IBIS Open Forum Minutes Meeting Date: August 7, 2009 VOTING MEMBERS AND 2009 PARTICIPANTS Actel (Prabhu Mohan) Agilent Brian Andresen, Radek Biernacki, Saliou Dieye, Yutao Hu, Fangyi Rao AMD Nam Nguyen Apple Computer (Matt Herndon) Applied Simulation Technology (Fred Balistreri) ARM V. Muniswara Reddy Cadence Design Systems Terry Jernberg, Ambrish Varma Cisco Systems Luis Boluna, Tram Bui, Bill Chen, Syed Huq, Mike LaBonte*, Pedo Miran, Huyen Pham, AbdulRahman (Abbey) Rafiq, Ashwin Vasudevan, Zhiping Yang Ericsson Anders Ekholm* Green Streak Programs Lynne Green Hitachi ULSI Systems (Kazuyoshi Shoji) IBM Adge Hawes* Infineon Technologies AG (Christian Sporrer) Intel Corporation Myoung J. Choi, Michael Mirmak, Vishram Pandit, Jon Powell, Sirisha Prayaga IO Methodology Li (Kathy) Chen, Lance Wang*, Zhi (Benny) Yan LSI Brian Burdick* Mentor Graphics Weston Beal, Vladimir Dmitriev-Zdorov, Zhen Mu, Arpad Muranyi* Micron Technology Randy Wolff* Nokia Siemens Networks GmbH Eckhard Lenski* Samtec (Corey Kimble) Signal Integrity Software Barry Katz, Walter Katz*, Todd Westerhoff Sigrity Brad Brim, Sam Chitwood Synopsys Ted Mido Teraspeed Consulting Group Bob Ross* Toshiba (Yasumasa Kondo) Xilinx [David Banas] ZTE (Ying Xiong) Zuken Michael Schaeder, Ralf Bruening OTHER PARTICIPANTS IN 2009 AET Mikio Kiyono Altera Hui Fu Ansoft Corporation Steve Pytel Apache Yu Lin ATE Nob Tanak, Kenny Suga Bayside Design Stephen Coe, Elliot Nahas Circuit Spectrum Zaven Tashjian CST Antonio Ciccomancini, Martin Schauem Curtiss-Wright Embedded J. Phillips Computing EM Integrity Guy de Burgh Exar Helen Nguyen Freescale Jon Burnett, Om Mandhama Huawei Technologies Xiaoqing Dong, Chunxing Huang, Guan Tao ICT Solutions Steven Wong IdemWorks Michelangelo Bandinu Juniper Kevin Ko Kineret Design Ricardo Teliuteuesh Leventhal Design & Roy Leventhal Communications Maxim Integrated Products Ron Olisar Mindspeed Technologies Bobby Alkay NetLogic Microsystems Eric Hsu Politecnico di Torino Igor Stievano Sanmina SCI Vladimir Drivanenko Sedona International Joe Socha Siemens Manfred Maurer Signal Consulting Group Timothy Coyle, Nicole Mitchell Simberian Yuriy Shlepnev TechAmerica (GEIA) (Chris Denham) Texas Instruments Pavani Jella Xsigo Systems Robert Badel Independent Ian Dodd In the list above, attendees at the meeting are indicated by *. Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS The bridge numbers for future IBIS teleconferences are as follows: Date Meeting Number Meeting Password August 28, 2009 206 289 325 IBIS For teleconference dial-in information, use the password at the following website: https://cisco.webex.com/cisco/j.php?J=206289325 All teleconference meetings are 8:00 AM to 9:55 AM US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. When calling into the meeting, press 3 to attend the meeting, then follow the prompts to enter the meeting ID. For new, local international dial-in numbers, please reference the bridge numbers provided by Cisco Systems at the following link: http://www.cisco.com/web/about/doing_business/conferencing/index.html NOTE: "AR" = Action Required. ---------------------------------------------------------------------------- --------------------------------------------------- INTRODUCTIONS AND MEETING QUORUM No new participants. Bob Ross noted that the new officers for 2009-2010 are: Chair: Bob Ross, Teraspeed Consulting Group Vice-Chair: Lance Wang, IO Methodology, Inc. Secretary: Randy Wolff, Micron Technology Librarian: Anders Ekholm, Ericsson AB Webmaster: Syed Huq, Cisco Systems Postmaster: Mike LaBonte, Cisco Systems CALL FOR PATENTS Bob Ross called for any patents or pending patents related to the IBIS 3.2, IBIS 4.2, IBIS 5.0 or ICM 1.1 specifications. No patents were declared. MEMBERSHIP UPDATE AND TREASURER'S REPORT Bob Ross reported that we have 28 paid members. We are working on renewals for four other members. The membership roll has been cleared of non-paid members as of the DAC IBIS summit. We are on target for our budget for the year. REVIEW OF MINUTES AND ARS Bob Ross called for comments regarding the minutes of the July 17, 2009 IBIS Open Forum teleconference. Bob noted that IO Methodology should have been noted as a new member. The minutes were approved with the noted change. WEB PAGE UPDATES Bob Ross reported for