IBIS Open Forum Minutes Meeting Date: March 13, 2009 VOTING MEMBERS AND 2009 PARTICIPANTS Actel (Prabhu Mohan) Agilent Technologies Yutao Hu, Fangyi Rao AMD Nam Nguyen Ansoft Corporation Steve Pytel Apple Computer (Matt Herndon) Applied Simulation Technology (Fred Balistreri) ARM V. Muniswara Reddy Cadence Design Systems Terry Jernberg, Ambrish Varma Cisco Systems Luis Boluna, Tram Bui, Bill Chen, Syed Huq, Mike LaBonte*, Pedo Miran Huyen Pham, AbdulRahman (Abbey) Rafiq, Ashwin Vasudevan, Zhiping Yang Ericsson Anders Ekholm Freescale Jon Burnett, Om Mandhama Green Streak Programs Lynne Green Hitachi ULSI Systems (Kazuyoshi Shoji) Huawei Technologies Xiaoqing Dong, Chunxing Huang, Guan Tao* IBM Adge Hawes* Infineon Technologies AG (Christian Sporrer) Intel Corporation Michael Mirmak*, Jon Powell, Sirisha Prayaga LSI Brian Burdick* Marvell Semiconductor (Itzik Peleg) Mentor Graphics Weston Beal, Vladimir Dmitriev-Zdorov, Zhen Mu, Arpad Muranyi* Micron Technology Randy Wolff* Nokia Siemens Networks GmbH Eckhard Lenski Samtec (Corey Kimble) Signal Integrity Software Barry Katz, Walter Katz, Todd Westerhoff* Sigrity Sam Chitwood Synopsys Ted Mido Teraspeed Consulting Group Bob Ross* Texas Instruments Pavani Jella Toshiba (I.S. Corporation) (Yasumasa Kondo) Xilinx David Banas ZTE (Ying Xiong) Zuken (Michael Schaeder) OTHER PARTICIPANTS IN 2009 AET Mikio Kiyono Bayside Design Stephen Coe, Elliot Nahas Circuit Spectrum Zaven Tashjian CST Antonio Ciccomancini, Martin Schauem Curtiss-Wright Embedded J. Phillips Computing EM Integrity Guy de Burgh Exar Helen Nguyen GEIA (Chris Denham) ICT Solutions Steven Wong* IO Methodology Li (Kathy) Chen, Lance Wang*, Zhi (Benny) Yan Juniper Kevin Ko Leventhal Design & Roy Leventhal Communications Maxim Integrated Products Ron Olisar* Mindspeed Technologies Bobby Alkay NetLogic Microsystems Eric Hsu Sanmina SCI Vladimir Drivanenko Sedona International Joe Socha Signal Consulting Group Timothy Coyle, Nicole Mitchell Simberian Yuriy Shlepnev Xsigo Systems Robert Badel Independent Ian Dodd In the list above, attendees at the meeting are indicated by *. Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS The bridge numbers for future IBIS teleconferences are as follows: Date Telephone Number Meeting ID April 3, 2009 1-866-432-9903 121644215 April 23, 2009 -- IBIS Summit at DATE; no teleconference -- All meetings are 8:00 AM to 9:55 AM US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. When calling into the meeting, press 1 to attend the meeting, then follow the prompts to enter the meeting ID. For new, local international dial-in numbers, please reference the bridge numbers provided by Cisco Systems at the following link: http://www.cisco.com/web/about/doing_business/conferencing/index.html NOTE: "AR" = Action Required. ---------------------------------------------------------------------------- --------------------------------------------------- INTRODUCTIONS AND MEETING QUORUM Ron Olisar of Maxim Integrated Products introduced himself. He has had discussions with Bob Ross recently and decided to join the IBIS Open Forum teleconference. He works in a product group building drivers for up to 10Gbps channels. He has interest in IBIS AMI for internal use of models and as an easier way to co-model complete channels with customers. He wants to understand how well adopted IBIS AMI will be in the industry. He thinks the signs are positive for AMI. He wants to help support the transition to IBIS AMI by Maxim. CALL FOR PATENTS Michael Mirmak called for any patents or pending patents related to the IBIS Version 3.2, 4.0, 4.1, 4.2, or ICM 1.1 specifications. No patents were declared. MEMBERSHIP UPDATE AND TREASURER'S REPORT Michael Mirmak reported that we are waiting on our financial update from TechAmerica to close 2008. Michael has gotten notes that some companies have not received renewal notifications. Let the board know if you are having any issues with membership renewal. REVIEW OF MINUTES AND ARS Michael Mirmak called for comments regarding the minutes of the