IBIS Open Forum Minutes Meeting Date: May 11, 2011 Meeting Location: SPI-E IBIS Summit, Naples, Italy VOTING MEMBERS AND 2011 PARTICIPANTS Agilent Radek Biernacki, Fangyi Rao AMD Nam Nguyen Ansys (Ansoft Corporation) Samuel Martens Apple Computer (Matt Herndon) Applied Simulation Technology Norio Matsui ARM (Nirav Patel) Cadence Design Systems Terry Jernberg, Ambrish Varma, Dennis Nagle, Martin Biehl* Cisco Systems Syed Huq, Mike LaBonte, Luis Boluna, Ashwin Vasudevan, Zhiping Yang Ericsson Anders Ekholm* Freescale (Jon Burnett) Green Streak Programs Lynne Green Hitachi ULSI Systems (Kazuyoshi Shoji) Huawei Technologies Xiaoqing Dong IBM Adge Hawes, Greg Edlund Infineon Technologies AG (Christian Sporrer) Intel Corporation Michael Mirmak, Udy Shrivastava IO Methodology Lance Wang* LSI Brian Burdick Mentor Graphics Arpad Muranyi, Ed Bartlett, Vladimir Dmitriev- Zdorov, Steve Kaufer, Chuck Ferry Micron Technology Randy Wolff*, Andrea Spiezia*, Roberto Izzi*, Aniello Viscardi*, Giovanni Guerra*, Francesco Madonna*, Giuseppe Fusillo* National Semiconductor Hsinho Wu, Pegah Alavi, John Goldie Nokia Siemens Networks GmbH Eckhard Lenski Signal Integrity Software Walter Katz, Todd Westerhoff, Mike Steinberger, Barry Katz Sigrity Raymond Chen, Kumar Keshavan, Yingxin Sun Synopsys Andy Tai, Ted Mido, Scott Wedge Teraspeed Consulting Group Bob Ross*, Kellee Crisafulli, Tom Dagostino, Scott McMorrow Texas Instruments Casey Morrison, Alfred Chong Toshiba (Yasumasa Kondo) Xilinx (Raymond Anderson) ZTE (Huang Min) Zuken (Michael Schaeder) OTHER PARTICIPANTS IN 2011 AET Mikio Kiyono Altera Hui Fu, Zhuyuan Liu, Julia Nekrylova Avago Weiping He, Minh Quach, Sari Tocco Bayside Design Elliot Nahas Broadcom Mohammad Ali Exar Corporation Helen Nguyen Granite River Labs Johnson Tan, Mike Engbretson, Quintin Anderson High Speed Design Center Ben Chia ICT-Lanto Steven Wong KEI Systems Shinichi Maeda Maxim Integrated Products Hassan Rafat Oracle Gustav Blando Politecnico di Torino Igor Stievano*, Stefano Grivet-Talocia* Pristine Signals AbdulRahman (Abbey) Rafiq Renesas Electronics Takuji Komeda Siemens Manfred Maurer* Simberian Yuriy Shlepnev ST Microelectronics Fabio Brina*, Alan Smith* TechAmerica (Chris Denham) Thales Communication Alexandre Amedeo*, Cyril Chastang* University of Illinois Jose Schutt-Aine* University of L'Aquila Danilo di Febo* Vitesse Semiconductor Sirius Tsang Independent Yoichi Niioka In the list above, attendees at the meeting are indicated by *. Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS The bridge numbers for future IBIS teleconferences are as follows: Date Meeting Number Meeting Password May 13, 2011 601 116 211 IBIS For teleconference dial-in information, use the password at the following website: https://cisco.webex.com/cisco/j.php?J=601116211 All teleconference meetings are 8:00 AM to 9:55 AM US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. When calling into the meeting, follow the prompts to enter the meeting ID. For new, local international dial-in numbers, please reference the bridge numbers provided by Cisco Systems at the following link: http://www.cisco.com/web/about/doing_business/conferencing/index.html NOTE: "AR" = Action Required. ---------------------------------------------------------------------------- --------------------------------------------------- OFFICIAL OPENING The IBIS Open Forum Summit was held in Naples, Italy at the Grand Hotel Santa Lucia following the 2011 SPI conference. About 20 people representing 11 organizations attended. The notes below capture some of the content and discussions. The meeting presentations and other documents are available at: http://www.eda.org/ibis/summits/may11/ Lance Wang welcomed all the participants and thanked the co-sponsors Zuken and Micron. He asked all the participants to introduce themselves. IBIS PROJECTS 2011 Bob Ross, Teraspeed Consulting Group Bob Ross gave a summary of the IBIS organization including current activities. The current IBIS parser is version 5.0.6. IBIS-ISS is under review. A cleanup of the IBIS AMI specification is in progress. The IBIS specification is being reformatted into a true .doc/.pdf format. Model Connection Protocol is also in progress and Touchstone is being upgraded to version 2.1. IBIS FILE: PROBLEMS & SOFTWARE SOLUTION Francesco de Paulis, Antonio Orlandi, Danilo di