IBIS Open Forum Minutes Meeting Date: February 20, 2009 VOTING MEMBERS AND 2009 PARTICIPANTS Actel (Prabhu Mohan) Agilent Technologies Yutao Hu, Fangyi Rao AMD Nam Nguyen* Ansoft Corporation Steve Pytel* Apple Computer (Matt Herndon) Applied Simulation Technology (Fred Balistreri) ARM V. Muniswara Reddy* Cadence Design Systems Terry Jernberg, Ambrish Varma Cisco Systems Luis Boluna, Tram Bui, Bill Chen, Syed Huq*, Mike LaBonte, Pedo Miran Huyen Pham, AbdulRahman (Abbey) Rafiq, Ashwin Vasudevan, Zhiping Yang Ericsson Anders Ekholm* Freescale Jon Burnett, Om Mandhama Green Streak Programs Lynne Green* Hitachi ULSI Systems (Kazuyoshi Shoji) Huawei Technologies Xiaoqing Dong, Chunxing Huang IBM Adge Hawes* Infineon Technologies AG (Christian Sporrer) Intel Corporation Michael Mirmak*, Jon Powell, Sirisha Prayaga LSI Brian Burdick* Marvell Semiconductor (Itzik Peleg) Mentor Graphics Weston Beal, Vladimir Dmitriev-Zdorov, Zhen Mu, Arpad Muranyi* Micron Technology Randy Wolff* Nokia Siemens Networks GmbH Eckhard Lenski* Samtec (Corey Kimble) Signal Integrity Software Barry Katz, Walter Katz*, Todd Westerhoff* Sigrity Sam Chitwood Synopsys Ted Mido Teraspeed Consulting Group Bob Ross* Texas Instruments Pavani Jella* Toshiba (I.S. Corporation) (Yasumasa Kondo) Xilinx David Banas ZTE (Ying Xiong) Zuken (Michael Schaeder) OTHER PARTICIPANTS IN 2009 AET Mikio Kiyono Bayside Design Stephen Coe, Elliot Nahas Circuit Spectrum Zaven Tashjian CST Antonio Ciccomancini, Martin Schauem Curtiss-Wright Embedded Computing J. Phillips EM Integrity Guy de Burgh Exar Helen Nguyen GEIA (Chris Denham) IO Methodology Li (Kathy) Chen, Lance Wang*, Zhi (Benny) Yan Juniper Kevin Ko Leventhal Design & Communications Roy Leventhal Mindspeed Technologies Bobby Alkay NetLogic Microsystems Eric Hsu Sanmina SCI Vladimir Drivanenko Sedona International Joe Socha Signal Consulting Group Timothy Coyle, Nicole Mitchell Simberian Yuriy Shlepnev Xsigo Systems Robert Badel Independent Ian Dodd In the list above, attendees at the meeting are indicated by *. Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS The bridge numbers for future IBIS teleconferences are as follows: Date Telephone Number Meeting ID March 13, 2009 1-866-432-9903 121217376 April 23, 2009 -- IBIS Summit at DATE; no teleconference -- All meetings are 8:00 AM to 9:55 AM US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. When calling into the meeting, press 1 to attend the meeting, then follow the prompts to enter the meeting ID. For new, local international dial-in numbers, please reference the bridge numbers provided by Cisco Systems at the following link: http://www.cisco.com/web/about/doing_business/conferencing/index.html NOTE: "AR" = Action Required. ---------------------------------------------------------------------------- --------------------------------------------------- INTRODUCTIONS AND MEETING QUORUM No new members. CALL FOR PATENTS Michael Mirmak called for any patents or pending patents related to the IBIS Version 3.2, 4.0, 4.1, 4.2, or ICM 1.1 specifications. No patents were declared. MEMBERSHIP UPDATE AND TREASURER'S REPORT Michael Mirmak noted that members should let the board know if they have not received a notification for renewals for 2009. We have not received any end of the year status on financials. REVIEW OF MINUTES AND ARS Michael Mirmak called for comments regarding the minutes of the January 30, 2009 IBIS Open Forum teleconference. The minutes were approved without changes. WEB PAGE UPDATES Syed Huq reported that the Infineon logo was updated on the poster page, Ansoft contact information was updated on the roster page, and the events page was updated to remove the DesignCon summit. MAILING LIST ADMINISTRATION Bob Ross reported that everything is working normally. MODEL LIBRARY UPDATE Lance Wang reported that he has not updated the library yet, but he will check in 1-2 weeks for broken links. PRESS UPDATE Bob Ross mentioned three mentions of IBIS in the press. A recently published book includes a section on basic IBIS. The book is “Signal Integrity and Radiated Emission of High-Speed Digital Systems” by Spartaco Caniggia and Francescaromana Maradei, 2008, Wiley. The book can be found at: http://www.amazon.com/s/ref=nb_ss_gw?url=search- alias%3Dstripbooks&field- keywords=%22signal+integrity+and+radiated+emission%22&x=19&y=18 An article covering a DesignCon discussion panel mentions that SerDes AMI models are not widely available yet a year after addition to the IBIS specification. The article is "Signal Integrity Issues Dog High-Speed Design" by Rick Merritt, EE Times, February 3, 2009. The article can be found