IBIS Open Forum Minutes Meeting Date: October 30, 2009 VOTING MEMBERS AND 2009 PARTICIPANTS Actel (Prabhu Mohan) Agilent Brian Andresen, Radek Biernacki, Saliou Dieye, Yutao Hu, Fangyi Rao AMD Nam Nguyen Ansoft Corporation Steve Pytel Apple Computer (Matt Herndon) Applied Simulation Technology (Fred Balistreri) ARM V. Muniswara Reddy Cadence Design Systems Terry Jernberg*, Ambrish Varma Cisco Systems Luis Boluna, Tram Bui, Bill Chen, Syed Huq*, Mike LaBonte*, Pedo Miran, Huyen Pham, AbdulRahman (Abbey) Rafiq, Ashwin Vasudevan, Zhiping Yang Ericsson Anders Ekholm* Green Streak Programs Lynne Green Huawei Technologies Xiaoqing Dong, Chunxing Huang, Guan Tao Hitachi ULSI Systems (Kazuyoshi Shoji) IBM Adge Hawes* Infineon Technologies AG (Christian Sporrer) Intel Corporation Myoung J. Choi, Michael Mirmak, Vishram Pandit, Jon Powell, Sirisha Prayaga IO Methodology Li (Kathy) Chen, Lance Wang, Zhi (Benny) Yan LSI Brian Burdick* Mentor Graphics Weston Beal, Vladimir Dmitriev-Zdorov, Zhen Mu, Arpad Muranyi Micron Technology Randy Wolff* Nokia Siemens Networks GmbH Eckhard Lenski* Samtec (Corey Kimble) Signal Integrity Software Barry Katz, Walter Katz*, Todd Westerhoff Sigrity Brad Brim, Sam Chitwood Synopsys Ted Mido Teraspeed Consulting Group Bob Ross* Toshiba (Yasumasa Kondo) Xilinx [David Banas] ZTE (Ying Xiong) Zuken Michael Schaeder, Ralf Bruening OTHER PARTICIPANTS IN 2009 AET Mikio Kiyono Altera Hui Fu Apache Yu Lin ATE Nob Tanak, Kenny Suga Bayside Design Stephen Coe, Elliot Nahas Circuit Spectrum Zaven Tashjian CST Antonio Ciccomancini, Martin Schauem Curtiss-Wright Embedded J. Phillips Computing EM Integrity Guy de Burgh Exar Helen Nguyen Freescale Jon Burnett, Om Mandhama ICT Solutions Steven Wong IdemWorks Michelangelo Bandinu Juniper Kevin Ko Kineret Design Ricardo Teliuteuesh Leventhal Design & Roy Leventhal Communications Maxim Integrated Products Ron Olisar Mindspeed Technologies Bobby Alkay NetLogic Microsystems Eric Hsu Politecnico di Torino Igor Stievano Sanmina SCI Vladimir Drivanenko Sedona International Joe Socha Siemens Manfred Maurer Signal Consulting Group Timothy Coyle, Nicole Mitchell Simberian Yuriy Shlepnev TechAmerica (GEIA) (Chris Denham) Texas Instruments Pavani Jella Xsigo Systems Robert Badel Independent Ian Dodd In the list above, attendees at the meeting are indicated by *. Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS The bridge numbers for future IBIS teleconferences are as follows: Date Meeting Number Meeting Password November 4, 2009 IBIS China Summit (China) No teleconference November 6, 2009 IBIS Japan Summit (Japan) No teleconference November 20, 2009 208 910 728 IBIS For teleconference dial-in information, use the password at the following website: https://cisco.webex.com/cisco/j.php?J=208910728 All teleconference meetings are 8:00 AM to 9:55 AM US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. When calling into the meeting, follow the prompts to enter the meeting ID. For new, local international dial-in numbers, please reference the bridge numbers provided by Cisco Systems at the following link: http://www.cisco.com/web/about/doing_business/conferencing/index.html NOTE: "AR" = Action Required. ---------------------------------------------------------------------------- --------------------------------------------------- INTRODUCTIONS AND MEETING QUORUM No new participants. CALL FOR PATENTS Bob Ross called for any patents or pending patents related to the IBIS 3.2, IBIS 4.2, IBIS 5.0 or ICM 1.1 specifications. No patents were declared. MEMBERSHIP UPDATE AND TREASURER'S REPORT Bob Ross reported that Huawei Technologies is now an official member again. We are at 30 paid members. There may be one more member pending. REVIEW OF MINUTES AND ARS Bob Ross called for comments regarding the minutes of the October 9, 2009 IBIS Open Forum teleconference. Randy Wolff mentioned that Eckhard Lenski requested the reference to Nokia in the Touchstone parser license vote tally be changed to Nokia Siemens Networks. Nokia is not actually a member of the IBIS Open Forum. The minutes were approved with the noted change. WEB PAGE UPDATES Syed Huq reported that there have been a few changes. He changed the IBIS Committee name on the front page to the IBIS Open Forum. He removed one former member from the poster page and updated Synopsys on the roster page. He is putting the DesignCon logo on the events page. Randy Wolff mentioned changing some references from GEIA to TechAmerica on several web pages. MAILING LIST ADMINISTRATION Mike LaBonte reported that there was