IBIS Open Forum Minutes Meeting Date: November 18, 2011 Meeting Location: Yokohama, Japan VOTING MEMBERS AND 2011 PARTICIPANTS Agilent Radek Biernacki, Fangyi Rao, Amolak Badesha, Hiroaki Sasaki*, Sho Okuyama*, Toshinori Kageura* Altera Hui Fu, Zhuyuan Liu, Julia Nekrylova, David Banas AMD Nam Nguyen, Tadashi Arai* ANSYS (Ansoft) Samuel Mertens, YanJun (Yuki) Chen, Minggang Hou, Rui Li, Eiji Nakamoto*, Miyo Kawata*, Kazuhiro Kadota*, Toru Watanabe*, Yuji Saeki* Apple Computer (Matt Herndon) Applied Simulation Technology Norio Matsui, Osamu Nakamura* Cadence Design Systems Terry Jernberg, Ambrish Varma, Dennis Nagle, Martin Biehl, Yukio Masuko, Aileen Chen, Lanbing Chen, Yubao Meng, Liu Ping, Yitong Wen, Dingru Xiao, Benny Yan, Jinhui Zhang, Rong Zhang, Weijan Zhang, Alex Zhao, Zhangmin Zhong, Zhongyoung Zhou, Morihiro Nakazato*, Yukio Masuko* Cisco Systems [Syed Huq], [Mike LaBonte], Luis Boluna, Ashwin Vasudevan, Zhiping Yang, Greg (Guan) Fu, Xinyi Hu, Jiang Wang, Zhongfu Gu, Lihua Yuan, Xinghai Tang, Yang Wu, Chunyuan Zhou Ericsson Anders Ekholm* Foxconn Technology Group (Sogo Hsu) Freescale Takahiro Sato* Green Streak Programs Lynne Green Huawei Technologies Xiaoqing Dong, Yu (Jeff) Chen, ZhenXing Hu, Chunxing Huang, Peng Huang, Randy Zhao, Hongxing Jiang, Qiang Lin, Longfang Lv, Zhengrong Xu, Zhou Yi, Hongcheng Yin, Tinghou Chen, Luyu Ma, Gezi Zhang, Iris Lou, Tuhua Yu, Ying Zhang IBM Adge Hawes, Greg Edlund Infineon Technologies AG (Christian Sporrer) Intel Corporation Michael Mirmak, Udy Shrivastava, Heather Monigan, Jinsong Hu, Y.L. Li, Yinglei Zheng, Long Yang, Weifeng Shu IO Methodology Lance Wang LSI Brian Burdick Mentor Graphics Arpad Muranyi, Ed Bartlett, Vladimir Dmitriev- Zdorov, Steve Kaufer, Chuck Ferry, Kenji Kushima*, Minoru Ishikawa* Micron Technology Randy Wolff, Andrea Spiezia, Roberto Izzi, Aniello Viscardi, Giovanni Guerra, Francesco Madonna, Giuseppe Fusillo Nokia Siemens Networks GmbH Eckhard Lenski, Xiaoguang Cai, Hongwei Fu, Bruce (Zhenshui) Qin, Xiaoping Yang, Xiangpeng Yao, Jieping Zhang, Xianzhao Zhao QLogic David Choe, James Zhou Signal Integrity Software Walter Katz, Todd Westerhoff, Mike Steinberger, Barry Katz, Mike LaBonte Sigrity Raymond Chen, Kumar Keshavan, Yingxin Sun Li Li, Kezhou Li, Jing Wang, Xingfeng Li, Haisan Wang, Zuli Qin, Lily Luo Synopsys Andy Tai, Ted Mido, Scott Wedge, Xuefeng Chen, Maggie Dai, Zerui Fan, Wenyun Gu, Jianghua Huang, Bo Liu Teraspeed Consulting Group Bob Ross*, Kellee Crisafulli, Tom Dagostino, Scott McMorrow Texas Instruments Casey Morrison, Alfred Chong (National Semiconductor - [Hsinho Wu], Pegah Alavi, John Goldie merged with TI) Toshiba Kenji Ito*, Shigeo Kida*, Yasuki Torigoshi*, Yasutaka Oodake* Xilinx (Raymond Anderson) ZTE Bi Yi, HuaZheng Cao, Fenling Gao, Xiaolin Ghen, Mai Hu, Wei Jia, Hui Jiang, Ganghui Li, Wanming Mao, Baofei Qian, Anbing Sun, Hao Tian, Junfeng Wang, Yingxin Wang, Yunfeng Wang, Meihua Xu, Changgang Ying, Qiang Zhang, Wei Zhou, Zhi Zhou, Jiangrong Xiao, Xiaobing Zhang, Zhiwei Yang, Shenghu Wang, Dawei Sun, Cheng Li, Lu Li, Li Wang, Renjie Wang, Jie Yu, Shunlin Zhu Zuken Hirohiko Matsuzawa*, Hironari Kibe*, Makiko Shimizu*, Yuichi Nakajima* OTHER PARTICIPANTS IN 2011 3M Kylin Chen, Shiang Yao AET Mikio Kiyono, Chihiro Ueda* Anymid Group Charles Zhou Apache Design Solutions Shulong Wu Apollo Giken Mitsuo Kaetsu*, Naoya Iisaka*, Satoshi Endo* Arrow Electronics Ian Dodd ATE Service Yutaka Honda* Avant Technology Enson Lee Avago Weiping He, Minh Quach, Sari Tocco Axell Nobumasa Iwakoshi* Bayside Design Elliot Nahas Broadcom Mohammad Ali Canon Kohji Hirai*, Matsumoto Shoji*,Takamasa Sakuragi*, Yoshihiro Kobayashi* Canon Components Syohtaro Hiramatsu* Casio Computer Yasuhisa Hayashi* Celestica Sophia Feng, Lily Dai, Jason Liu, Yunqiang Meng, Junwei Zhang, Harrison Xue, Van Zhu CST Martin Schauer Cybernet Systems Masahito Kobayashi*, Takayuki Tsuzura* Denso Kouji Ichikawa*, Takahiro