at: http://eetimes.eu/design/showArticle.jhtml?articleID=213000730&printabl e=true An article covers choices of simulation models including IBIS and IBIS AMI. The article is "Simulation: The Need for Speed" by Tim Coyle in Printed Circuit Design & Fab, February 2009. The article can be found at: http://pcdandf.com/cms/cms/content/view/5805/95/ MISCELLANY/ANNOUNCEMENTS No update. OPENS FOR NEW ISSUES Michael Mirmak noted that a Touchstone 2.0 introduction was added to the agenda. INTERNATIONAL/EXTERNAL PROGRESS - DASC Michael Mirmak reported that there was a meeting on February 19, 2008. There were no issues discussed of relevance to IBIS. The DASC file and e-mail archive may be found at: http://www.dasc.org/ - P1735 Encryption No update. The IEEE DASC Study Group on Encryption web reflector archives are found at: http://www.eda-stds.org/ip-encrypt/hm/ - GEIA/ITAA Issues Bob Ross noted that the organization resulting from the ITAA/AeA merger is officially called TechAmerica. Email addresses have changed to name@techamerica.org. The GEIA name will be going away. We are not sure how this will affect ANSI accreditation. The new website is: http://www.techamerica.org Two upcoming conferences include Signal Integrity and Power Integrity topics. Information on these is below. The 13th IEEE Workshop on Signals Propagation on Interconnects is May 12- 15, 2009 in Strasbourg, France. http://spi.univ-brest.fr The 7th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO 2009) is November 17-20, 2009 in Toulouse, France. The call for papers deadline is May 30, 2009. http://www.emccompo.org IEC APPROVAL ACTIVITIES No update. SUMMIT STATUS - DesignCon Review The DesignCon summit was held Thursday, February 5, 2009. Michael Mirmak reported that over 50 people from over 30 organizations were in attendance. There was a good technical program with good discussions. All the presentation material has been posted. He thanked the co-sponsors Cisco and IEC and also the presenters. Bob Ross noted that there was a problem with DesignCon moving some technical content into the Thursday morning time slot. We will probably still schedule the summit for Thursday next year, but we may want to look at other days. -DATE Planning Ralf Bruening of Zuken has been organizing the event. It is scheduled for Thursday morning, April 23, 2009. Agilent, Sigrity and Zuken are the current sponsors. Several paper presentations are already planned. -DAC Planning DAC is scheduled for July 26-31, 2009 in San Francisco. We plan to have representation from GEIA at the event to explain the new parent organization. The IBIS summit is scheduled for Tuesday, July 28. Sponsorship is welcome. Elections are also held at this meeting. Sponsorship opportunities for all upcoming IBIS summits are available, with sponsors receiving free mentions in the minutes, agenda, and other announcements. Contact the IBIS Board for further details. IBIS QUALITY TASK GROUP Bob Ross reported that the group is working on Section 5 of the IBIS Quality Specification. The Quality Task Group checklist and other documentation can be found at: http://www.eda-stds.org/ibis/quality_wip/ IBIS MODEL REVIEW TASK GROUP Lynne Green reported that the group reviewed 8 models from 7 companies last year. Many of the models did not pass the parser on the first check. There has been one model to review in 2009 so far. ADVANCED TECHNOLOGY MODELING TASK GROUP Arpad Muranyi reported that the group is working on IBIS Interconnect Spice details. They started discussing details of elements used in the specification such as transmission lines, S-parameters and RLC elements. Task group material can be found at: http://www.eda-stds.org/ibis/macromodel_wip/ AD HOC TASK GROUPS (INTERCONNECT) Michael Mirmak reported that the group has finished a draft of the Touchstone 2.0 document, and it will be reviewed in this meeting. Task group material can be found at: http://www.eda.org/ibis/adhoc/interconnect/ NEW ISSUES None. BIRD111.2: EXTENDED USAGE OF EXTERNAL SERIES COMPONENTS IN EBDS Bob Ross reported that the change to the BIRD deleted two paragraphs describing handling of differential pin pairs. Michael Mirmak asked should this BIRD be approved, would the parser have to change. Bob replied that it would not have to change, but if the BIRD is not approved, the parser may have to be updated. Michael noted that series components are listed, but could you put in series capacitors as well as inductors and resistors? Bob said that it is pathologically possible. Lance Wang felt that it should be described that any series element could be included. Bob will issue a BIRD111.3 to add in