IO Methodology Lance reviewed the circuit elements of a basic I/O buffer. He then related these elements to their corresponding I-V curves in IBIS. He noted that all I-V curves are related to specific voltage references and showed examples of I-V curves for high, low and open buffer states. He overlaid load lines on the I-V curves. The voltage point where the load line intersected to the [Pullup] or [Pulldown] I-V curve corresponded to the endpoint voltage found in the V-t curves of the same load. He discussed the importance of maintaining timing relationships between the V-t curves. [Submodel] I-V curves were shown to demonstrate how to model on-die termination characteristics. A question was asked about the difference between using the [Ramp] data and the V-t data. Lance explained that it was important to include V-t data for more correct results from simulation. STUDY OF SOLVING IBIS SINGLE VT Xuefeng Chen, Synopsys Xuefeng began by reviewing that solving for [Pullup] and [Pulldown] scaling coefficients is commonly done with the 2-equation, 2-unknown method. Theoretically, there is no solution for a single V-t curve. He showed waveforms of Kd and Ku values during a low to high transition of a buffer output. He demonstrated one method of solving for Ku and Kd values when only one V-t waveform is available. Results were shown for various test loads. A second method imposed a constraint relating Ku and Kd. This method showed worse accuracy. He concluded that there is not a good general method to get an accurate solution for all IBIS models with a single V-t waveform. A question was asked if Ku and Kd parameters change with different loads. Xuefeng explained that these parameters relate to the physical device and do not change with load. A question was asked about how to use more than two sets of V-t curves. The answer was that you use two sets at a time, but use the sets that most closely match the load of the system. Also, one should try to set R_fixture to a value close to the transmission line impedance of the system. MICRON’S IBIS MODEL QUALITY PROCESS Randy Wolff, Micron Technology Randy highlighted that building a quality IBIS model involves building quality checks into each step of the model creation process. The process begins with a quality Spice model. Including multiple pre-driver stages ensures that the model input stimulus does not affect the output slew rate and timing. Critical timing paths should not be modified. Micron has two choices of netlists for inclusion of layout parasitics. An RC netlist provides the best match to silicon but is a much larger netlist than a C- only netlist. A good compromise is to use a C-only netlist but add RC models on critical nets to match timing delays of long metal lines. The resulting netlist shows good correlation to the RC netlist when looking at rising and falling waveform crossing voltage, Vox. C_comp minimum and maximum corners should be adjusted to match the range seen from silicon measurements including the package. When correlating I-V curves to measurements, voltage and temperature are easy to adjust, but it is more difficult to know how to adjust the transistor process model to match the silicon. Randy detailed a method for adjusting the process model to match the silicon. Detailed checklists should be used during both the Spice and IBIS model creation processes. Example checklists were shown. Randy mentioned the importance of the IBIS Quality task group’s work. Micron releases a detailed report with each IBIS model comparing the model to specification data and measurement data and comparing the IBIS model to the Spice model. Randy showed an example of Micron’s quality report. He concluded that model users should demand quality models from vendors and show them examples of quality models. David Banas asked about bounding of capacitance measurements and how to adjust C_comp. Randy explained that he uses variation in C_comp to bound the measurement data, but this is kept within a reasonable range, such as +/- 200fF for a mature process. Another question was asked if the process model could be adjusted in the corners if enough measurement data of the process was taken. Randy said that this could be done to create a model showing less process variation than may be found in the transistor model library, but only with enough measurement data to justify less process variation. USING BEHAVIORAL-LEVEL MODEL FOR SSN ANALYSIS Zhiwei Yang, Shunlin Zhu, ZTE Corporation Zhiwei showed a schematic of a multi-driver model for analyzing simultaneous switching characteristics. He introduced three simulation methods including using Spice