Tsuda* East China Normal University Mengting Liao Eastwell David Wu EDADOC Technology Hansheng Ke, Bruce Wu Electro System Kazuyuki Saijo* EMC Corporation Abigail Jiang, Peng (Tony) Liu, Lynn Kong, Chambers Yin E-Train Technology Weiming (David) Lu Exar Corporation Helen Nguyen Flextronics Golden Qiang Fujitsu Advanced Technologies Hiroyuki Kawata*, Syogo Fujimori*, Toshiro Sato* Fujitsu Electronics Kenji Goto* Fujitsu Microelectronics Solutions Daisuke Suzuki* Fujitsu Semiconductor Masaaki Suzuki*, Motoaki Matsumura*, Shintaro Otani*, Toshiki Iwai* Fujitsu VLSI Hiroki Kubota*, Hiroshi Miyazaki*, Kyota Shimizu*, Sizue Kato* Giga Hertz Technology Ryuji Kawamura* Granite River Labs Johnson Tan, Mike Engbretson, Quintin Anderson H3C Technologies Huanyang Chen, Haitao Zhang, Xiaoqun Li Hakkao Denshi Eiji Mita* High Speed Design Center Ben Chia Hino Jisso Design Sigekazu Hino* Hitachi Makoto Okumura*, Ritsurou Orihashi*, Shingo Suzuki* Hitachi Global Storage Takayuki Imai* Technologies Hitachi Information and Control Hiroyuki Tayama* Systems Hitachi ULSI Systems Hiroshi Uematsu*, Kazuhiko Sugisaki*, Sadahiro Nonoyama* IBITECH Hitoshi Miwa*, Kiyohisa Hasegawa* ICT-Lanto Steven Wong IMU Runjong Zhou Inventec Zhong Peng Japan Futec Kenji Ishida* JEITA Atsushi Ishikawa* JVC Kenwood Hidetoshi Suzuki* Kawasaki Microelectronics Hajime Kinugasa*, Yoshimasa Yahata* KEI Systems Shinichi Maeda* Kyoden Hiroshi Hohga*, Katsuhiro Ota*, Sinichi Mochida*, Takao Saito*, Takehiko Murata* Lapis Semiconductor Kenji Arai* Lecroy Derek Hu Marvell Semiconductor Fang Lv, Guobing Han, Yuyang Wang, Liang Wu, Michael Wang, Xike Liu, Zhiqiang Li Maxim Integrated Products Hassan Rafat MD Systems Hidetoshi Ogawa* Mindspeed Jeff Li, Lyn Wang Mitsubishi Electric Engineering Toshio Ueda* NEC Hiroshi Yamaguchi*, Tomohiro Hayashi*, Tomokazu Tokoro*, Toshihiko Nakano* NEC Communication Systems Tsuneo Kikuchi* NEC Toppan Circuit Solutions Kiyohiko Kaiya*, Masanori Naito*, Toshiyuki Kaneko* NetLogic Ryan Coutts, Antonis Orphanou Nikon Kazuomi Tominaga*, Manabu Matsumoto*, Toshiyuki Kobayashi* Nisoul Fumio Tazaki*, Toshio Hoshi* Oki Electric Industry Atsushi Kitai* Olympus Kazuhiro Sakamoto* Olympus Medical Systems Hiroshi Tamai* Oracle Gustav Blando Panasonic Yoshiyuki Saito* Pericom Semiconductor Zhangqi Guo, Jun Li, Qing Mao Politecnico di Torino Igor Stievano, Stefano Grivet-Talocia Pristine Signals AbdulRahman (Abbey) Rafiq Renesas Electronics Takuji Komeda, Masafumi Mituishi*, Mikiko Sode*, Naho Hokoiwa*, Osamu Takeuchi*, Soji Sunairi*, Tatsuaki Tsukuda* Renesas Micro Systems Munehisa Okita*, Yoshihiro Kikuchi* Ricoh Shigeru Isobe*, Toshihiko Makino*, Yasuhiro Akita* Rohm Yutaka Okui* Samsung Electronics Il Seong Samsung Yokohama Research Toshiyuki Hasegawa* Institute Sanritz Automation Masamichi Yahara* Shimadzu Kazuo Nakajima* Siemens Manfred Maurer Signal Khobho Atsuhito Noda* Signal-Lab Sei Shida* Simberian Yuriy Shlepnev* Sony EMCS Shigeru Sana* Spreadtrum Communications Xianyu Meng ST Microelectronics Fabio Brina, Alan Smith Taiyo Yuden Masayuki Satou* TDK Katsufumi Ehata*, Yoshikazu Fujishiro* TechAmerica (Chris Denham) Teradyne Makoto Kikuchi*, Takeshi Shimabukuro* Tellabs Yuehui Zhu Thales Communication Alexandre Amedeo, Cyrip Chastang Tianma Micro-electronics Xiaoyan Lai, Shengjie Yang Tokyo Cathode Laboratory Akitoshi Nishimura* Tokyo University of Science Yohtaro Yasu* Graduate School Toshiba Digital Media Engineering Kouji Yasutake* Trident Microsystems Andy (Zhiguang) Li University of Illinois Jose Schutt-Aine University of L'Aquila Danilo di Febo Vitesse Semiconductor Siris Tsang WADOW Kazuhiko Kusunoki* Wens Heien Hirokawa* Xpeedic Technology Feng Ling, Wenliang Dai, Shisheng Wu Yazaki Kazuki Hattori* YDC Yoshiaki Manabe* YDK Yoshio Takemura* Independent Yoichi Niioka, [Mike LaBonte], Mingwei Chen, Liping Wang In the list above, attendees at the meeting are indicated by *. Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS The bridge numbers for future IBIS teleconferences are as follows: Date Meeting Number Meeting Password November 21, 2011 Asian IBIS Summit – Taipei – no teleconference December 9, 2011 205 475 958 IBIS For teleconference dial-in information, use the password at the following website: https://ciscosales.webex.com/ciscosales/j.php?J=205475958 All teleconference meetings are 8:00 AM to 9:55 AM US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. When calling into the meeting, follow the prompts to enter the meeting ID. For new, local international dial-in numbers, please reference the bridge numbers provided by Cisco Systems at the following link: http://www.cisco.com/web/about/doing_business/conferencing/index.html NOTE: "AR" = Action Required. ---------------------------------------------------------------------------- --------------------------------------------------- WELCOME AND KEYNOTE COMMENTS The IBIS Open Forum summit was held in Yokohama, Japan, co-located with the Electronics Design Solutions Fair (EDS Fair) at the Pacifico Yokohama Conference Center. About 131 people representing 74 organizations attended. The notes below capture some of the content and discussions. The meeting presentations and other documents are available at: http://www.eda.org/pub/ibis/summits/nov11b/ Bob Ross (on behalf of Michael Mirmak) opened the sixth Asian IBIS Summit in Japan at 1:30 PM. Yasutaka Oodake (JEITA EC Working Group Chair and Toshiba Corporation) welcomed everyone and thanked the international attendees. Bob Ross provided some brief remarks, thanked the co-sponsors ANSYS, ATE Service Corporation (Sigrity), Cadence Design Systems, Mentor Graphics Corporation and Zuken. Bob noted that this was the sixth meeting and that cooperation with JEITA had provided strong IBIS support. He cited the recent publication in Japanese of a signal integrity book with strong IBIS content. He thanked JEITA for arranging the meeting and providing excellent facilities. IBIS UPDATE AND PARSERS Bob Ross (Teraspeed Consulting Group, USA) Bob Ross first gave a brief overview of the IBIS Open Forum and its recent activities. He showed the revised home page and then described its organization within TechAmerica and under the SSTC (Standards and Technology Council). IBIS-ISS (IBIS-Interconnect Spice Subcircuit) Specification, a subset of HSpice was recently introduced. Work is continuing on IBIS Version 5.1. Work on IBIS Version 5.2 (or 6.0), and Touchstone Version 2.1 is continuing. Also, ibischk5 and touchstone2 parsers are being maintained. Bob summarized the latest parser release, ibischk5, Version 5.0.7. The IBIS committee has spent over $114,000 since the beginning in 1993. Bob illustrated some of the recent flags and functionality and showed how 1155 unique Error, Warning, Notes, and Caution message strings are documented in a spreadsheet format. This allows sorting of messages in several ways such as by severity or by source code modules. Messages for specific areas (such as for the IBIS-AMI .ami syntax) can be grouped. This will be released in the future, but at this time only about 350 of the 1,155 messages have descriptions filled in. The recent parser fixed problems with the dV check, the [Model Spec timing test load entry processing and demoted the Error check for [ISSO PU] and [ISSO PD] time alignment to a Caution message (in anticipation for the removal of the requirement in IBIS Version 5.1). The tschk2 parser was also summarized. It allows both checking of Touchstone Version 2.0 and Touchstone Version 1.0 and conversion between the two formats. The parser source code package already contains the documentation of 71 Error and Warning messages in an html format. Bob illustrated how these messages are grouped. Both of these parsers serve to check the specification and also check actual files for specification and value compliance. As a result, the parsers