Febo, University of L'Aquila, Italy Danilo di Febo described that a large percentage of IBIS files generate errors and warnings when run through the IBIS checker. He helped develop the Uaq Healing IBIS Tool, version 2.5.1. The tool can automatically fix many common problems. The tool can upgrade the IBIS version and correct errors such as non-monotonic data. It can also add min and max values to C_comp and [Package] parasitics. Danilo showed simulation results before and after use of the tool to correct the model. Randy Wolff asked how the tool corrects non-monotonic data. Is the strategy to correct a combined table or only individual tables of data? Danilo said the strategy is to correct individual tables. Manfred Maurer noted the correct place for usage of the tool is by the model provider, not by the designer. Danilo thought it was useful for engineers that understand the models to be able to correct old models. Another comment was that the use of the tool could be dangerous for model users that don't understand how much to 'correct' the model. Danilo encouraged everyone to provide feedback to improve the tool. THE GOLDEN WAVEFORM FOR QA? Manfred Maurer*, Christian Sporrer**, *Siemens AG, **Infineon Technologies AG, Germany Manfred Maurer noted that an essential requirement from IBIS model users is the comparison of SPICE and IBIS simulation results. Quality reports are valuable, but there is no standard format for automated use and no automated way for checking QA criteria. The Golden Waveform container could be used to concentrate quality information. Model users can evaluate model quality by simulating with the TEST_LOAD. Manfred would like to see a second Golden Waveform generated with the IBIS model in an EDA tool (included in the model) to allow a user to check if their EDA tool gives similar results or incorrect results. He then showed examples of Golden Waveform data. He concluded with suggested improvements for better use of Golden Waveforms. A question was asked if the t-line shown was part of the model data extraction. Manfred said that no, it should be part of the test load only for the Golden Waveform generation. Lance Wang asked about including Golden Waveforms from an IBIS simulation – what simulator do you use? Manfred did not suggest a specific simulator, but he assumed that any should give the same results. Anders Ekholm commented that measurement data cannot be included as Golden Waveforms, because package data cannot be included correctly. FEATURE SELECTIVE VALIDATION Danilo di Febo, Francesco de Paulis, Antonio Orlandi, University of L'Aquila, Italy Danilo di Febo presented that the Uaq laboratory has developed a tool to compare datasets using Feature Selective Validation (FSV). Visual comparisons of datasets are not a good way of classifying levels of similarity. One method for FSV comparisons is Amplitude Difference Measure (ADM). A Feature Different Measure (FDM) can be computed and combined with ADM to generate a Global Different Measure (GDM). The measures report the number of points from the two datasets that fall within categories from excellent to very poor correlation. The tool is available free upon request. Lance Wang asked if the tool is useful for comparing a large dataset or only for looking at small regions of the dataset. Danilo said you can zoom into a small region of interest. Randy Wolff asked if the datasets need to include the same sampling points. Danilo said no, the datasets can include different numbers of samples and are re-sampled within the tool before comparison. Bob Ross commented that there is another methodology (also called feature selective validation) compared measured features such as rise time and pulse width. How does this tool work with that kind of waveform data? Danilo said an FFT of the data would make for a valid comparison. ICEM BASED MODEL FOR ICs EMC ANALYSIS Antonio Maffucci*, Antonio Girardi**, Domenico Capriglione*, Andrea Chiariallo*, Roberto Izzi**, Ignazio Martines**, Giuseppe Fusillo**, Francessco Camarda**, Mauizio Bencivinni**, *University di Cassino, **Micron Technology, Italy Antonio Maffucci presented that his group's task was to analyze the EMC behavior of some devices. Goals were to derive a circuit model for evaluating the currents flowing through the package pins and for evaluating the far field