models, IBIS models and macro-model based IBIS models. The test circuit included five drivers and a 2-port RLGC package model. He showed waveform results from the simulations. The IBIS model results are not accurate enough for full SSN evaluation, as they overestimate power, ground and quiet line noise. Improvements are needed to the model such as use of macro-models to provide voltage feedback or use of a BIRD95 methodology. He stressed the importance of developing software to convert BIRD95 Spice data to IBIS format and supporting IBIS 5.0 in EDA software. A question was asked if coupling of the package from power to ground was considered. Zhiwei answered that no, a simplified model was used for this part of the analysis. NEW TABLE-BASED MODELS IN IBIS 5.0, A COOKBOOK-STYLE GUIDE Michael Mirmak, Intel Corporation Michael began with a summary of IBIS development. He noted two new table- based keywords in IBIS 5.0. BIRD98 introduced [ISSO_PD] and [ISSO_PU] and BIRD95 introduced [Composite Current]. A cookbook style method was demonstrated for extracting the [ISSO_PD] and [ISSO_PU] data from a buffer. He stressed the importance of excluding diode clamp current from ISSO tables (including on-die termination effects). He noted that the ISSO keywords do not describe the pre-driver stage but describe static current modulation. The [Composite Current] data should include tables using the same load as the V-t tables and be time correlated to the V-t tables. The power delivery structure must be complete including buffer rail inductances and resistances, pre-driver structures and on-die decoupling structures. He summarized that model makers should start collecting this data now and encouraged the EDA tool providers to support these keywords. A question was asked if BIRD95 includes a way to model the on-die decoupling. Michael explained that there are no keywords included in the BIRD for this now. A second question was asked if the on-die decoupling is included on a per-buffer basis. Michael responded that one must be consistent with modeling an entire device or a single buffer. Bob Ross commented that you can use the series element keywords to model the on-die decoupling circuit. Another question was asked if [ISSO_PU] and [ISSO_PD] should be used with a model simulated with power supplies internal or external to the model. Michael said that the keywords are best used when modeling an external power supply where you could then model power supply noise. IBIS EBD MODELING, USAGE AND ENHANCEMENT, AN EXAMPLE OF MEMORY CHANNEL MULTI-BOARD SIMULATION Tao Xu, Sigrity Tao began by showing the typical system memory bus structure for a two DIMM system. Several challenges in memory channel simulation exist including multi-drop topologies, high speed signaling with transmission loss, tighter timing among different signal groups, significant crosstalk and SSO and model accuracy. She introduced EBDs and noted that they are good for transmission effect assessment and timing analysis for first order considerations. Sections of EBD syntax were shown for a DIMM module address path and for a differential data strobe path. An EBD simulation problem was presented. Tao noted that PDS noise was simulated on the motherboard, but the EBD assumes ideal powers and grounds, so much information is lost by using an EBD for the DIMM. Also, crosstalk analysis is incomplete. She recommended enhancing EBD for improvements to crosstalk and power and ground effects analysis. She demonstrated the ability to simulate both power integrity and signal integrity effects for proper SSN analysis and concluded that enhancements are required for EBD. A question was posed that lots of vendors support multi-board simulation, so why not use more complete board models than EBDs. Tao explained that multi-board simulation is very slow to simulate and board models are not always available due to IP protection. TOUCHSTONE VERSION 2.0 MIXED-MODEL SYNTAX Bob Ross, Teraspeed Consulting Group Bob noted that terms used in Touchstone include SE for single-ended, MM for mixed-mode and GMM for generalized mixed-mode. The original Touchstone was issued in 1984. Touchstone version 2.0 is extended to remove some format limitations and to add some resistance-per-port flexibility for PDS applications. Touchstone 2.0 adds eight IBIS-like keywords. Details of the keywords are found in the IBIS summit meeting at DesignCon 2008. Only four of the keywords are required. He showed the differences in block arrangement between Touchstone version 1.0 and 2.0. He highlighted that the new [Mixed-Mode Order] keyword applies to S, Y and Z n-port matrices. Mathematical