this clarification language. TOUCHSTONE 2.0 DISCUSSION Michael Mirmak re-introduced the specification and gave a presentation found at: http://www.eda.org/ibis/docs/touchstone/touchstone2-summary-update- 09.pdf He summarized that Touchstone 2.0 is a revision to Touchstone and is fully backwards compatible. It adds language to remove the limit on the maximum number of ports, better organize network data, support mixed-mode data, support network data describing both power planes and signal lines through per-port reference impedances, support upper- and lower-half matrices, and remove normalization for non-S-parameter data sets. Michael described the changes that have been made since the 2007 review. He noted that support for data compression formats, complex reference impedances, and frequency- dependent reference impedances are not included. He showed a reference table highlighting the differences between the two versions. It is planned to have a review and comment period through the end of April. A call for vote will occur once all major issues are closed, followed by GEIA balloting after the IBIS vote. Walter Katz noted that he liked how the document was written in a text and graphics format. He also plans to look into a sparse S-parameter format for data on large, many port structures. For interconnect files, one would like to know for near-end/far-end, which ports are differential and have physical pin information on the ports. He plans to submit improvements for this. Michael described that there is controversy about whether Touchstone is a data-only specification or should include usage data as well. Bob Ross noted that he is not in favor of making any of this usage data required. There is a placeholder in Touchstone 2.0 for this usage data, but it is not defined yet. The draft Touchstone 2.0 document is found at: http://www.eda.org/ibis/docs/touchstone/touchstone2_forum_review_draft_ a.pdf IBISCHK5 PARSER STATUS Michael Mirmak reported that bidding has opened and closes on March 1. There have been requests for the bid packet. The bids will be reviewed after March 1, 2009. The total cost of the parser is not known yet. IBISCHK4 BUG STATUS Michael Mirmak reported that two BUGs are open right now and there is a potential one related to BIRD106. There are no plans to fix these in the near term, as they are not included in the IBISCHK5 parser development. Lance Wang noted that he is looking into a potential BUG related to PECL models and checking between I-V and V-t curves. The BUG report list is available at the link below: http://www.eda.org/ibis/bugs/ibischk/ ICMCHK1 BUG STATUS ICMCHK1 version 1.1.3 has been released, and the executables can be downloaded. NEW ISSUES Michael Mirmak noted that the Touchstone 2.0 document followed IEEE document standards and the group used a document editor that allowed graphics. Bob Ross and Walter Katz thought that new documents should all be in non-txt formats. Discussion of updating the IBIS specification to a non-txt format ensued. There is a lot of work to update the IBIS specification. Arpad Muranyi noted that the existing format is a parse- able style that includes most text after comment characters. Michael also felt that new BIRDs, especially those like AMI that are separate sections could be written in a new format and integrated into the original specification. The original specification could be re-formatted to remove the comment characters and update the graphics over time. Michael plans to make a proposal list on how changes to the document might be made. NEXT MEETING The next IBIS Open Forum teleconference will be held March 13, 2009 from 8:00 AM to 10:00 AM US Pacific Standard Time. The next IBIS summit will take place at DATE on April 23, 2009. No teleconference has been arranged for the meeting. ======================================================================== NOTES IBIS CHAIR: Michael Mirmak (916) 356-4261, Fax: (916) 377-3788 michael.mirmak@intel.com Server Platform Technical Marketing Engineer, Intel Corporation FM5-239 1900 Prairie City Rd. Folsom, CA 95630 VICE CHAIR: Syed Huq (408) 525-3399, Fax: (408) 526-5504 shuq@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA 95134-1706 SECRETARY: Randy Wolff (208) 363-1764, Fax: (208) 368-3475 rrwolff@micron.com SI Modeling Manager, Micron Technology, Inc. 8000 S. Federal Way Mail Stop: 01-711 Boise, ID 83707-0006 LIBRARIAN: Lance Wang (978) 633-3388 lwang@iometh.com President / CEO, IO Methodology, Inc. PO Box 2099 Acton, MA 01720 WEBMASTER: Syed Huq (408) 525-3399, Fax: (408) 526-5504 huqs@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA 95134-1706 