ITAA IBIS Open Forum Meeting Date: January 30, 2009 VOTING MEMBERS AND 2009 PARTICIPANTS Actel (Prabhu Mohan) Agilent Technologies (Sanjeev Gupta) AMD (Jonathan Dowling) Ansoft Corporation (Eldon Staggs) Apple Computer (Matt Herndon) Applied Simulation Technology (Fred Balistreri) ARM (Nirav Patel) Cadence Design Systems (Terry Jernberg) Cisco Systems Syed Huq*, Mike LaBonte Ericsson (Anders Ekholm) Freescale (Jon Burnett) Green Streak Programs (Lynne Green) Hitachi ULSI Systems (Kazuyoshi Shoji) Huawei Technologies (Jiang XiangZhong) IBM Adge Hawes* Infineon Technologies AG (Christian Sporrer) Intel Corporation Michael Mirmak* LSI Brian Burdick* Marvell Semiconductor (Itzik Peleg) Mentor Graphics Arpad Muranyi* Micron Technology Randy Wolff* Nokia Siemens Networks GmbH Eckhard Lenski* Samtec (Corey Kimble) Signal Integrity Software Walter Katz* Sigrity Sam Chitwood* Synopsys (Andy Tai) Teraspeed Consulting Group Bob Ross* Texas Instruments Pavani Jella Toshiba (I.S. Corporation) (Yasumasa Kondo) Xilinx David Banas* Zuken (Michael Schaeder) ZTE (Ying Xiong) OTHER PARTICIPANTS IN 2009 GEIA (Chris Denham) IO Methodology Lance Wang* In the list above, attendees at the meeting are indicated by *. Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS The bridge numbers for future IBIS teleconferences are as follows: Date Telephone Number Meeting ID February 5, 2009 -- IBIS Summit at DesignCon; no teleconference -- February 20, 2009 1-866-432-9903 121836136 All meetings are 8:00 AM to 9:55 AM US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. When calling into the meeting, press 1 to attend the meeting, then follow the prompts to enter the meeting ID. For new, local international dial-in numbers, please reference the bridge numbers provided by Cisco Systems at the following link: http://www.cisco.com/web/about/doing_business/conferencing/index.html NOTE: "AR" = Action Required. ---------------------------------------------------------------------------- --------------------------------------------------- INTRODUCTIONS AND MEETING QUORUM No new members. CALL FOR PATENTS Michael Mirmak called for any patents or pending patents related to the IBIS Version 3.2, 4.0, 4.1, 4.2, or ICM 1.1 specifications. No patents were declared. MEMBERSHIP UPDATE AND TREASURER'S REPORT Michael Mirmak reported that we closed out last year with 32 paid members. Let the board know if you have not received a notification for renewals for 2009. All the items approved at the last meeting for spending did get paid by GEIA. We should get November and December updates from GEIA in the next few weeks. REVIEW OF MINUTES AND ARS Michael Mirmak called for comments regarding the minutes of the January 9, 2009 IBIS Open Forum teleconference. The minutes were approved without changes. WEB PAGE UPDATES Syed Huq reported that the Infineon logo was updated on the poster page. Syed will check if ST Microelectronics is listed with member status as they should not be. MAILING LIST ADMINISTRATION Bob Ross reported that everything is working normally. MODEL LIBRARY UPDATE Lance Wang reported that he plans to do a scan of the library soon. Let him know if you see any broken links or additions. PRESS UPDATE None. MISCELLANY/ANNOUNCEMENTS No update. OPENS FOR NEW ISSUES Bob Ross asked that DATE summit planning be added to the agenda. INTERNATIONAL/EXTERNAL PROGRESS - DASC Michael Mirmak reported that there was a meeting on December 18, 2008. There were no issues discussed of relevance to IBIS. The DASC file and e-mail archive may be found at: http://www.dasc.org/ - P1735 Encryption No update. The IEEE DASC Study Group on Encryption web reflector archives are found at: http://www.eda-stds.org/ip-encrypt/hm/ - GEIA/ITAA Issues There have been no merger updates. We are expecting an update from Chris Denham at the DAC meeting. Bob Ross reported about logo issues. We need to narrow down our selection before the logo developer proceeds. He wanted to wait to see what the new AeA/ITAA logos will be. We will need to see if there are any new logo rules after the merger. Bob Ross noted that there are two upcoming conferences that include Signal Integrity and Power Integrity topics. Information on these is below. The 13th IEEE Workshop on Signals Propagation on Interconnects is May 12- 15, 2009 in Strasbourg, France. The call for papers deadline is February 7, 2009. http://spi.univ-brest.fr The 7th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO 2009) is November 17-20, 2009 in Toulouse, France. The call for papers deadline is May 30, 2009. http://www.emccompo.org IEC APPROVAL ACTIVITIES Randy Wolff reported that the IEC approval discussion will be set back by a couple of months until Chris Denham returns to work. Michael Mirmak wondered if anything changes with our standards accreditation status after the merger. SUMMIT STATUS - DesignCon Planning The DesignCon event is scheduled for February 2-5, 2009 at the Santa Clara Convention Center in Santa