emissions. For measurements of DUTs, a test board was designed to minimize radiation from the board and guarantee signal integrity. The circuit model of the IC and package were based on a standard IEC ICEM approach. An S-parameter model was developed for the test board. The model for the far-field radiated emissions included analysis of loop areas of current within the IC's package. Antonio showed correlation between the model and measurement. He noted that the ICEM model gives good agreement for lower frequencies, but the model was not expected to be valid for higher frequencies. Antonio concluded that the model is good but has room for improvement such as for modeling cavity resonances within the circuit board. A question was asked of what is the methodology for measuring the currents on the test board. Antonio said a high frequency probe (1GHz bandwidth) was used and it was most important to model the jumper inserted on the board for the probe. Another question was what was done to eliminate contributions from the test machine. Antonio said that much shielding was used. The IC was also put in a standby condition and background noise was measured and removed. T-COILS AND BRIDGED-T NETWORKS Bob Ross, Teraspeed Consulting Group, USA Bob Ross introduced T-coils, noting that they are an old technology with current applications such as ESD compensation and bandwidth improvement. He showed improvements on a terminated multi-drop line, the trade-off being more delay in the system. He showed the application of Wang algebra to reduce the complexity of the circuit analysis equations. Many historical applications were shown. There are dozens of contributions in the literature in the last 10 years. IC POWER DELIVERY MODELING Igor Stievano*, Luca Rigazio*, Flavio Canavero*, T. R. Cunha**, J.C. Pedro**, H.M. Teixeira**, Antonio Girardi***, Roberto Izzi***, F. Vitale***, *Politecnico di Torino, Italy, *Instituto de Telecommunicacoes, Portugal, ***Micron Technology, Italy Igor Stievano introduced the MOCHA project. Motivation for the project was to compute parameters from measured data and improve the model for a specific class of devices for System in Package (SiP) signal and power integrity analysis. I/O power rail modeling used a cascade connection of lumped RLC cells. The IC core power delivery model was an equivalent impedance of a Norton equivalent. The current source modeling the core can be derived from numerical simulation. Examples of simulation and measurement correlation were shown. Simulation and measurement were in good agreement when all the cascaded models were included. Igor added that motivation for the project was to develop the simplest model possible. BIRD95 AND BIRD98 SIMULATIONS Randy Wolff*, Lance Wang**, *Micron Technology, **IO Methodology, USA Randy Wolff investigated BIRD95 and BIRD98 implementations in two EDA software tools. An IBIS 5.0 model was developed for a DDR3 device that included [Composite Current], [ISSO PU] and [ISSO PD] tables. He noted that adding [Composite Current] data to the model reduced the valid switching rate of the model. He showed examples of the data tables added to the model. IBISCHK5 was found to be too sensitive with its checks on [ISSO PU] and [ISSO PD] data. Warnings were issued that seemed non-useful. Randy showed simulation results from the two software tools. Four simulations were run with different package models to test BIRD95 and BIRD98 information separately as well as to look at a realistic SSO simulation. VCCQ and VSSQ currents were compared to the original SPICE results. A BUG was found with one of the tools related to over-clocking. VCCQ currents did match well with both tools using a simple package model, but VSSQ currents did not look as good. With a realistic package modeling including inductance and coupling, the results did not match very well with SPICE. Randy concluded that the algorithms could use further improvement. Anders Ekholm asked how he handled package modeling. Randy said that a SPICE subcircuit was used since IBIS incorrectly models on-die decoupling. CONTINUOUS AND DISCRETE MODELING FOR IBIS-AMI Bob Ross, Teraspeed Consulting Group, USA Bob Ross presented methods for relating Laplace transforms, differential equations, difference equations and the Z transform. The methods are useful in IBIS AMI for relating tap