February 5, 2009 IBIS Open Forum summit at DesignCon and the February 20, 2009 IBIS Open Forum teleconference. Both sets of minutes were approved without changes. WEB PAGE UPDATES No update. MAILING LIST ADMINISTRATION Bob Ross reported that everything is working normally. MODEL LIBRARY UPDATE Lance Wang reported that he will be reviewing model links before the next meeting and should have an update then. PRESS UPDATE Bob Ross mentioned four references to IBIS in the technical literature. A recently published book includes a section on IBIS basics. The book is “Advanced Signal Integrity for High-Speed Digital Designs” by Stephen Hall and Howard Heck, Wiley and IEEE Press, 2009. The book can be found at: http://www.wiley.com/WileyCDA/WileyTitle/productCd-0470192356.html A professional journal article references IBIS work and several other IBIS people. The article is “Improving Behavioral IO Buffer Modeling Based on IBIS,” by A. Varma, M. Steer, and P. Franzon, IEEE Trans. Advanced Packaging, vol. 31, no. 4, Nov. 2008, pp.711-721. The article can be found at: http://www.ece.ncsu.edu/erl/publications/papers/paulf/2008/paulf_2008_varma. pdf A professional journal article develops the mathematical theory assuming a square-law FET structure similar to the earlier presentations, references IBIS and VHDL-AMS. The article is "A Modified IBIS Model Aimed at Signal Integrity Analysis of Systems in Package," by P. Pulici, A. Girardi, G.P. Vanalli, R. Izzi, G. Beranrdi, G. Ripamonti, A.G.M. Strollo, IEEE Trans. Circuit Theory, I, Reg. Papers, vol. 55, no. 7, Aug. 2008, pp. 1921-1928. A professional journal article references IBIS, and Etienne Sicard has been active over several years at IBIS summits. The article is "Modeling the Electromagnetic Emission of a Microcontroller Using a Single Model," by C. Labussiere-Dorgan, S. Bendhia, E. Sicard, J. Tao, H.J. Quaresma, C. Lochot, B. Vrignon, IEEE Trans. Electromagnetic Compatibilities, vol. 50, no. 1, Feb. 2008, pp. 22-34. The article can be found at: http://www.lattis.univ- toulouse.fr/uploaded/files/publications/revues/TEMC-241-2006-R1.pdf MISCELLANY/ANNOUNCEMENTS None. OPENS FOR NEW ISSUES None. INTERNATIONAL/EXTERNAL PROGRESS - DASC Michael Mirmak reported that there is a meeting on March 19, 2009. He has not seen the agenda yet. The DASC file and e-mail archive may be found at: http://www.dasc.org/ - P1735 Encryption No update. The IEEE DASC Study Group on Encryption web reflector archives are found at: http://www.eda-stds.org/ip-encrypt/hm/ - TechAmerica/GEIA/ITAA Issues There have been no updates from TechAmerica yet on any organization changes. Bob Ross noted that we need to revisit our logo development soon. We will add this to the agenda next time. Three upcoming conferences include Signal Integrity and Power Integrity topics. Information on these is below. The 13th IEEE Workshop on Signals Propagation on Interconnects (SPI) is May 12-15, 2009 in Strasbourg, France. http://spi.univ-brest.fr The Electrical Performance of Electronic Packaging and Systems (EPEPS 2009) is October 19-21, 2009 at the Embassy Suites in Portland, OR. This is a major meeting for SI people from universities and industry. http://www.epep.org/ The 7th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO 2009) is November 17-20, 2009 in Toulouse, France. The call for papers deadline is May 30, 2009. http://www.emccompo.org IEC APPROVAL ACTIVITIES Randy Wolff reported that he checked with Chris Denham of TechAmerica to confirm if Touchstone 2.0 standardization would run into any difficulties to the ITAA/AeA merger. Chris said that the PINS document filed with GEIA in December 2007 is still valid and TechAmerica is still accredited by ANSI. Randy mentioned that we may need to look into voting status of members if going forward with TechAmerica standardization of Touchstone 2.0. Bob Ross said that we may want to wait on the ballot process. A parser project may find minor issues, so would be better to wait on balloting through TechAmerica. SUMMIT STATUS -DATE Planning Ralf Bruening