EIA IBIS Open Forum Meeting Date: December 12, 2008 VOTING MEMBERS AND 2008 PARTICIPANTS Actel (Prabhu Mohan) Agilent Technologies Sanjeev Gupta, Radek Biernacki, Amolak Badesha Fangyi Rao, [Ian Dodd], Yutao Hu, Vuk Borich Nobutaka Arai, Ludwig Eichingner, Cheng-ming Ren, Xuliang Yuan, Jianping Zhu AMD Nam Nguyen*, Tadashi Arai Ansoft Corporation Steve Pytel, Ricardo Teliuteuesh, Dan Dvorscak, Steele Deng, Donny Hou, Baolong Li, Davis Yan, Long Yang, Song Zheng, Kazuhiro Kadota, Mitsuyo Kawata, Toru Watanabe Apple Computer (Bill Cornelius) Applied Simulation Technology (Fred Balistreri) ARM (Nirav Patel) Cadence Design Systems Terry Jernberg, Hemant Shah, Ambrish Varma [C. Kumar], Brad Griffin, Zhen Mu, Lanbing Chen, Wenliang Dai, Feng Li, Shirley Li, Jinbai Liu, Ping Liu, Yabao Meng, Jian (John) Peng, Jain Shan, Hui Wang, Yitong Wen, Yitong Wu, Dingru Xiao, Ke (Coco) Xu, Feng Yu, Rong Zhang, Wenjiang Zhang, Alex Zhao, George Zhou, Yukio Masuko, Morihiro Nakazato, Norikazu Takada Cisco Systems Syed Huq*, Mike LaBonte, AbdulRahman (Abbey) Rafiq Huyen Pham, Emily Yao, Susmita Mutsuddy John Fisher, Paul Ruddy, Jun Li, Jianmin Zhang Luis Boluna, Kelvin Qiu, Jane Lim, Ilyoung Park Rick Brooks, Chris Padilla, Ehsan Kabir, Jin (Leo) Hu, Weifeng Shu, Xinghai (Sean) Tang, Huihui (Iris) Zhao Ericsson Anders Ekholm* Freescale Jon Burnett Green Streak Programs Lynne Green Hitachi ULSI Systems Kazuyoshi Shoji, Shinmei Hirano, Shinji Itano, Sadahiro Nonoyama, Hiroshi Uematsu Huawei Technologies Tao Guan*, Xiaoqing Dong, Yu Chen, Jing Fu, Peng Huang, Jinjun Li, Bo Liu, Mongfang Lv, Shaokun Shen, Victor Wang, Shisheng Wu, Qilin Xu, Zhenlong Xu, Hang Ya, Zhou Yang, Wen Yu, Cheng Zhang, Gezhi Zhang, Yuehui Zhu IBM Adge Hawes* Infineon Technologies AG Christian Sporrer Intel Corporation Michael Mirmak*, Rich Mellitz, Wei-hsing Huang Vishram Pandit, Lili Deng, Haifeng Gong, Fanghui Li, Wenjie Mao, Yang Qu, Yiunglei Ren, Wayne Tsuchimoto, Yang Wu, Maoxin Yin, Xinjun Zhang, James Zhou, Nanditha Rao LSI [Frank Gasparik], Brian Burdick*, [Kim Helliwell] Marvell Semiconductor Jane Liu, Michael Wang, Yuyang Wang, Mentor Graphics Arpad Muranyi*, John Angulo, Minggang Hou, Jane Liao, Xuefeng Liu Micron Technology Randy Wolff* Nokia Siemens Networks GmbH Eckhard Lenski, Klaus Huebner, Katja Koller, Xianyun Wang Samtec Jim Nadolny, Justin McCalister Signal Integrity Software Mike Steinberger, Walter Katz*, Todd Westerhoff Doug Burns, Mike Mayer, Barry Katz Sigrity Sam Chitwood, Brad Brim, Ben Franklin Kristopher Stytte, Raymond Chen, Jiangsong Hu, Xianfeng Li, Tao (Helen) Xu Synopsys Ted Mido, Xuefeng Chen, Wenyun Gu, Jinghua Huang, Deng Shi Teraspeed Consulting Group Bob Ross*, Tom Dagostino, Al Neves Texas Instruments Richard Ward, Pavani Jella* Toshiba (I.S. Corporation) Yasumasa Kondo, Noriyasu Yoshikawa, Yoshihiro Hamaji, Atsushi Osaki Xilinx David Banas*, Ajay Shah, Suzanne Yiu Mustansir Fanaswalla Zuken Michael Schaeder, Ralf Bruening, Shigeru Hayashi, Hirohiko Matsuwawa ZTE Huifeng Chen, Xiaolin Chen, Jinku Guan, Hui Jiang, Nan Jiang, Shiju Sui, Zhiwei Yang, Shunlin Zhu OTHER PARTICIPANTS IN 2008 3M Kylin Chen, Shiang Yao Aeroflex Metelics David Nguyen AET Mikio Kiyono Aica Kogyo Akihiro Tanaka Alcatel-Lucent Haibo Wang Alcatel-Shell Weiping Chen, Feng Ji Altera Ravindra Gali, Jing Wu, John Oh, Hui Fu ATE Service Corporation Hideaki Endo, Yutaka Honda, Kevin Iida, Hiroyuik Itabashi, Kenji Kagawa Avago Technologies Minh Quach, Sari Tocco Bayside Design Elliot Nahas, Kevin Roselle Canon Seiji Hayashi, Shoji Matsumoto, Takamasa Sakuragi, Haruka Watanabe Celestica Ihsan Erdin, Shuxu Bao, Ricky Liu, Gloria Wang, Shengyu