POSTMASTER: Bob Ross (503) 246-8048, Fax : (503) 239-4400 bob@teraspeed.com Staff Scientist, Teraspeed Consulting Group 10238 SW Lancaster Road Portland, OR 97219 This meeting was conducted in accordance with the GEIA Legal Guides and GEIA Manual of Organization and Procedure. The following e-mail addresses are used: majordomo@eda.org In the body, for the IBIS Open Forum Reflector: subscribe ibis In the body, for the IBIS Users' Group Reflector: subscribe ibis-users Help and other commands: help ibis-request@eda.org To join, change, or drop from either or both: IBIS Open Forum Reflector (ibis@eda.org) IBIS Users' Group Reflector (ibis-users@eda.org) State your request. ibis-info@eda.org To obtain general information about IBIS, to ask specific questions for individual response, and to inquire about joining the EIA-IBIS Open Forum as a full Member. ibis@eda.org To send a message to the general IBIS Open Forum Reflector. This is used mostly for IBIS Standardization business and future IBIS technical enhancements. Job posting information is not permitted. ibis-users@eda.org To send a message to the IBIS Users' Group Reflector. This is used mostly for IBIS clarification, current modeling issues, and general user concerns. Job posting information is not permitted. ibis-bug@eda.org To report ibischk parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/bugs/ibischk/ http://www.eda.org/ibis/bugs/ibischk/bugform.txt icm-bug@eda.org To report icmchk1 parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/icm_bugs/ http://www.eda.org/ibis/icm_bugs/icm_bugform.txt To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which reside at: http://www.eda.org/ibis/bugs/s2ibis/bugs2i.txt http://www.eda.org/ibis/bugs/s2ibis2/bugs2i2.txt http://www.eda.org/ibis/bugs/s2iplt/bugsplt.txt Information on IBIS technical contents, IBIS participants and actual IBIS models are available on the IBIS Home page: http://www.eigroup.org/ibis/ibis.htm Check the IBIS file directory on eda.org for more information on previous discussions and results: http://www.eda.org/ibis/directory.html Other trademarks, brands and names are the property of their respective owners. IBIS CURRENT MEMBER VOTING STATUS I/O Buffer Information Specification Committee (IBIS) |Organization |Interest |Standard|January |January|Februar|Februar| | |Category |s Ballot|9, 2009 |30, |y 5, |y 20, | | | |Voting | |2009 |2009 |2009 | | | |Status | | | | | |Actel |Producer |Inactive| | | | | |Advanced Micro |Producer |Inactive| | | |( | |Devices | | | | | | | |Agilent |User |Inactive| | |( | | |Technologies | | | | | | | |Ansoft |User |Inactive| | | |( | |Apple Computer |User |Inactive| | | | | |Applied |User |Inactive| | | | | |Simulation | | | | | | | |Technology | | | | | | | |ARM |Producer |Active | | |( |( | |Cadence Design |User |Inactive| | |( | | |Systems | | | | | | | |Cisco Systems |User |Active |( |( |( |( | |Ericsson |Producer |Active | | |( |( | |Freescale |Producer |Inactive| | |( | | |Green Streak |General |Inactive| | | |( | |Programs |Interest | | | | | | |Hitachi ULSI |Producer |Inactive| | | | | |Systems | | | | | | | |Huawei |User |Inactive| | |( | | |IBM |Producer |Active | |( | |( | |Infineon |Producer |Inactive| | | | | |Technologies AG | | | | | | | |Intel Corp. |Producer |Active |( |( |( |( | |LSI |Producer |Active |( |( | |( | |Marvell |Producer |Inactive| | | | | |Semiconductor | | | | | | | |Mentor Graphics |User |Active |( |( |( |( | |Micron |Producer |Active |( |( | |( | |Technology | | | | | | | |Nokia Siemens |Producer |Active |( |( | |( | |Networks | | | | | | | |Samtec |Producer |Inactive| | | | | |Signal Integrity|User |Active | |( |( |( | |Software | | | | | | | |Sigrity |User |Active |( |( |( | | |Synopsys |User |Inactive| | |( | | |Teraspeed |General |Active |( |( |( |( | |Consulting |Interest | | | | | | |Texas |Producer |Inactive|( | | |( | |Instruments | | | | | | | |Toshiba |Producer |Inactive| | | | | |Xilinx |Producer |Active |( |( |( | | |ZTE |User |Inactive| | | | | |Zuken |User |Inactive| | | | | Criteria for Member in good standing: • Must attend two consecutive meetings to establish voting membership • Membership dues current • Must not miss two consecutive Meetings Interest categories associated with GEIA ballot voting are: • Users - Members that utilize electronic equipment to provide services to an end user. • Producers - Members that supply electronic equipment. • General Interest - Members are neither producers nor users. This category includes, but is not limited to, Government, regulatory agencies (state and federal), researchers, other organizations and associations, and/or consumers.