coefficients to continuous functions. Bob demonstrated a spreadsheet he developed to do a recursive Taylor series. Many of these functions are built into math programs such as Matlab and can be useful for AMI modeling. CONCLUDING ITEMS Lance Wang closed the meeting by thanking the co-sponsors and the presenters. He also thanked all the attendees for making the meeting a success. The meeting concluded at approximately 5:30 PM. NEXT MEETING The next IBIS Open Forum teleconference will be held May 13, 2011 from 8:00 to 10:00 AM US Pacific Standard Time. ======================================================================== NOTES IBIS CHAIR: Michael Mirmak (916) 356-4261, Fax (916) 377-3788 michael.mirmak@intel.com Platform Applications Engineer, Intel Corporation 1900 Prairie City Rd., FM5-239 Folsom, CA 95630 VICE CHAIR: Lance Wang (978) 633-3388 lwang@iometh.com President/CEO, IO Methodology, Inc. PO Box 2099 Acton, MA 01720 SECRETARY: Randy Wolff (208) 363-1764, Fax: (208) 368-3475 rrwolff@micron.com SI Modeling Manager, Micron Technology, Inc. 8000 S. Federal Way Mail Stop: 01-711 Boise, ID 83707-0006 LIBRARIAN: Anders Ekholm (46) 10 714 27 58, Fax: (46) 8 757 23 40 ibis-librarian@eda.org Digital Modules Design, PDU Base Stations, Ericsson AB BU Network Färögatan 6 164 80 Stockholm, Sweden WEBMASTER: Syed Huq (408) 525-3399, Fax: (408) 526-5504 huqs@cisco.com Manager, Hardware Engineering, Cisco Systems 170 West Tasman Drive San Jose, CA 95134-1706 POSTMASTER: Mike LaBonte (978) 936-2147 milabont@cisco.com Signal Integrity Engineer, Cisco Systems Mail Stop BXB01/1/ 1414 Massachusetts Ave Boxborough, MA 01719 This meeting was conducted in accordance with the GEIA Legal Guides and GEIA Manual of Organization and Procedure. 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IBIS CURRENT MEMBER VOTING STATUS I/O Buffer Information Specification Committee (IBIS) |Organization |Interest |Standard|March |April |April |May 11, | | |Category |s Ballot|11, 2011|1, 2011|22, |2011 | | | |Voting | | |2011 | | | | |Status | | | | | |Advanced Micro |Producer |Active |- |X |X |- | |Devices | | | | | | | |Agilent |User |Active |X |X |X |- | |Technologies | | | | | | | |Ansys |User |Inactive|- |- |- |- | |Apple Computer |User |Inactive|- |- |- |- | |Applied |User |Inactive|- |- |- |- | |Simulation | | | | | | | |Technology | | | | | | | |ARM |Producer |Inactive|- |- |- |- | |Cadence Design |User |Inactive|X |- |- |X | |Systems | | | | | | | |Cisco Systems |User |Active |X |X |X |- | |Ericsson |Producer |Active |X |X |- |X | |Freescale |Producer |Inactive|- |- |- |- | |Green Streak |General |Inactive|- |- |- |- | |Programs |Interest | | | | | | |Huawei |Producer |Inactive|- |- |- |- | |Technologies | | | | | | | |Hitachi ULSI |Producer |Inactive|- |- |- |- | |Systems | | | | | | | |IBM |Producer |Inactive|X |X |- |- | |Infineon |Producer |Inactive|- |- |- |- | |Technologies AG | | | | | | | |Intel Corp. |Producer |Active |X |X |X |- | |IO Methodology |User |Active |X |X |X |X | |LSI |Producer |Inactive|X |- |- |- | |Mentor Graphics |User |Active |X |X |X |- | |Micron |Producer |Active |X |X |- |X | |Technology | | | | | | | |National |Producer |Inactive|- |- |- |- | |Semiconductor | | | | | | | |Nokia Siemens |Producer |Inactive|X |X |- |- | |Networks | | | | | | | |Signal Integrity|User |Active |X |X |X |- | |Software | | | | | | | |Sigrity |User |Inactive|- |- |X |- | |Synopsys |User |Inactive|- |- |- |- | |Teraspeed |General |Active |X |X |X |X | |Consulting |Interest | | | | | | |Texas |Producer |Inactive|- |- |- |- | |Instruments | | | | | | | |Toshiba |Producer |Inactive|- |- |- |- | |Xilinx |Producer |Inactive|- |- |- |- | |ZTE |User |Inactive|- |- |- |- | |Zuken |User |Inactive|- |- |- |- | Criteria for Member in good standing: • Must attend two consecutive meetings to establish voting membership • Membership dues current • Must not miss two consecutive Meetings Interest categories associated with TechAmerica ballot voting are: • Users - Members that utilize electronic equipment to provide services to an end user. • Producers - Members that supply electronic equipment. • General Interest - Members are neither producers nor users. This category includes, but is not limited to, Government, regulatory agencies (state and federal), researchers, other organizations and associations, and/or consumers.