Wu, Molly Xu, Harrison Xue, Camilla Zhang, Van Zhu Cybernet Systems Golden Qian, Bill Wang, James Wang, David Xu Junko Kuriyama, Ryo Nakayama, Takayuki Tsuzura, Masato Yanagisawa ECL Advantage Thomas Iddings EFM Ekkehard Miersch Elma Bustronic Michael Munroe Exar Helen Nguyen Feng Hao Shanghai Information Zhengchang Gu Fiberhome Telecommunications Qian (Andy) Liao, Juan Liu, Elliotte Wan, Qi Zheng Flextronics Hasnain Syed Fujitsu Advanced Technology Shogo Fujimori, Hikoyuki Kawata, Toshiro Sato Fujitsu Limited (Digital Process) Masakatsu Kinjo, Kazumasa Kobayashi GEIA (Chris Denham) Golden Bridge Networks Saman Sadigh Hisense Electronic Haishi Hu Huawei-3Com Wei Yang ICT Solutions Steven Wong IDT Newave Zhiguang Li Interface Technologies Dan Waterloo Inventec Corporation Leonardo Huang, Zhong Peng IO Methodology Lance Wang, Zhi (Benny) Yan, Li (Kathy) Chen, Seana Tong, Salvia Yu, Zhangmin Zhong, Edwin Zhu JEITA Atsushi Ishikawa, Hideo Kogure Kawasaki Microelectronics Hajime Kinugasa, Hiroyuki Sato KEI Systems Shinichi Maeda Magma DA Anand Ramalingam Meds IC Solutions Xinhua Zhang Nanjing Nari-Relays Tao Wang, Yu Xia NEC Takeshi Watanabe, Itsuki Yamada NetLogic Microsystems Eric Hsu North Carolina State University Paul Franzon Nokia Ali Arsian Nuova Systems Zhiping Yang Nvidia Corporation Baal Yang, Tibet Zhao Prentice Hall Bernard Goodwin Physware Marc Kowalski Politecnio di Torino Igor Stievano Qimonda AG Md Morshed Alam Heial, Suhas Jawale Radisys Ling Li, Guo Tang Ricoh Yuji Maeno Shanghai University Shipeng Liu Siemens AG Manfred Maurer, Annika Woehner Simberian Yuriy Shlepnev SimLab Software GmbH Heiko Grubrich Sony Toshiro Honda, Iguchi Yasuhiko Sony EMC Corporation Takeshi Osanai TDK Yoshikazu Fujishiro Tektronix Steve Corey, Xin Wu TietoEnator GmbH Heinz-Hartmut Ibowski Trident Multimedia Technologies Xiagin Cao, Jeffery He Tyco Electronics Chad Morgan Universal Scientific Industrial Lurker Li, Spenser Tang VeriSilicon Microelectronics Qiang Chen, Steven Gou, Zhiying Yuan Vertical Circuits Mark Egbers Victor Corporation of Japan (JVC) Manabu Matsumoto Winwin Corporation Haiphe Lau, Linfa Liu Xsigo Systems Robert Bada Zuken Support and Service Seikou Go, Yoshiaki Nishi, Tomotaka Unose, Yin Yi Independent Guy de Burgh, Ardy Forouhar, Dave Galloi Kazuhiko Kusunoki In the list above, attendees at the meeting are indicated by *. Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS The bridge numbers for future IBIS teleconferences are as follows: Date Telephone Number Meeting ID January 9, 2009 1-866-432-9903 121006125 All meetings are 8:00 AM to 9:55 AM US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. When calling into the meeting, press 1 to attend the meeting, then follow the prompts to enter the meeting ID. For new, local international dial-in numbers, please reference the bridge numbers provided by Cisco Systems at the following link: http://www.cisco.com/web/about/doing_business/conferencing/index.html NOTE: "AR" = Action Required. ---------------------------------------------------------------------------- --------------------------------------------------- INTRODUCTIONS AND MEETING QUORUM No new members. CALL FOR PATENTS Michael Mirmak called for any patents or pending patents related to the IBIS Version 3.2, 4.0, 4.1, 4.2, or ICM 1.1 specifications. No patents were declared. MEMBERSHIP UPDATE AND TREASURER'S REPORT Michael Mirmak reported that we will close the year with 32 members. We have more revenues than income for the year. We need to spend it by the end of the year or we lose the extra money, about $4500. We will discuss this later in the meeting. REVIEW OF