details are found in the Touchstone 2.0 specification. Examples were shown of converting single-ended data to generalized mixed- mode and mixed-mode data formats. Several EDA tools are already implementing portions of the mixed-mode syntax. He noted that the specification is not yet completed, so minor changes are still being considered. OPTIMUM FREQUENCY SAMPLING IN S-PARAMETER EXTRACTION AND SIMULATION Jinghua Huang, Synopsys Jinghua noted that there are many issues in S-parameter creation such as limited frequency range coverage, no DC point, coarse sampling, non- passivity and noise. These issues cause problems in simulation. AC analysis results were shown for two models using sparse and dense sampling points. Transient analysis showed significant differences between the models as well. A good S-parameter data set provides the DC point, covers a wide enough frequency range, has dense enough data, is passive and has no measurement noise. Interpolation and extrapolation methods can be used to correct bad S-parameter data and make it useful. Several methods are available with various advantages and disadvantages. Differences were shown between using Real/Imaginary and Magnitude/Angle interpolation. Noise filters can be used to smooth data. Passivity checking and enforcement are very important. Data should be plotted on a Smith chart before determining which methods to use for data correction. Good S- parameters always show beautiful curves on the Smith chart. A question was asked if using the Smith Chart, can you check for causality. Jinghua explained that you need tools to convert to the time domain to see if any data occurs before time zero. SYSTEM-LEVEL SERIAL LINK ANALYSIS USING IBIS-AMI MODELS Todd Westerhoff, SiSoft Todd began by detailing requirements for analyzing serial links. Multi- million bit simulations are needed as well as modeling of equalization and clock recovery circuits. IP must also be protected. There are challenges with using traditional SerDes analysis. SerDes vendor tools don’t work together and open-source tools lack IP vendor models. IBIS-AMI is a new serial link analysis method and is now part of IBIS 5.0. It divides SerDes simulation into two parts – network characterization and communications analysis. IBIS-AMI models include an analog model and an algorithmic model. Designing a serial link involves a lot of analysis and design decisions. Statistical analysis directly computes eye distributions and is extremely fast. Tap settings are easily optimized for a transmitter to minimize bit error rate. Time domain analysis can be used to model non- linear effects and time-varying behavior including adaptive optimization. The Rx DFE model can include adaptive equalization to optimize tap coefficients based on an input data stream. IBIS-AMI models provide significant performance enhancement over Spice simulation and equivalent performance to proprietary SerDes simulation tools. Comparisons were shown between an IBIS-AMI model and both Spice and IBM HSSCDR. The results correlated very well. IBIS-AMI SUPPORT VIA VHDL-AMS Arpad Muranyi, Minggang Hou, Mentor Graphics Minggang began by noting that one vendor’s implementation of VHDL-AMS has a built-in function that acts as a C-code interface. This function was used to call an IBIS-AMI model into a VHDL-AMS simulator using a C-code wrapper. An example was shown using IBIS-AMI Tx and Rx models. A time domain simulation generates a channel response, and then the AMI Tx and Rx models are executed using that channel response. Waveform results are then plotted. In conclusion, IBIS-AMI models (DLLs) are fully supported in VHDL- AMS through attributes. Any programming language capable of producing executables could also be supported in the same way. A question was asked of where the DLL model came from. Minggang responded that it came from a vendor. AMI MODEL IN SI SIMULATION Tao Guan, Huawei Technologies Tao began with background on serial link simulation development. IBIS 5.0 now provides users with a good solution for serial link simulation. He showed a simulation using an AMI model including a 3-tap Tx FFE and a 5-tap Rx DFE simulated at 11.0Gbps. Three different channels were analyzed. A channel analysis report was shown that summarized eye height and eye width under different bit error rates. Eye diagram and bathtub curve results were plotted. Highlights of the simulation approach included simulation of a large number of bits, inclusion of FFE, CDR and CDR circuits, consideration of jitter and DFE and FFE coefficient auto-calculation. A drawback of the simulation was that the AMI model was in a vendor specific (non-IBIS) format, and with current AMI models, users can’t analyze the contribution of clock jitter and power noise due to the lack of a jitter transfer function (JTF) and power noise sensitivity (PNS). Also, a mask specification was not included with the model, and Tao felt that this needs to be included in AMI. JTF and PNS contributions were analyzed in more detail as they apply to a PLL. If PLLs are to be modeled in IBIS-AMI, JTF and PNS will need to be added to the AMI model. EYE DIAGRAMS IN IBIS Yubao Meng, Cadence Design Systems Yubao noted that eye diagrams are very important for SI analysis, but IBIS does not support inclusion of eye mask data in the specification. Including eye mask data in IBIS models would improve design flows by encouraging earlier eye mask checking. Eye mask data added to the specification could represent either standards such as PCI Express or device specific eye limits. Eye masks included for SerDes channel analysis would allow easy checking of interface compliance. For source synchronous channels, the eye mask might relate to setup and hold time limits and be aligned to the clock/strobe. Examples were shown for HDMI, HDMI TP2, source synchronous and common clock eye masks. By including eye masks in the IBIS model, this will promote earlier use of eye masks in the design process and IC vendors might also be allowed to advertise their device- specific, less stringent eye mask requirements. QUASI-ANALYTICAL ESTIMATION OF VERY LOW BIT ERROR RATE Dingqing Lu, Sanjeev Gupta, Mihai Marcu, Xuliang Yuan, Agilent Technologies Dingqing noted that a very low bit error rate (BER) estimation for a system with ISI, jitter and noise is needed. Monte Carlo analysis is very slow, so fast BER techniques have been proposed. First the BER is estimated using a Monte Carlo analysis. Then, a quasi-analytical (QA) method is used. The results matched very well. The QA analysis was also used to plot the BER versus time offset. The QA method showed a large reduction in simulation data points needed to determine a small BER versus the Monte Carlo method. A question was asked if the QA method is similar to what is used in StatEye. Dingqing noted that they are not easily compared. ACCURATE GHZ CHANNEL SIMULATION AND STATISTICAL ANALYSIS FOR SSE (SOLUTION SPACE EXPLORATION) Baolong Li*, Weiping Hou**, Ansoft*, Huawei Technologies** Baolong explained that the traditional serial link analysis was done with Spice simulation or mathematical methods such as Matlab. A Spice simulation was used to analyze a 6.25Gbps serial link and compared to measurements. Then the fast convolution method of statistical analysis was shown. An LTI assumption was made for the statistical analysis. Solution space exploration is much easier using statistical analysis methods due to simulation speed improvements. Statistical analysis methods can be used to analyze BER as well as jitter and plotting of an eye mask. With a full channel model, the effects of back-drill length, anti-pad diameter, connector parasitic and transmission line length can be analyzed separately and swept together in SSE simulations. This analysis methodology is realistically only possible with use of statistical analysis techniques. CONCLUDING ITEMS Michael Mirmak thanked the presenters, sponsors, co-sponsors and attendees for their support and participation. The meeting adjourned at approximately 5:30 PM. NEXT MEETING The next IBIS Open Forum summit will be held in Tokyo, Japan on November 14. The next teleconference will be held November 21, 2007 from 8:00 AM to 10:00 AM US Pacific Time. Minutes may be delayed due to summit activities. ======================================================================== NOTES IBIS CHAIR: Michael Mirmak (916) 356-4261, Fax: (916) 377-3788 michael.mirmak@intel.com Server Platform Technical Marketing Engineer, Intel Corporation FM5-239 1900 Prairie City Rd. Folsom, CA 95630 VICE CHAIR: Syed Huq (408) 525-3399, Fax: (408) 526-5504 shuq@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA 95134-1706 SECRETARY: Randy Wolff (208) 363-1764, Fax: (208) 368-3475 rrwolff@micron.com SI Modeling Manager, Micron Technology, Inc. 8000 S. Federal Way Mail Stop: 01-711 Boise, ID 83707-0006 LIBRARIAN: Lance Wang (978) 633-3388 lwang@iometh.com President / CEO, IO Methodology, Inc. PO Box 2099 Acton, MA 01720 WEBMASTER: Syed Huq (408) 525-3399, Fax: (408) 526-5504 huqs@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA 95134-1706 POSTMASTER: Bob Ross (503) 246-8048, Fax : (503) 239-4400 bob@teraspeed.com Staff Scientist, Teraspeed Consulting Group 10238 SW Lancaster Road Portland, OR 97219 This meeting was