one mailing list addition recently. He hasn’t been seeing notifications of any emails going out to the list and bouncing. He plans to contact one of the eda.org system administrators to enquire further. MODEL LIBRARY UPDATE Anders Ekholm reported that the library updates and new logo are uploaded to the website. PRESS UPDATE None. MISCELLANY/ANNOUNCEMENTS None. OPENS FOR NEW ISSUES Bob Ross noted that a new BUG report came in from Mike LaBonte. We will discuss this in the IBISCHK4 BUG report section. INTERNATIONAL/EXTERNAL ACTIVITIES - DASC No update. The DASC file and e-mail archive may be found at: http://www.dasc.org/ - P1735 Encryption Syed Huq noted that several more companies have joined the encryption forum. The IEEE Study Group on Encryption web reflector archives are found at: http://www.eda-stds.org/ip-encrypt/hm/ -Conferences The Electrical Performance of Electronic Packaging and Systems (EPEPS 2009) was October 19-21, 2009 at the Embassy Suites in Portland, OR. Bob Ross reported that there were a couple of tutorials from IBIS members. IBIS AMI and Touchstone 2.0 were mentioned. There were lots of interconnect and stacked die issues discussed. A paper was presented on equation- based IBIS modeling. It was by Ting Zhu and Paul D. Franzon of North Carolina State University entitled "Application of Surrogate Modeling to Generate Compact and PVT-sensitive IBIS Models.” There was about 25% less attendance than normal. http://www.epep.org/ The 7th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO 2009) is November 17-20, 2009 in Toulouse, France. Lance Wang of IO Methodology is presenting a paper entitled "2-Pin- Pair Oriented Extraction Method for True Differential Pair Buffer Behavioral Modeling." http://www.emccompo.org TECHAMERICA STATUS Bob Ross noted that he talked to Chris Denham recently. GEIA no longer exists, and Chris is now Vice President in charge of Systems, Standards & Technology Council (SSTC) for all of TechAmerica. IBIS is positioned under SSTC. We need to update GEIA references in our documents. IEC APPROVAL ACTIVITIES Randy Wolff reported that the IEC meeting was September 28-30, 2009. He has not heard any update from Victor Berman on the status of IEC approval of the IBIS 4.2 specification. SUMMIT STATUS -China Summit Planning The meeting is scheduled for Wednesday, November 4 at the Four Points Hotel in Shanghai in the Pudong district. Bob Ross reported that the agenda was sent out last week. There is a full program with 12 presentations. There will be 5-6 vendor tables. Bob estimated about 110 people will attend. Lance Wang will help with translation and questions. Co-sponsors include Huawei Technologies, Agilent Technologies, Ansoft, Cadence Design, Cybernet Systems, Intel, IO Methodology, Mentor Graphics, SiSoft, Sigrity, Synopsys and ZTE Corporation. -Japan Summit Planning The meeting is scheduled for Friday, November 6 at the JEITA headquarters from 2:00 PM to 6:00 PM. Bob Ross noted that 10 presentations are scheduled. Over 30 people are signed up so far. Co-sponsors include Japan Electronics and Information Technology Industries Association (JEITA), ATE (Sigrity Distributor), Cadence, Zuken and others to be determined. -DesignCon Planning Bob Ross reported that the most likely day for the meeting is Thursday, February 4, 2010. Bob has 3-5 presentations already penciled in. The agreement is signed between IEC and IBIS. We have not heard anything from IEC about room arrangements. Bob is inclined not to have a booth. The booth is complimentary, but there are a lot of extra fees, probably about $400 worth. -European Summit Planning Bob Ross reported that the planning group is strongly considering holding the summit at the SPI conference in May in Hiedesheim, Germany. Eckhard Lenski noted that he prefers holding the meeting at the SPI Conference instead of DATE. Sponsorship opportunities for all upcoming IBIS summits are available, with sponsors receiving free mentions in the minutes, agenda, and other announcements. Contact the IBIS Board for further details. IBIS QUALITY TASK GROUP Mike LaBonte reported that the IBIS Quality Specification Version 2.0 is up for a vote today. At the last meeting the group looked over new IQ checks to see which ones would make good candidates for incorporation into the IBISCHK parser. They submitted a BUG today. The next meeting is November 10. They will be going over a spreadsheet style IQ checklist. Then, they plan to talk about correlation and a possible update to the IQ handbook. The Quality Task Group checklist and other