MINUTES AND ARS Michael Mirmak called for comments regarding the minutes of the November 11, 2008 Asian IBIS summit in China, the November 14, 2008 Asian IBIS Summit meeting in Japan and the November 21, 2008 IBIS Open Forum teleconference. All three sets of minutes were approved without changes. WEB PAGE UPDATES Syed Huq reported that a new LSI logo was sent to ITAA for upload on the poster page. MAILING LIST ADMINISTRATION Bob Ross reported that everything is working normally. MODEL LIBRARY UPDATE No update. PRESS UPDATE No update. MISCELLANY/ANNOUNCEMENTS No update. OPENS FOR NEW ISSUES Syed Huq requested time for a discussion on RSS implementation for the web page. Bob Ross noted the announcement of a merger between ITAA and AeA. Michael Mirmak said that this merger will create the Technology Association of America. The new association will represent about 2,000 member companies. New offices in Beijing and Brussels may be useful to us. We may be reorganized next year under a different group than GEIA. A news article about the merger can be found at: http://www.eetimes.com/showArticle.jhtml?articleID=212300401&cid=NL_eet INTERNATIONAL/EXTERNAL PROGRESS - DASC Michael Mirmak reported that there have been no meetings lately. The next meeting is December 18, 2008. The DASC file and e-mail archive may be found at: http://www.dasc.org/ - P1735 Encryption Syed Huq reported that meetings are on Mondays, 8:00 AM PT. He has conflicts with this time, but will try to get updates regardless. The IEEE DASC Study Group on Encryption web reflector archives are found at: http://www.eda-stds.org/ip-encrypt/hm/ - GEIA/ITAA Issues Bob Ross mentioned that we need to redesign our IBIS logo. A graphic artist friend of Bob created a few logos. These show IBIS in different fonts and carry through the white IBIS bird graphic. Michael explained that the logo needs to be updated to remove the EIA reference and to have a higher resolution logo than we do currently. Arpad Muranyi wondered if the bird was really a good part of the logo, although people are used to seeing the bird in the logo. He also wanted to make sure that the logo would print well in color, black and white, and look good against different color backgrounds. Bob Ross noted that there are two upcoming conferences that include Signal Integrity and Power Integrity topics. Information on these is below. The 13th IEEE Workshop on Signals Propagation on Interconnects is May 12- 15, 2009 in Strasbourg, France. The call for papers deadline is February 7, 2009. http://spi.univ-brest.fr The 7th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO 2009) is November 17-20, 2009 in Toulouse, France. The call for papers deadline is May 30, 2009. http://www.emccompo.org IEC APPROVAL ACTIVITIES Randy Wolff reported that he and Michael Mirmak talked with Chris Denham of GEIA about IEC approval. Chris advised that he has an agreement with IEC that allows IEC to have a copyright on international standards while maintaining the copyright for the GEIA/ANSI version of the same standard. He mentioned that the IEEE has a dual logo agreement with IEC, and this would be the preferred method of bringing our standard into the IEC process. It is also very important to try to maintain control of our standard through the IEC approval process if we go forward with it. Bob Ross mentioned that IEC members may want to make comments, but he is not worried about the IEC wanting to make changes to IBIS. David Banas asked if we are worried about issues in packaging in IBIS being a concern to IEC. Bob said he would be more interested in the dual logo process. David is more concerned with