are critical to IBIS success. QUALITY OF S-PARAMETER MODELS Yuriy Shlepnev (Simberian, USA) Yuriy Shlepnev indicated that S-parameter models including Touchstone files have these quality issues: reciprocity failure, passivity and causality violations, and common sense violations. These issues can cause different tools to produce different time-domain and frequency-domain responses. Discrete models are approximated by the discrete Fourier transform and by rational functions. Some common problems in models include bandwidth deficiency (DC and high frequency), discreteness (interpolation required), and distortions (measurement artifacts, passivity violations, and causality violations). Yuriy showed the derivations and provided estimation methods for quantifying these defects. He suggested metrics, normalized to a 0 to 100% range: Passivity Quality Measure (PQM), Reciprocity Quality Measure (RQM), and Causality Quality Measure (CQM). He also suggested ranges for which models are good, acceptable, inconclusive and bad. The acceptable level is PQM > 99%, RQM > 99% and CQM > 80%. Yuriy also suggested using rational or broad band models for more consistent time and frequency domain analysis. IBIS MODEL AS DE-FACTO STANDARD Kazuhiko Kusunoki* and Wenliang Dai** (*WADOW, Japan and **Xpeedic Technology, China) Kazuhiko Kusunoki questioned whether the same IBIS model produced the same results in different simulators. He presented the results of differential buffer IBIS model test cases analyzed on six different simulators. No two results were identical, and the differential buffer output crossing points ranged from 600 mV to 764 mV. The IBIS Quality Framework within JEITA is attempting to address this issue. It sets a framework where IBIS models can be checked and where simulators can be validated against reference IBIS models with known simulation results. Kazuhiko also noted that operator experience is a factor. In one experiment, different operators produced different results for the same simulator. What the industry needs is good IBIS models, good tools, good engineers and good support. Yuriy Shlepnev suggested that the Touchstone models also be checked in a similar manner against different simulators, and Kazuhiko stated that he would consider doing this. DDR3 SI/PI ANALYSIS USING IBIS5.0 Shintaro Ohtani (Fujitsu Semiconductor, Japan) Shintaro Ohtani stated that SI/PI (signal integrity, power integrity) analysis is becoming necessary for higher speed DDR3 design. Traditional netlist analysis is too slow and may require encrypted models available only through NDA and for specific tools. He showed that IBIS simulation is very accurate for SI analysis when he compared by an eye diagram simulation with measured results. Shintaro illustrated the composite current (BIRD95) and ISSO_PU/ISSO_PD advances (BIRD98) in IBIS Version 5.0 to support SSO analysis. He also noted that the parasitic RC between power and ground was needed to make the results nearly identical for SSO noise and signal distortion with reference to transistor level simulations. However, he showed delay penalty differences for the DQ signal between the transistor level results and the IBIS simulation results (36 ps versus 15 ps). This prompted several questions and discussion. Shintaro concluded that the delay penalty difference is a limitation in IBIS 5.0 and is a future challenge that needs to be addressed. IBIS AMI SEEN FROM USER’S VIEWPOINT Shinichi Maeda (KEI Systems, Japan) Shinichi Maeda compared IBIS and Spice. Good support exists for standard IBIS. IBIS-AMI gives new life to IBIS for SerDes analysis. Shinichi then gave a brief overview of the [Begin Algorithmic Model] calling sequence and the parameter file (.ami file content). From a user’s perspective, Shinichi stated that verification is needed to trust IBIS-AMI model accuracy. More support is needed (cookbook, golden parser, tools, curve viewer, tune-up