Clara, California. Thursday, February 5, 2009 is scheduled for the summit. The meeting room is in the main convention center in rooms 209-210. Syed Huq is the main contact for the event. Register if you plan to attend. The final announcement went out on the reflectors yesterday. The deadline for presentation submittals has passed. Michael Mirmak thanked Cisco for helping with arrangements and the luncheon. We have cancelled the IBIS booth due to logistics. -DATE Planning Ralf Bruening of Zuken has been organizing the event. It is scheduled for Thursday morning, April 23, 2009. Agilent, Sigrity and Zuken are the current sponsors. Several paper presentations are already planned. -DAC Planning DAC is scheduled for July 26-31, 2009 in San Francisco. We plan to have representation from GEIA at the event to explain the new parent organization. Sponsorship opportunities for all upcoming IBIS summits are available, with sponsors receiving free mentions in the minutes, agenda, and other announcements. Contact the IBIS Board for further details. IBIS QUALITY TASK GROUP David Banas reported that the group is reviewing section 5.4 and is also reviewing sections 6 and 7. Section 5.4 discusses requirements of having a minimum number of V-t tables in a model. They are discussing how to include cautionary statements to help with improving quality while also not preventing a model from reaching a certain quality level of the specification. Section 7 is the correlation section. Roy Leventhal and David have both contributed to writing this section, and it will be discussed next. The Quality Task Group checklist and other documentation can be found at: http://www.eda-stds.org/ibis/quality_wip/ IBIS MODEL REVIEW TASK GROUP No update. ADVANCED TECHNOLOGY MODELING TASK GROUP Arpad Muranyi reported that the group got approval from Synopsys to use elements from their documentation to help develop an IBIS Interconnect SPICE language. The group is developing this document now but will not have a meeting next week. Task group material can be found at: http://www.eda-stds.org/ibis/macromodel_wip/ AD HOC TASK GROUPS (INTERCONNECT) Michael Mirmak reported that the group is finishing the Touchstone 2 draft and is on draft 15, making editorial changes. There is no meeting next week. They are only planning for one more draft before submitting it to this committee for approval. Task group material can be found at: http://www.eda.org/ibis/adhoc/interconnect/ NEW ISSUES None. BIRD111.1: EXTENDED USAGE OF EXTERNAL SERIES COMPONENTS IN EBDS Bob Ross reported that he has not made any further progress on reviewing the BIRD yet, but he plans to spend more time on this BIRD after DesignCon. IBISCHK5 PARSER STATUS Michael Mirmak showed a draft bid packet. This scopes out individual portions of the development. It splits the job into two parts, one to address the BIRDs, the second to address AMI parameter files. Randy Wolff mentioned adding to the bid packet an item for error and warning numbers to be added to the parser. We should add this as a separate bid item and determine later if we will have funds to support it. Bob Ross noted that there has been discussion of modularizing the code – cleaning it up and updating it. Bob felt that we do not have time to have this be part of the current parser, as the project needs to get started right away. Michael suggested we have the bid process finished by March 1. The bid packet will be released with the suggested changes very soon. TOUCHSTONE 2.0 DISCUSSION (TENTATIVE) This item will be discussed during the next teleconference meeting in three weeks. IBISCHK4 BUG STATUS Michael Mirmak reported that two BUGs are open right now and there is a potential one related to BIRD106. There are no plans to fix these in the near term, as they are not included in the IBISCHK5 parser development. The BUG report list is available at the link below: http://www.eda.org/ibis/bugs/ibischk/ ICMCHK1 BUG STATUS ICMCHK1 version 1.1.3 has been released. The executables can be downloaded. Licensees can get the source code. Michael Mirmak thanked John Angulo for his help in the development and Kelly Green for his assistance. ICM BUG4 is now considered closed with the parser update. NEW ISSUES None. NEXT MEETING The next IBIS Open Forum Summit will be held February 5, 2009 at DesignCon in Santa Clara, California. The next IBIS Open Forum teleconference will be held February 20, 2009 from 8:00 AM to 10:00 AM US Pacific Standard Time. ======================================================================== NOTES IBIS CHAIR: Michael Mirmak (916) 356-4261, Fax: (916) 377-3788 michael.mirmak@intel.com Server Platform Technical Marketing Engineer, Intel Corporation FM5-239 1900 Prairie City Rd. Folsom, CA 95630 VICE CHAIR: Syed Huq (408) 525-3399, Fax: (408) 526-5504 shuq@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA 95134-1706 SECRETARY: Randy Wolff (208) 363-1764, Fax: (208) 368-3475 rrwolff@micron.com SI Modeling Manager, Micron