abandonment of the specification than it getting changed. Michael Mirmak mentioned that there are concerns with overseas members needing an international standard in some cases. Randy asked Bob if the IBIS 3.2 approval went smoothly, or if were there major editorials. Bob remembered it being a fast track process but wasn’t sure if those editorials resulted in any changes to the IEC document. Randy took the AR to continue discussions with GEIA and IEC and push the idea of the dual logo process. SUMMIT STATUS - DesignCon Planning The DesignCon event is scheduled for February 2-5, 2009 at the Santa Clara Convention Center in Santa Clara, California. Thursday, February 5, 2009 is scheduled for the summit. Michael Mirmak noted that the first call for papers will go out after the meeting. Other announcements will follow a 2- week release schedule. Michael showed a map of the convention center to show our room location. This year the summit will be in the main classroom area, rooms 209-210. We should see more foot traffic. We will need to arrange for booth transportation if we move forward with the booth in the exhibit area. Sponsorship opportunities for all upcoming IBIS summits are available, with sponsors receiving free mentions in the minutes, agenda, and other announcements. Contact the IBIS Board for further details. IBIS QUALITY TASK GROUP Bob Ross reported that the group continued on section 6, discussing whether this section includes checklist items or just advisory items. There are more topics to discuss in section 7, the last section to review. The Quality Task Group checklist and other documentation can be found at: http://www.eda-stds.org/ibis/quality_wip/ IBIS MODEL REVIEW TASK GROUP No update. ADVANCED TECHNOLOGY MODELING TASK GROUP Arpad Muranyi reported that the group is discussing a complete IBIS overhaul and sketching out ideas and plans for what it would look like if we did it. The group is making lists of things that need to be fixed to make it more useful and extend it to new technologies and cover simulation needs of IBIS users. He wondered if discussion should continue in the ATM group or if it should be handled by a new committee. He encouraged participation and comments. Task group material can be found at: http://www.eda-stds.org/ibis/macromodel_wip/ AD HOC TASK GROUPS (INTERCONNECT) Michael Mirmak reported that the last meeting of the year is next Wednesday. The group has settled out major technical and keyword issues. They are looking over a final draft for editorial comments and should have a final document to vote on soon. Task group material can be found at: http://www.eda.org/ibis/adhoc/interconnect/ 2008 BUDGET CLOSURE Michael Mirmak reported that we have about $4500 of extra revenue for 2008. This must be allocated by January 12, 2009 or we lose it. Some options include pre-payment of DesignCon IBIS Summit expenses ($4000), new logo development ($500-$1000), BUG fixes to IBISCHK4 and IBIS DesignCon booth expenses ($500). The IBIS booth at DesignCon requires additional expenses this year, and we have all the information on these costs. Syed Huq asked about funding for the IBISCHK5 parser. Michael responded that we need about 6 weeks to finish the bidding process, so we don’t have enough time for this. Bob Ross thinks that if we do not get significant sponsorship for DesignCon, then we should prepay up to $4000 for the summit and cancel the booth. Bob felt we should also look at prepaying the logo development. Arpad Muranyi asked if we could prepay DesignCon with all the money we have and get a refund later if we go over. This might be an option. Also, Bob mentioned