guidance, supporting tools). He stated that some tools work better than others. Also needed are verification tools, more documentation that includes a simulation result example and trouble-shooting guidance and a model quality document. With more IBIS-AMI infrastructure, both legacy IBIS and IBIS-AMI models can be released. ANALYZING CROSSTALK’S IMPACT ON BER PERFORMANCE: METHODS AND SOLUTIONS Minoru Ishikawa (Mentor Graphics Corporation, Japan) Minoru Ishikawa presented some historical background since 2006. He provided an overview for IBIS-AMI to dynamically link compiled algorithmic models with IBIS buffer models for channel interconnects in SerDes designs. In addition to the standard IBIS flow, IBIS-AMI includes TX equalization, RX equalization, and clock data recovery. Minoru presented multi-channel analysis with some examples showing how the victim is impacted by near end (NEXT) and far end (FEXT) aggressors. Two time-domain approaches for crosstalk are used. For linear channels, the frequency response can be converted by IFFT, and for non-linear channels actual time-domain simulation is performed. In addition, four combinations exist: synchronous or asynchronous time- domain crosstalk, and synchronous or asynchronous statistical time-domain crosstalk. Synchronous analysis assumes that there are constant phase of transitions, and asynchronous analysis assumes that the phases in different channels are statistically independent. Minoru listed the features and advantages of these approaches and compared some eye diagrams for each. He stated that it is important to understand the advantages and limitations of 4-port S-parameter models, neither synchronous nor asynchronous methods are perfect, but information from either method can be useful. SUPPORTING EXTERNAL CIRCUIT AS SPICE OR S-PARAMETERS IN CONJUNCTION WITH I- V/V-T TABLES Kent Dramstad# and Adge Hawes## (IBM, #USA, ##United Kingdom); Taranjit Kukal###, Feras Al-Hawari#, Ambrish Varma#, and Terry Jernberg# (Cadence Design Systems, ###India, #USA) Yukio Masuko (Cadence Design Systems, Japan) introduced two sets of requirements that are related to proposed BIRDs: BIRD144 - to connect IBIS with S-parameters directly, and BIRD145 - to connect IBIS buffers with on- die terminations (ODT) or with re-distribution layer (RDL) parasitics. The current proposals have S-parameter models wrapped within Spice models (IBIS- ISS). IBIS models need to be connected directly to [External Circuit]s. BIRD144 proposes a new language “Touchstone” to connect S-parameter models for [External Circuit] and [External Model] support without involving Spice wrappers. Standard Typ/Min/Max corners can be supported, and Yukio showed how this can be extended to new user-defined corners with some sample listings. BIRD145 proposes a new keyword, [Model Call], to connect IBIS models and on- die [External Circuit]s for ODT and RDL connections. Yukio showed several examples to illustrate these connections. Yukio concluded that both BIRD144 and 145 are needed enhancements for higher frequency analysis. MODEL CONNECTIVITY IN PDN ANALYSIS FOR 3D-SIP Brad Brim# and Yutaka Honda## (Sigrity, #USA, ##Japan) Yutaka Honda showed 3D-SiP power distribution networks (PDN) for distributed dies (e.g., power/ground mesh on silicon imposer), stacked dies (e.g., vertical paths with through silicon vias), and wirebond connections from a package. Decoupling capacitors shape the SSO frequency and time domain noise characteristics. SSO analysis is influenced by including adjacent circuits, by actual physical die location, and by coupling through packages. To handle all of these effects in a unified flow, a model connection protocol (MCP) is needed. Yutaka illustrated a protocol that contains IBIS- like keywords and describes pin_name, node_name, net, and coordinate. Such a protocol had been presented at earlier IBIS Summits to interface chip, package, and board models. (The