of Zuken has been organizing the event. It is scheduled for Thursday morning, April 23, 2009 in Nice, France. Agilent, Sigrity and Zuken are the current sponsors. Several paper presentations are already planned. -DAC Planning DAC is scheduled for July 26-31, 2009 in San Francisco. The IBIS summit is scheduled for Tuesday, July 28. Sponsorship is welcome. Elections are also held at this meeting. Let the board know if you are interested in an officer position. The first call for papers should go out in mid-May. Mentor Graphics is a co-sponsor of this event. -Asia Summits Planning Meetings in China and Japan are tentatively scheduled in the November- December timeframe. Sponsors are welcome. Sponsorship opportunities for all upcoming IBIS summits are available, with sponsors receiving free mentions in the minutes, agenda, and other announcements. Contact the IBIS Board for further details. IBIS QUALITY TASK GROUP Mike LaBonte reported that the group has completed review of section 6. This section covered checks outside of the normal list (these are more warning items). They are discussing section 7 that covers simulation and lab correlation. Meetings are on Tuesdays at 8:00 AM Pacific time. The Quality Task Group checklist and other documentation can be found at: http://www.eda-stds.org/ibis/quality_wip/ IBIS MODEL REVIEW TASK GROUP No update. ADVANCED TECHNOLOGY MODELING TASK GROUP Arpad Muranyi reported that the group is working on IBIS Interconnect Spice details, discussing each element in the list. The group is also discussing Todd Westerhoff’s idea for inclusion of an S-parameter block for analog buffer characteristics in AMI models. There is discussion on how to include this block in IBIS. Task group material can be found at: http://www.eda-stds.org/ibis/macromodel_wip/ AD HOC TASK GROUPS (INTERCONNECT) Michael Mirmak reported that the group has not met since submitting the Touchstone 2.0 document to the IBIS Open Forum. The group will meet again when needed. Task group material can be found at: http://www.eda.org/ibis/adhoc/interconnect/ NEW ISSUES None. BIRD111.2: EXTENDED USAGE OF EXTERNAL SERIES COMPONENTS IN EBDS Bob Ross reported that the “Dealing with Series Elements” paragraph needs updating to include a better description of handling series elements including more than R and L elements. Michael Mirmak asked if the example showing CLK assumes a discrete resistance separate from another IBIS file, like a Spice model. Bob responded that no, these elements must be components in the [Reference Designator Map] that reference IBIS models. Michael asked if the parser needs to check if one pin of a series element is an I/O buffer and the other pin is another I/O buffer. Bob responded that no checking is needed. Verbiage was added in BIRD111.1 to describe this situation, but then it was removed to not open the door to too many complications. TOUCHSTONE 2.0 REVIEW Michael Mirmak made the second call for comments on the Touchstone 2.0 document. He listed two comments from an S-parameter expert. Normalization of S-parameters may be implied by the current document language. We should clarify that normalization does not apply for S- parameters in either Touchstone or Touchstone 2.0. The document also implies that the original Touchstone prohibited blank lines. We should clarify that the document explicitly allows blank lines (including leading blank lines) in both versions. Comments from Radek Biernacki make suggestions of clarification language to address normalization. Bob Ross clarified that this meant that S-parameter data of the same network taken with two different reference impedances would be different data, tied to the reference impedance stated. Michael added that the difference between the two data sets would be seen in the magnitude. Michael and Bob discussed adding language to address the blank line issue. Michael noted that there was a request for a file name or model name keyword in the file. Michael clarified that multiple ‘models’ would not be described in the same Touchstone