Syed Huq that the upcoming events page was updated to add a link to the China summit. MAILING LIST ADMINISTRATION Mike LaBonte reported that he is in transition and now has permission as administrator on majordomo. He is waiting for Accellera to change their email alias before updating Accellera addresses on the mailing list. MODEL LIBRARY UPDATE Anders Ekholm found some broken links and is working on fixing them. PRESS UPDATE None. MISCELLANY/ANNOUNCEMENTS None. OPENS FOR NEW ISSUES Bob Ross requested time to discuss the processing of BUG105 and creation of a new IBIS librarian email address. INTERNATIONAL/EXTERNAL ACTIVITIES - DASC Bob Ross noted that a DASC teleconference meeting was held June 30. There was a presentation by an IEEE member on a new dues structure that IEEE is adopting for DASC and other groups. This is a four tiered membership system. Pricing includes $1250-$5000 per member with non-voting rights and $2500-$10000 per company for voting rights. Bob also noted that DASC is voting on restarting the VHDL-AMS 1076.1 project. The DASC file and e-mail archive may be found at: http://www.dasc.org/ - P1735 Encryption No update. The IEEE Study Group on Encryption web reflector archives are found at: http://www.eda-stds.org/ip-encrypt/hm/ -Conferences The Electrical Performance of Electronic Packaging and Systems (EPEPS 2009) is October 19-21, 2009 at the Embassy Suites in Portland, OR. This is a major meeting for SI people from universities and industry. http://www.epep.org/ The 7th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO 2009) is November 17-20, 2009 in Toulouse, France. http://www.emccompo.org TECHAMERICA STATUS Randy Wolff reported that he received notice from Chris Denham that we can begin using the new IBIS logo without any copyright symbol additions. Chris suggested that we put notice on our website of our trademark and copyright policies. IEC APPROVAL ACTIVITIES Randy Wolff reported that he recently received an email from Victor Berman. Victor has been in discussion with the IEC about the possibility of a dual logo agreement with TechAmerica, but he has not been able to get a definitive answer. He also sent a Maintenance Cycle Report (MCR) form to be filled out. The MCR form will be circulated for approval of the update to the IBIS specification. IEC approval of IBIS 4.2 will be on the agenda at the next IEC meeting in September. Bob Ross noted that IBIS 3.2 is currently standardized as IEC 62014-1. We should describe the project in the MCR as a re-issue as an upgraded standard. SUMMIT STATUS -DAC Summit Review The DAC IBIS summit was held Tuesday, July 28 at the Westin San Francisco Market Street. Bob Ross noted that the meeting went well. There were 10 presentations. Walter Katz commented that Lance Wang gave a nice presentation about running a model through multiple simulators that was well done. There were four presentations about interconnect and the need for EDA tools to use good interconnect models. There was a nice summary of Michael Mirmak’s accomplishments during his leadership of IBIS. -China Summit Planning Bob Ross noted that the meeting is scheduled for Wednesday, November 4 at the Four Points Hotel in the Pudong district. The first announcement has gone out. Co-sponsors include Huawei Technologies, Agilent Technologies, Ansoft, Cadence Design, Cybernet Systems, Intel, Mentor Graphics, SiSoft, Sigrity, Synopsys, ZTE Corporation and others to be determined. -Japan Summit Planning Bob Ross stated that Friday, November 6 had been requested from JEITA as the date for the event. This event will be held at the JEITA headquarters. Co-sponsors include Japan Electronics and Information Technology Industries Association (JEITA) and others to be determined. Sponsorship opportunities for all upcoming IBIS summits are available, with sponsors receiving free mentions in the minutes, agenda, and other announcements. Contact the IBIS Board for further details. IBIS QUALITY TASK GROUP Mike LaBonte reported that the group voted and decided to issue the new IBIS Quality Specification as revision 2.0 instead of 1.1 due to it being such a major revision. Mike was hopeful that the official release will happen this month. Mike is also making some changes are to the website to remove frames. The Quality Task Group checklist