prepaying for a GEIA representative to attend the DAC IBIS summit. The board will discuss this further offline, and a vote if required will happen during the January 9, 2009 teleconference. NEW ISSUES Syed Huq explained that Really Simple Syndication (RSS) allows us to setup an RSS feed on our webpage that alerts viewers to changes on the website page. GEIA wants to wait until the mergers are completed to see if RSS is a feature that can be supported across the organization. Michael Mirmak felt that this would be a good addition to the website. Syed will keep the group updated on any progress. BIRD111.1: EXTENDED USAGE OF EXTERNAL SERIES COMPONENTS IN EBDS Bob Ross noted that no further work has been done on this yet. Walter Katz had asked about adding comments about handling differential nets, and Bob needs to review this. IBISCHK5 PARSER STATUS Michael Mirmak showed a draft parser development contract. The debate is still open on whether code should be included for AMI file parsing. Bob Ross mentioned that we may need to have a pay-as-you-go approach to funding. Critical items need to be funded first. IBISCHK4 BUG STATUS Michael Mirmak reported that two BUGs are open right now and there is a potential one related to BIRD106. There are no plans to fix these in the near term. The BUG report list is available at the link below: http://www.eda.org/ibis/bugs/ibischk/ ICMCHK1 BUG STATUS John Angulo looked into the code further, and a new update should be able to be released in about a week. NEW ISSUES Bob Ross mentioned that all member companies should have received invoices for 2009 dues. These can be paid at any time without affecting our budgeting. NEXT MEETING The next IBIS Open Forum teleconference will be held January 9, 2009 from 8:00 AM to 10:00 AM US Pacific Standard Time. ======================================================================== NOTES IBIS CHAIR: Michael Mirmak (916) 356-4261, Fax: (916) 377-3788 michael.mirmak@intel.com Server Platform Technical Marketing Engineer, Intel Corporation FM5-239 1900 Prairie City Rd. Folsom, CA 95630 VICE CHAIR: Syed Huq (408) 525-3399, Fax: (408) 526-5504 shuq@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA 95134-1706 SECRETARY: Randy Wolff (208) 363-1764, Fax: (208) 368-3475 rrwolff@micron.com SI Modeling Manager, Micron Technology, Inc. 8000 S. Federal Way Mail Stop: 01-711 Boise, ID 83707-0006 LIBRARIAN: Lance Wang (978) 633-3388 lwang@iometh.com President / CEO, IO Methodology, Inc. PO Box 2099 Acton, MA 01720 WEBMASTER: Syed Huq (408) 525-3399, Fax: (408) 526-5504 huqs@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA 95134-1706 POSTMASTER: Bob Ross (503) 246-8048, Fax : (503) 239-4400 bob@teraspeed.com Staff Scientist, Teraspeed Consulting Group 10238 SW Lancaster Road Portland, OR 97219 This meeting was conducted in accordance with the GEIA Legal Guides and GEIA Manual of Organization and Procedure. The following e-mail addresses are used: majordomo@eda.org In the body, for the IBIS Open Forum Reflector: subscribe ibis In the body, for the IBIS Users' Group Reflector: subscribe ibis-users Help and other commands: help ibis-request@eda.org To join, change, or drop from either or both: IBIS Open Forum Reflector (ibis@eda.org) IBIS Users' Group Reflector (ibis-users@eda.org) State your request. ibis-info@eda.org To obtain general information about IBIS, to ask specific questions for individual response, and to inquire about joining the EIA-IBIS Open Forum as a full Member. ibis@eda.org To send a message to the general IBIS Open Forum Reflector. This is used mostly for IBIS Standardization business and future IBIS technical