file. A file name field might make it easier for a parser to associate the file name with the data. Michael asked for comments from programmers about this. Mike LaBonte did not think this was a useful feature. A revised document will be reviewed at the next meeting. Bob also noted use of the multiplier character ‘x’, on page 19 for instance, is not necessary. Michael suggested getting guidance from IEEE or other standards groups on this and making changes later. The draft Touchstone 2.0 document is found at: http://www.eda.org/ibis/docs/touchstone/touchstone2_forum_review_draft_ a.pdf IBISCHK5 PARSER STATUS Michael Mirmak reported that the IBISCHK bid committee has reviewed the bids and decided on a parser developer. The committee will be discussing the parser contract and development schedule after this meeting. Commitments for parser purchases will need to be made before the parser development can officially begin. Details of the contract will be shared at the next meeting. IBISCHK4 BUG STATUS Michael Mirmak reported that two BUGs are open right now. There are no plans to fix these in the near term, as they are not included in the IBISCHK5 parser development. The BUG report list is available at the link below: http://www.eda.org/ibis/bugs/ibischk/ ICMCHK1 BUG STATUS ICMCHK1 version 1.1.3 has been released, and the executables can be downloaded. All BUGs have been closed at this point. NEW ISSUES Ron Olisar asked how the committee members felt about adoption of IBIS AMI in the industry. Arpad Muranyi responded that all major vendors have proposals for support of AMI. Arpad would like to see more models for testing of AMI. Todd Westerhoff noted that many semiconductor vendors are investigating AMI. Companies are interested in knowing how they can trust the models. Todd thinks there are good answers to the questions and thinks progress is happening towards adoption. Ron noted that StatEye is unsupported. Arpad felt that StatEye competes with AMI, and the best model will win. Todd noted that StatEye is written into some standards, and that is one reason why it is used. Steven Wong noted that he does Spice modeling with passive components. He was interested in knowing if IBIS has any involvement in USB 3.0 development. Michael Mirmak noted that the ATM group is working on Interconnect Spice modeling, and this may be of interest to Steven. NEXT MEETING The next IBIS Open Forum teleconference will be held April 3, 2009 from 8:00 AM to 10:00 AM US Pacific Standard Time. The next IBIS summit will take place at DATE on April 23, 2009. No teleconference has been arranged for the meeting. ======================================================================== NOTES IBIS CHAIR: Michael Mirmak (916) 356-4261, Fax: (916) 377-3788 michael.mirmak@intel.com Server Platform Technical Marketing Engineer, Intel Corporation FM5-239 1900 Prairie City Rd. Folsom, CA 95630 VICE CHAIR: Syed Huq (408) 525-3399, Fax: (408) 526-5504 shuq@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA 95134-1706 SECRETARY: Randy Wolff (208) 363-1764, Fax: (208) 368-3475 rrwolff@micron.com SI Modeling Manager, Micron Technology, Inc. 8000 S. Federal Way Mail Stop: 01-711 Boise, ID 83707-0006 LIBRARIAN: Lance Wang (978) 633-3388 lwang@iometh.com President / CEO, IO Methodology, Inc. PO Box 2099 Acton, MA 01720 WEBMASTER: Syed Huq (408) 525-3399, Fax: (408) 526-5504 huqs@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA 95134-1706 POSTMASTER: Bob Ross (503) 246-8048, Fax : (503) 239-4400 bob@teraspeed.com Staff Scientist, Teraspeed Consulting Group 10238 SW Lancaster Road Portland, OR 97219 This meeting was conducted in accordance with the GEIA Legal Guides and GEIA Manual of Organization and Procedure. The following e-mail addresses are used: majordomo@eda.org In the body, for the IBIS Open Forum Reflector: subscribe ibis In the body, for the IBIS Users' Group Reflector: subscribe ibis-users Help and other commands: help ibis-request@eda.org To join, change, or drop from either or both: IBIS Open Forum Reflector (ibis@eda.org) IBIS Users' Group Reflector (ibis-users@eda.org) State your request. ibis-info@eda.org To obtain general information about IBIS, to ask specific questions for individual response, and to inquire about joining the EIA-IBIS Open Forum as a full Member. ibis@eda.org To send a message to the general IBIS Open Forum Reflector. This is used mostly for IBIS Standardization business and future IBIS technical enhancements. Job posting information is not permitted. ibis-users@eda.org To send a message to the IBIS Users' Group Reflector. This is used mostly for IBIS clarification, current modeling issues, and general user concerns. Job posting information is not permitted. ibis-bug@eda.org To report ibischk parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/bugs/ibischk/ http://www.eda.org/ibis/bugs/ibischk/bugform.txt icm-bug@eda.org To report icmchk1 parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/icm_bugs/ http://www.eda.org/ibis/icm_bugs/icm_bugform.txt To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which reside at: http://www.eda.org/ibis/bugs/s2ibis/bugs2i.txt http://www.eda.org/ibis/bugs/s2ibis2/bugs2i2.txt http://www.eda.org/ibis/bugs/s2iplt/bugsplt.txt Information on IBIS technical contents, IBIS participants and actual IBIS models are available on the IBIS Home page: http://www.eigroup.org/ibis/ibis.htm Check the IBIS file directory on eda.org for more information on previous discussions and results: http://www.eda.org/ibis/directory.html Other trademarks, brands and names are the property of their respective owners. IBIS CURRENT MEMBER VOTING STATUS I/O Buffer Information Specification Committee (IBIS) |Organization |Interest |Standard|January |Februar|Februar|March | | |Category |s Ballot|30, 2009|y 5, |y 20, |13, | | | |Voting | |2009 |2009 |2009 | | | |Status | | | | | |Actel |Producer |Inactive| | | | | |Advanced Micro |Producer |Inactive| | |( | | |Devices | | | | | | | |Agilent |User |Inactive| |( | | | |Technologies | | | | | | | |Ansoft |User |Inactive| | |( | | |Apple Computer |User |Inactive| | | | | |Applied |User |Inactive| | | | | |Simulation | | | | | | | |Technology | | | | | | | |ARM |Producer |Active | |( |( | | |Cadence Design |User |Inactive| |( | | | |Systems | | | | | | | |Cisco Systems |User |Active |( |( |( |( | |Ericsson |Producer |Active | |( |( | | |Freescale |Producer |Inactive| |( | | | |Green Streak |General |Inactive| | |( | | |Programs |Interest | | | | | | |Hitachi ULSI |Producer |Inactive| | | | | |Systems | | | | | | | |Huawei |User |Inactive| |( | |( | |IBM |Producer |Active |( | |( |( | |Infineon |Producer |Inactive| | | | | |Technologies AG | | | | | | | |Intel Corp. |Producer |Active |( |( |( |( | |LSI |Producer |Active |( | |( |( | |Marvell |Producer |Inactive| | | | | |Semiconductor | | | | | | | |Mentor Graphics |User |Active |( |( |( |( | |Micron |Producer |Active |( | |( |( | |Technology | | | | | | | |Nokia Siemens |Producer |Active |( | |( | | |Networks | | | | | | | |Samtec |Producer |Inactive| | | | | |Signal Integrity|User |Active |( |( |( |( | |Software | | | | | | | |Sigrity |User |Inactive|( |( | | | |Synopsys |User |Inactive| |( | | | |Teraspeed |General |Active |( |( |( |( | |Consulting |Interest | | | | | | |Texas |Producer |Inactive| | |( | | |Instruments | | | | | | | |Toshiba |Producer |Inactive| | | | | |Xilinx |Producer |Inactive|( |( | | | |ZTE |User |Inactive| | | | | |Zuken |User |Inactive| | | | | Criteria for Member in good standing: • Must attend two consecutive meetings to establish voting membership • Membership dues current • Must not miss two consecutive Meetings Interest categories associated with GEIA ballot voting are: • Users - Members that utilize electronic equipment to provide services to an end user. • Producers - Members that supply electronic equipment. • General Interest - Members are neither producers nor users. This category includes, but is not limited to, Government, regulatory agencies (state and federal), researchers, other organizations and associations, and/or consumers.