documentation can be found at: http://www.eda-stds.org/ibis/quality_wip/ IBIS MODEL REVIEW TASK GROUP No update. ADVANCED TECHNOLOGY MODELING TASK GROUP Walter Katz reported that the group is looking at flow options for IBIS AMI. They settled on a new flow and controlling parameters for an update in IBIS 5.1. Arpad Muranyi is working on flow charts and documentation. Walter plans to introduce a BIRD with the AMI changes for discussion in the task group. Task group material can be found at: http://www.eda-stds.org/ibis/macromodel_wip/ AD HOC TASK GROUPS (INTERCONNECT) Bob Ross reported that there have been no meetings recently due to absences. The group is dealing with the sparse matrix mapping syntax and technical description. Walter Katz added that the group is discussing what to classify as errors and warnings in the parser. Task group material can be found at: http://www.eda.org/ibis/adhoc/interconnect/ NEW ISSUES None. IBIS QUALITY SPECIFICATION VERSION 2.0 Mike LaBonte stated that many original checks in the IQ specification were already checked with the IBISCHK parser. This revision to the specification adds checks beyond what the IBISCHK parser does. The new specification defines quality levels 0-4. The new document is easier to follow. The new levels also change the way of indicating levels of correlation of the model to measurement and simulation. Mike motioned to approve the document as a formal IBIS Quality specification. The vote passed with the following vote tally: Cadence – yes Cisco – yes Ericsson – yes IBM – yes LSI – yes Micron – yes Nokia Siemens Networks – yes SiSoft – yes Teraspeed – yes The document can be downloaded from: http://www.eda-stds.org/ibis/quality_wip/iq_ver_2_0.pdf IBISCHK5 PARSER STATUS Bob Ross reported that the IBISCHK5 parser was officially released yesterday for 6 different operating systems. Several source code license purchases are pending. Two new flags are added with this update: –ami and –numbered. Some AMI models may need to be updated to conform to the checks in the new parser. The new parser may be downloaded from: http://www.eda.org/pub/ibis/ibischk5 TSCHK2 PARSER STATUS Bob Ross noted that he received a report from the developer at Agilent. The developer is finished with an alpha release, and he should give the first beta version to the committee in a week or so. A license for the parser will be available for $1000. IBISCHK4 BUG STATUS Bob Ross noted that there are several open BUGs that will need to be fixed in the future. The BUG report list is available at the link below: http://www.eda.org/ibis/bugs/ibischk/ ICMCHK1 BUG STATUS All BUGs have been closed. No new BUGs have been filed. NEW ISSUES (Bob Ross moved this discussion to after the brief ICMCHK1 Bug Status report.) Mike LaBonte submitted an IBISCHK BUG on behalf of the IBIS Quality task group this morning. It requests that the [Ramp] dV values be checked against values calculated from combined I-V tables and a caution be issued for deviations of more than 5%. This check would also indirectly indicate a potential issue with the dt value of [Ramp]. Issuing a caution instead of a warning makes it so older models won’t have new warnings to explain. Mike also asked for someone to double check the values he put in the BUG report in the [Ramp] example. The BUG was classified as BUG107 with severity Enhancement, priority Low and status Open. The title of the BUG is “Checking for [Ramp] dV_r and dV_f.” NEXT MEETING The IBIS China summit will be held November 4, 2009. The IBIS Japan summit will be held November 6, 2009. No teleconferences will be available. The next IBIS Open Forum teleconference will be held November 20, 2009 from 8:00 to 10:00 AM US Pacific Standard Time. ======================================================================== NOTES IBIS CHAIR: Bob Ross (503) 246-8048, Fax: (503) 239-4400 bob@teraspeed.com Staff Scientist, Teraspeed Consulting Group 10238 SW Lancaster Road Portland, OR 97219 VICE CHAIR: Lance Wang (978) 633-3388 lwang@iometh.com President / CEO, IO Methodology, Inc. PO Box 2099 Acton, MA 01720 SECRETARY: Randy Wolff (208) 363-1764, Fax: (208) 368-3475 rrwolff@micron.com SI Modeling Manager, Micron Technology, Inc. 8000 S. Federal Way Mail Stop: 01-711 Boise, ID 83707-0006 LIBRARIAN: Anders Ekholm (46) 10 714 27 58, Fax: (46) 8 757 23 40 ibis-librarian@eda.org Digital Modules Design, PDU Base Stations, Ericsson AB BU Network Färögatan 6 164 80 Stockholm, Sweden WEBMASTER: Syed Huq (408) 525-3399, Fax: (408) 526-5504 huqs@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA 95134-1706 POSTMASTER: Mike LaBonte (978) 936-2147 milabont@cisco.com Signal Integrity Engineer, Cisco Systems Mail Stop BXB01/1/ 1414 Massachusetts Ave Boxborough, MA 01719 This meeting was conducted in accordance with the GEIA Legal Guides and GEIA Manual of Organization and Procedure. The following e-mail addresses are used: majordomo@eda.org In the body, for the IBIS Open Forum Reflector: subscribe ibis In the body, for the IBIS Users' Group Reflector: subscribe ibis-users Help and other commands: help ibis-request@eda.org To join, change, or drop from either or both: IBIS Open Forum Reflector (ibis@eda.org) IBIS Users' Group Reflector (ibis-users@eda.org) State your request. ibis-info@eda.org To obtain general information about IBIS, to ask specific questions for individual response, and to inquire about joining the EIA-IBIS Open Forum as a full Member. ibis@eda.org To send a message to the general IBIS Open Forum Reflector. This is used mostly for IBIS Standardization business and future IBIS technical enhancements. Job posting information is not permitted. ibis-users@eda.org To send a message to the IBIS Users' Group Reflector. This is used mostly for IBIS clarification, current modeling issues, and general user concerns. Job posting information is not permitted. ibis-bug@eda.org To report ibischk parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/bugs/ibischk/ http://www.eda.org/ibis/bugs/ibischk/bugform.txt icm-bug@eda.org To report icmchk1 parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/icm_bugs/ http://www.eda.org/ibis/icm_bugs/icm_bugform.txt To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which reside at: http://www.eda.org/ibis/bugs/s2ibis/bugs2i.txt http://www.eda.org/ibis/bugs/s2ibis2/bugs2i2.txt http://www.eda.org/ibis/bugs/s2iplt/bugsplt.txt Information on IBIS technical contents, IBIS participants and actual IBIS models are available on the IBIS Home page: http://www.eigroup.org/ibis/ibis.htm Check the IBIS file directory on eda.org for more information on previous discussions and results: http://www.eda.org/ibis/directory.html Other trademarks, brands and names are the property of their respective owners. IBIS CURRENT MEMBER VOTING STATUS I/O Buffer Information Specification Committee (IBIS) |Organization |Interest |Standard|August |Septemb|October|October| | |Category |s Ballot|28, 2009|er 18, |9, 2009|30, | | | |Voting | |2009 | |2009 | | | |Status | | | | | |Actel |Producer |Inactive| | | | | |Advanced Micro |Producer |Inactive|( | | | | |Devices | | | | | | | |Agilent |User |Inactive| | | | | |Technologies | | | | | | | |Ansoft |User |Inactive| | | | | |Apple Computer |User |Inactive| | | | | |Applied |User |Inactive| | | | | |Simulation | | | | | | | |Technology | | | | | | | |ARM |Producer |Inactive| | | | | |Cadence Design |User |Active |( | |( |( | |Systems | | | | | | | |Cisco Systems |User |Active |( |( |( |( | |Ericsson |Producer |Active |( |( |( |( | |Green Streak |General |Inactive| | | | | |Programs |Interest | | | | | | |Huawei |Producer |Inactive| | | | | |Technologies | | | | | | | |Hitachi ULSI |Producer |Inactive| | | | | |Systems | | | | | | | |IBM |Producer |Inactive| | | |( | |Infineon |Producer |Inactive| | | | | |Technologies AG | | | | | | | |Intel Corp. |Producer |Active |( |( |( | | |IO Methodology |User |Active |( |( |( | | |LSI |Producer |Active | |( |( |( | |Mentor Graphics |User |Active |( |( |( | | |Micron |Producer |Active |( |( |( |( | |Technology | | | | | | | |Nokia Siemens |Producer |Active |( |( |( |( | |Networks | | | | | | | |Samtec |Producer |Inactive| | | | | |Signal Integrity|User |Active |( |( |( |( | |Software | | | | | | | |Sigrity |User |Inactive| | | | | |Synopsys |User |Inactive| | | | | |Teraspeed |General |Active |( |( |( |( | |Consulting |Interest | | | | | | |Toshiba |Producer |Inactive| | | | | |Xilinx |Producer |Inactive| | | | | |ZTE |User |Inactive| | | | | |Zuken |User |Inactive| | | | | Criteria for Member in good standing: • Must attend two consecutive meetings to establish voting membership • Membership dues current • Must not miss two consecutive Meetings Interest categories associated with GEIA ballot voting are: • Users - Members that utilize electronic equipment to provide services to an end user. • Producers - Members that supply electronic equipment. • General Interest - Members are neither producers nor users. This category includes, but is not limited to, Government, regulatory agencies (state and federal), researchers, other organizations and associations, and/or consumers.