conducted in accordance with the GEIA Legal Guides and GEIA Manual of Organization and Procedure. The following e-mail addresses are used: majordomo@eda.org In the body, for the IBIS Open Forum Reflector: subscribe ibis In the body, for the IBIS Users' Group Reflector: subscribe ibis-users Help and other commands: help ibis-request@eda.org To join, change, or drop from either or both: IBIS Open Forum Reflector (ibis@eda.org) IBIS Users' Group Reflector (ibis-users@eda.org) State your request. ibis-info@eda.org To obtain general information about IBIS, to ask specific questions for individual response, and to inquire about joining the EIA-IBIS Open Forum as a full Member. ibis@eda.org To send a message to the general IBIS Open Forum Reflector. This is used mostly for IBIS Standardization business and future IBIS technical enhancements. Job posting information is not permitted. ibis-users@eda.org To send a message to the IBIS Users' Group Reflector. This is used mostly for IBIS clarification, current modeling issues, and general user concerns. Job posting information is not permitted. ibis-bug@eda.org To report ibischk parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/bugs/ibischk/ http://www.eda.org/ibis/bugs/ibischk/bugform.txt icm-bug@eda.org To report icmchk1 parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/icm_bugs/ http://www.eda.org/ibis/icm_bugs/icm_bugform.txt To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which reside at: http://www.eda.org/ibis/bugs/s2ibis/bugs2i.txt http://www.eda.org/ibis/bugs/s2ibis2/bugs2i2.txt http://www.eda.org/ibis/bugs/s2iplt/bugsplt.txt Information on IBIS technical contents, IBIS participants and actual IBIS models are available on the IBIS Home page: http://www.eigroup.org/ibis/ibis.htm Check the IBIS file directory on eda.org for more information on previous discussions and results: http://www.eda.org/ibis/directory.html All eda.org documents can be accessed using a mirror: http://www.ibis-information.org Note that the "/ibis" text should be removed from directory names when this URL mirror is used. Other trademarks, brands and names are the property of their respective owners. GEIA STANDARDS BALLOT VOTING STATUS I/O Buffer Information Specification Committee (IBIS) |Organization |Interest |Standard|Septembe|October|October|Novembe| | |Category |s Ballot|r19, |10, |31, |r 11, | | | |Voting |2008 |2008 |2008 |2008 | | | |Status | | | | | |Actel |Producer |Inactive| | | | | |Advanced Micro |Producer |Active |( |( |( | | |Devices | | | | | | | |Agilent |User |Inactive| | | |( | |Technologies | | | | | | | |Ansoft |User |Inactive| | | |( | |Apple Computer |User |Inactive| | | | | |Applied |User |Inactive| | | | | |Simulation | | | | | | | |Technology | | | | | | | |ARM |Producer |Inactive| | | | | |Cadence Design |User |Inactive| | | |( | |Systems | | | | | | | |Cisco Systems |User |Active |( |( |( |( | |Ericsson |Producer |Active | |( |( |( | |Freescale |Producer |Inactive| | | | | |Green Streak |General |Inactive| | | | | |Programs |Interest | | | | | | |Hitachi ULSI |Producer |Inactive| | | | | |Systems | | | | | | | |Huawei |User |Inactive| | | |( | |IBM |Producer |Active | |( |( | | |Infineon |Producer |Inactive| | | | | |Technologies AG | | | | | | | |Intel Corp. |Producer |Active |( | |( |( | |LSI |Producer |Inactive| | | | | |Marvell |Producer |Inactive| | | |( | |Semiconductor | | | | | | | |Mentor Graphics |User |Active |( |( | |( | |Micron |Producer |Active |( |( |( |( | |Technology | | | | | | | |Nokia Siemens |Producer |Active |( |( |( |( | |Networks | | | | | | | |Samtec |Producer |Inactive| | | | | |Signal Integrity|User |Active | |( | |( | |Software | | | | | | | |Sigrity |User |Inactive| | | |( | |Synopsys |User |Inactive| | | |( | |Teraspeed |General |Active |( |( |( |( | |Consulting |Interest | | | | | | |Texas |Producer |Active |( | |( | | |Instruments | | | | | | | |Toshiba |Producer |Inactive| | | | | |Xilinx |Producer |Active |( | |( |( | |ZTE |User |Inactive| | | |( | |Zuken |User |Inactive| | | | | Criteria for Member in good standing: • Must attend two consecutive meetings to establish voting membership • Membership dues current • Must not miss two consecutive Meetings Interest categories associated with GEIA ballot voting are: • Users - Members that utilize electronic equipment to provide services to an end user. • Producers - Members that supply electronic equipment. • General Interest - Members are neither producers nor users. This category includes, but is not limited to, Government, regulatory agencies (state and federal), researchers, other organizations and associations, and/or consumers.