and other documentation can be found at: http://www.eda-stds.org/ibis/quality_wip/ IBIS MODEL REVIEW TASK GROUP No update. ADVANCED TECHNOLOGY MODELING TASK GROUP Arpad Muranyi reported that the group is making editorial changes to the IBIS-ISS document. They received permission from Synopsys to release it publically. Arpad requested that the document be added as an official review topic in the Open Forum meeting. The group is going back to discussing IBIS-AMI specification clarifications. Task group material can be found at: http://www.eda-stds.org/ibis/macromodel_wip/ AD HOC TASK GROUPS (INTERCONNECT) Bob Ross reported that the group is discussing sparse matrix proposals and possible re-formatting issues of Touchstone. These relate to how to expand Touchstone to include other formats – pole zero, impulse response, etc. There is no meeting next week. Walter Katz added that there will be important decisions made in the short term, so any companies generating S- parameter models for connectors and packages would provide valuable input. Task group material can be found at: http://www.eda.org/ibis/adhoc/interconnect/ NEW ISSUES Bob Ross noted that Anders Ekholm would like a separate email address as a contact for the IBIS librarian so that he doesn’t lose any requests. This would make it so email addresses would remain constant even when officers change. We currently don’t have our own domain for IBIS. Arpad Muranyi suggested ibis-models.org for a domain. Mike LaBonte mentioned that we’d need to look for an ISP to host the domain and will need a reasonable amount of storage. Mike had a quick solution for setting up an email alias for Anders as ibis-librarian@eda.org. IBISCHK5 PARSER STATUS Bob Ross reported that an executable has been released to the parser committee for review. Mike LaBonte ran several hundred files through the parser, but he has not analyzed all the output yet. We will have a process in place soon for releasing it to a wider community for review. It was noted that table format checking may not be done for AMI models. IBISCHK4 BUG STATUS BUG104 suggested that [Test Data] and [Test Load] were hierarchically scoped within [Model] by the specification but were incorrectly treated as top-level keywords by the parser, which prohibits duplicated names for these keywords. It was found that the hierarchy shown in the specification is incorrect, and a BIRD needs to be filed to address the top-level hierarchy move. Bob Ross would like to keep the BUG open until either a BIRD or another BUG is filed. The BUG was classified as Annoying, Low and Open. BUG105 has just been filed by Prabhat Ranjan of ST Microelectronics. A [Model Selector] line including a model name and description is checked for an 80 character line length instead of a 120 character line length. The BUG was classified as Moderate severity, Medium priority and Open. The BUG report list is available at the link below: http://www.eda.org/ibis/bugs/ibischk/ ICMCHK1 BUG STATUS All BUGs have been closed. No new BUGs have been filed. TOUCHSTONE 2.0 STATUS Bob Ross reported that the tschk parser selection committee is in the process of selecting a contractor for the parser development. More details will hopefully be available at the next teleconference call in three weeks. NEW ISSUES None. NEXT MEETING The next IBIS Open Forum teleconference will be held August 28, 2009 from 8:00 to 10:00 AM US Pacific Standard Time. ======================================================================== NOTES IBIS CHAIR: Bob Ross (503) 246-8048, Fax: (503) 239-4400 bob@teraspeed.com Staff Scientist, Teraspeed Consulting Group 10238 SW Lancaster Road Portland, OR 97219 VICE CHAIR: Lance Wang (978) 633-3388 lwang@iometh.com President / CEO, IO Methodology, Inc. PO Box 2099 Acton, MA 01720 SECRETARY: Randy Wolff (208) 363-1764, Fax: (208) 368-3475 rrwolff@micron.com SI Modeling Manager, Micron Technology, Inc. 8000 S. Federal Way Mail Stop: 01-711 Boise, ID 83707-0006 LIBRARIAN: Anders Ekholm (46) 10 714 27 58, Fax: (46) 8 757 23 40 ibis-librarian@eda.org Digital Modules Design, PDU Base Stations, Ericsson AB BU Network Färögatan 6 164 80 Stockholm, Sweden WEBMASTER: Syed Huq (408) 525-3399, Fax: (408) 526-5504 huqs@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA 95134-1706 POSTMASTER: Mike LaBonte (503) 246-8048, Fax: (503) 239-4400 milabont@cisco.com This meeting was conducted in accordance with the GEIA Legal Guides and GEIA Manual of Organization and Procedure. The following e-mail addresses are used: majordomo@eda.org In the body, for the IBIS Open Forum Reflector: subscribe ibis In the body, for the IBIS Users' Group Reflector: subscribe ibis-users Help and other commands: help ibis-request@eda.org To join, change, or drop from either or both: IBIS Open Forum Reflector (ibis@eda.org) IBIS Users' Group Reflector (ibis-users@eda.org) State your request. ibis-info@eda.org To obtain general information about IBIS, to ask specific questions for individual response, and to inquire about joining the EIA-IBIS Open Forum as a full Member. ibis@eda.org To send a message to the general IBIS Open Forum Reflector. This is used mostly for IBIS Standardization business and future IBIS technical enhancements. Job posting information is not permitted. ibis-users@eda.org To send a message to the IBIS Users' Group Reflector. This is used mostly for IBIS clarification, current modeling issues, and general user concerns. Job posting information is not permitted. ibis-bug@eda.org To report ibischk parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/bugs/ibischk/ http://www.eda.org/ibis/bugs/ibischk/bugform.txt icm-bug@eda.org To report icmchk1 parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/icm_bugs/ http://www.eda.org/ibis/icm_bugs/icm_bugform.txt To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which reside at: http://www.eda.org/ibis/bugs/s2ibis/bugs2i.txt http://www.eda.org/ibis/bugs/s2ibis2/bugs2i2.txt http://www.eda.org/ibis/bugs/s2iplt/bugsplt.txt Information on IBIS technical contents, IBIS participants and actual IBIS models are available on the IBIS Home page: http://www.eigroup.org/ibis/ibis.htm Check the IBIS file directory on eda.org for more information on previous discussions and results: http://www.eda.org/ibis/directory.html Other trademarks, brands and names are the property of their respective owners. IBIS CURRENT MEMBER VOTING STATUS I/O Buffer Information Specification Committee (IBIS) |Organization |Interest |Standard|June 26,|July |July |August | | |Category |s Ballot|2009 |17, |28, |7, 2009| | | |Voting | |2009 |2009 | | | | |Status | | | | | |Actel |Producer |Inactive| | | | | |Advanced Micro |Producer |Inactive| | | | | |Devices | | | | | | | |Agilent |User |Inactive| | |( | | |Technologies | | | | | | | |Apple Computer |User |Inactive| | | | | |Applied |User |Inactive| | | | | |Simulation | | | | | | | |Technology | | | | | | | |ARM |Producer |Inactive| | | | | |Cadence Design |User |Inactive| | | | | |Systems | | | | | | | |Cisco Systems |User |Active |( |( |( |( | |Ericsson |Producer |Active | | |( |( | |Green Streak |General |Inactive|( | |( | | |Programs |Interest | | | | | | |Hitachi ULSI |Producer |Inactive| | | | | |Systems | | | | | | | |IBM |Producer |Inactive|( | | |( | |Infineon |Producer |Inactive| | | | | |Technologies AG | | | | | | | |Intel Corp. |Producer |Active |( |( |( | | |IO Methodology |User |Active | |( |( |( | |LSI |Producer |Active |( |( | |( | |Mentor Graphics |User |Active |( |( |( |( | |Micron |Producer |Inactive|( | | |( | |Technology | | | | | | | |Nokia Siemens |Producer |Active |( |( | |( | |Networks | | | | | | | |Samtec |Producer |Inactive| | | | | |Signal Integrity|User |Active |( |( |( |( | |Software | | | | | | | |Sigrity |User |Inactive| | |( | | |Synopsys |User |Inactive| | | | | |Teraspeed |General |Active |( |( |( |( | |Consulting |Interest | | | | | | |Toshiba |Producer |Inactive| | | | | |Xilinx |Producer |Inactive| | | | | |ZTE |User |Inactive| | | | | Criteria for Member in good standing: • Must attend two consecutive meetings to establish voting membership • Membership dues current • Must not miss two consecutive Meetings Interest categories associated with GEIA ballot voting are: • Users - Members that utilize electronic equipment to provide services to an end user. • Producers - Members that supply electronic equipment. • General Interest - Members are neither producers nor users. This category includes, but is not limited to, Government, regulatory agencies (state and federal), researchers, other organizations and associations, and/or consumers.