Technology, Inc. 8000 S. Federal Way Mail Stop: 01-711 Boise, ID 83707-0006 LIBRARIAN: Lance Wang (978) 633-3388 lwang@iometh.com President / CEO, IO Methodology, Inc. PO Box 2099 Acton, MA 01720 WEBMASTER: Syed Huq (408) 525-3399, Fax: (408) 526-5504 huqs@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA 95134-1706 POSTMASTER: Bob Ross (503) 246-8048, Fax : (503) 239-4400 bob@teraspeed.com Staff Scientist, Teraspeed Consulting Group 10238 SW Lancaster Road Portland, OR 97219 This meeting was conducted in accordance with the GEIA Legal Guides and GEIA Manual of Organization and Procedure. The following e-mail addresses are used: majordomo@eda.org In the body, for the IBIS Open Forum Reflector: subscribe ibis In the body, for the IBIS Users' Group Reflector: subscribe ibis-users Help and other commands: help ibis-request@eda.org To join, change, or drop from either or both: IBIS Open Forum Reflector (ibis@eda.org) IBIS Users' Group Reflector (ibis-users@eda.org) State your request. ibis-info@eda.org To obtain general information about IBIS, to ask specific questions for individual response, and to inquire about joining the EIA-IBIS Open Forum as a full Member. ibis@eda.org To send a message to the general IBIS Open Forum Reflector. This is used mostly for IBIS Standardization business and future IBIS technical enhancements. Job posting information is not permitted. ibis-users@eda.org To send a message to the IBIS Users' Group Reflector. This is used mostly for IBIS clarification, current modeling issues, and general user concerns. Job posting information is not permitted. ibis-bug@eda.org To report ibischk parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/bugs/ibischk/ http://www.eda.org/ibis/bugs/ibischk/bugform.txt icm-bug@eda.org To report icmchk1 parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/icm_bugs/ http://www.eda.org/ibis/icm_bugs/icm_bugform.txt To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which reside at: http://www.eda.org/ibis/bugs/s2ibis/bugs2i.txt http://www.eda.org/ibis/bugs/s2ibis2/bugs2i2.txt http://www.eda.org/ibis/bugs/s2iplt/bugsplt.txt Information on IBIS technical contents, IBIS participants and actual IBIS models are available on the IBIS Home page: http://www.eigroup.org/ibis/ibis.htm Check the IBIS file directory on eda.org for more information on previous discussions and results: http://www.eda.org/ibis/directory.html Other trademarks, brands and names are the property of their respective owners. GEIA STANDARDS BALLOT VOTING STATUS I/O Buffer Information Specification Committee (IBIS) |Organization |Interest |Standard|November|Decembe|January|January| | |Category |s Ballot|21, 2008|r 12, |9, 2009|30, | | | |Voting | |2008 | |2009 | | | |Status | | | | | |Actel |Producer |Inactive| | | | | |Advanced Micro |Producer |Inactive|( |( | | | |Devices | | | | | | | |Agilent |User |Inactive| | | | | |Technologies | | | | | | | |Ansoft |User |Inactive| | | | | |Apple Computer |User |Inactive| | | | | |Applied |User |Inactive| | | | | |Simulation | | | | | | | |Technology | | | | | | | |ARM |Producer |Inactive| | | | | |Cadence Design |User |Inactive| | | | | |Systems | | | | | | | |Cisco Systems |User |Active |( |( |( |( | |Ericsson |Producer |Inactive|( |( | | | |Freescale |Producer |Inactive| | | | | |Green Streak |General |Inactive| | | | | |Programs |Interest | | | | | | |Hitachi ULSI |Producer |Inactive| | | | | |Systems | | | | | | | |Huawei |User |Inactive|( |( | | | |IBM |Producer |Active |( |( | |( | |Infineon |Producer |Inactive| | | | | |Technologies AG | | | | | | | |Intel Corp. |Producer |Active |( |( |( |( | |LSI |Producer |Active |( |( |( |( | |Marvell |Producer |Inactive| | | | | |Semiconductor | | | | | | | |Mentor Graphics |User |Active |( |( |( |( | |Micron |Producer |Active |( |( |( |( | |Technology | | | | | | | |Nokia Siemens |Producer |Active |( | |( |( | |Networks | | | | | | | |Samtec |Producer |Inactive| | | | | |Signal Integrity|User |Active |( |( | |( | |Software | | | | | | | |Sigrity |User |Active | | |( |( | |Synopsys |User |Inactive| | | | | |Teraspeed |General |Active |( |( |( |( | |Consulting |Interest | | | | | | |Texas |Producer |Active | |( |( | | |Instruments | | | | | | | |Toshiba |Producer |Inactive| | | | | |Xilinx |Producer |Active |( |( |( |( | |ZTE |User |Inactive| | | | | |Zuken |User |Inactive| | | | | Criteria for Member in good standing: • Must attend two consecutive meetings to establish voting membership • Membership dues current • Must not miss two consecutive Meetings Interest categories associated with GEIA ballot voting are: • Users - Members that utilize electronic equipment to provide services to an end user. • Producers - Members that supply electronic equipment. • General Interest - Members are neither producers nor users. This category includes, but is not limited to, Government, regulatory agencies (state and federal), researchers, other organizations and associations, and/or consumers.