enhancements. Job posting information is not permitted. ibis-users@eda.org To send a message to the IBIS Users' Group Reflector. This is used mostly for IBIS clarification, current modeling issues, and general user concerns. Job posting information is not permitted. ibis-bug@eda.org To report ibischk parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/bugs/ibischk/ http://www.eda.org/ibis/bugs/ibischk/bugform.txt icm-bug@eda.org To report icmchk1 parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/icm_bugs/ http://www.eda.org/ibis/icm_bugs/icm_bugform.txt To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which reside at: http://www.eda.org/ibis/bugs/s2ibis/bugs2i.txt http://www.eda.org/ibis/bugs/s2ibis2/bugs2i2.txt http://www.eda.org/ibis/bugs/s2iplt/bugsplt.txt Information on IBIS technical contents, IBIS participants and actual IBIS models are available on the IBIS Home page: http://www.eigroup.org/ibis/ibis.htm Check the IBIS file directory on eda.org for more information on previous discussions and results: http://www.eda.org/ibis/directory.html Other trademarks, brands and names are the property of their respective owners. GEIA STANDARDS BALLOT VOTING STATUS I/O Buffer Information Specification Committee (IBIS) |Organization |Interest |Standard|November|Novembe|Novembe|Decembe| | |Category |s Ballot|11, 2008|r 14, |r 21, |r 12, | | | |Voting | |2008 |2008 |2008 | | | |Status | | | | | |Actel |Producer |Inactive| | | | | |Advanced Micro |Producer |Active | |( |( |( | |Devices | | | | | | | |Agilent |User |Inactive|( | | | | |Technologies | | | | | | | |Ansoft |User |Inactive|( |( | | | |Apple Computer |User |Inactive| | | | | |Applied |User |Inactive| | | | | |Simulation | | | | | | | |Technology | | | | | | | |ARM |Producer |Inactive| | | | | |Cadence Design |User |Inactive|( |( | | | |Systems | | | | | | | |Cisco Systems |User |Active |( | |( |( | |Ericsson |Producer |Active |( |( |( |( | |Freescale |Producer |Inactive| | | | | |Green Streak |General |Inactive| | | | | |Programs |Interest | | | | | | |Hitachi ULSI |Producer |Inactive| |( | | | |Systems | | | | | | | |Huawei |User |Active |( | |( |( | |IBM |Producer |Active | | |( |( | |Infineon |Producer |Inactive| | | | | |Technologies AG | | | | | | | |Intel Corp. |Producer |Active |( |( |( |( | |LSI |Producer |Active | | |( |( | |Marvell |Producer |Inactive|( | | | | |Semiconductor | | | | | | | |Mentor Graphics |User |Active |( | |( |( | |Micron |Producer |Active |( |( |( |( | |Technology | | | | | | | |Nokia Siemens |Producer |Active |( | |( | | |Networks | | | | | | | |Samtec |Producer |Inactive| | | | | |Signal Integrity|User |Active |( | |( |( | |Software | | | | | | | |Sigrity |User |Inactive|( | | | | |Synopsys |User |Inactive|( | | | | |Teraspeed |General |Active |( |( |( |( | |Consulting |Interest | | | | | | |Texas |Producer |Inactive| | | |( | |Instruments | | | | | | | |Toshiba |Producer |Inactive| |( | | | |Xilinx |Producer |Active |( |( |( |( | |ZTE |User |Inactive|( | | | | |Zuken |User |Inactive| |( | | | Criteria for Member in good standing: • Must attend two consecutive meetings to establish voting membership • Membership dues current • Must not miss two consecutive Meetings Interest categories associated with GEIA ballot voting are: • Users - Members that utilize electronic equipment to provide services to an end user. • Producers - Members that supply electronic equipment. • General Interest - Members are neither producers nor users. This category includes, but is not limited to, Government, regulatory agencies (state and federal), researchers, other organizations and associations, and/or consumers.