proposal was also considered by the IBIS committee, but is now being considered by the Silicon Integration Initiative (Si2) organization, which focuses more on chip modeling.) One MCP feature is its density control to map the pin resolution to the same level as the destination circuit (by grouping a node per power domain). Yutaka showed some examples of applying the MCP for what-if analysis. CONCLUDING ITEMS Bob Ross thanked Atsushi Ishikawa and Yasutaka Oodake of JEITA for arranging the meeting. Bob also thanked the sponsors and the presenters. He thanked Yukio Masuko (Cadence Design Systems) and Shinichi Maeda (KEI Systems) for assisting in English-to-Japanese translation. He also thanked the attendees for providing strong support, and he looked forward to another Summit in 2012. The meeting adjourned at approximately 5:45 PM. NEXT MEETING The Asian IBIS Summit – Taipei will be held November 21, 2011. The next IBIS Open Forum teleconference will be held December 9, 2011 from 8:00 to 10:00 AM US Pacific Time. Votes on BIRD127.4 and BIRD146 are scheduled. ======================================================================== NOTES IBIS CHAIR: Michael Mirmak (916) 356-4261, Fax (916) 377-3788 michael.mirmak@intel.com Data Center Platform Applications Engineering Intel Corporation FM5-239 1900 Prairie City Rd., Folsom, CA 95630 VICE CHAIR: Lance Wang (978) 633-3388 lwang@iometh.com President/CEO, IO Methodology, Inc. PO Box 2099 Acton, MA 01720 SECRETARY: Randy Wolff (208) 363-1764, Fax: (208) 368-3475 rrwolff@micron.com SI Modeling Manager, Micron Technology, Inc. 8000 S. Federal Way Mail Stop: 01-711 Boise, ID 83707-0006 LIBRARIAN: Anders Ekholm (46) 10 714 27 58, Fax: (46) 8 757 23 40 ibis-librarian@eda.org Digital Modules Design, PDU Base Stations, Ericsson AB BU Network Färögatan 6 164 80 Stockholm, Sweden WEBMASTER: Mike LaBonte mikelabonte@eda.org IBIS-AMI Modeling Specialist, Signal Integrity Software 6 Clock Tower Place Maynard, MA 01754 POSTMASTER: Mike LaBonte mikelabonte@eda.org IBIS-AMI Modeling Specialist, Signal Integrity Software 6 Clock Tower Place Maynard, MA 01754 This meeting was conducted in accordance with the TechAmerica Legal Guides and TechAmerica Manual of Organization and Procedure. The following e-mail addresses are used: majordomo@eda.org In the body, for the IBIS Open Forum Reflector: subscribe ibis In the body, for the IBIS Users' Group Reflector: subscribe ibis-users Help and other commands: help ibis-request@eda.org To join, change, or drop from either or both: IBIS Open Forum Reflector (ibis@eda.org) IBIS Users' Group Reflector (ibis-users@eda.org) State your request. ibis-info@eda.org To obtain general information about IBIS, to ask specific questions for individual response, and to inquire about joining the IBIS Open Forum as a full Member. ibis@eda.org To send a message to the general IBIS Open Forum Reflector. This is used mostly for IBIS Standardization business and future IBIS technical enhancements. Job posting information is not permitted. ibis-users@eda.org To send a message to the IBIS Users' Group Reflector. This is used mostly for IBIS clarification, current modeling issues, and general user concerns. Job posting information is not permitted. ibis-bug@eda.org To report ibischk parser BUGs as well as tschk2 parser BUGs. The BUG Report Form for ibischk resides along with reported BUGs at: http://www.eda.org/ibis/bugs/ibischk/ http://www.eda.org/ibis/bugs/ibischk/bugform.txt The BUG Report Form for tschk2 resides along with reported BUGs at: http://www.eda.org/ibis/tschk_bugs/ http://www.eda.org/ibis/tschk_bugs/bugform.txt icm-bug@eda.org To report icmchk1 parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/icm_bugs/ http://www.eda.org/ibis/icm_bugs/icm_bugform.txt To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which reside at: http://www.eda.org/ibis/bugs/s2ibis/bugs2i.txt http://www.eda.org/ibis/bugs/s2ibis2/bugs2i2.txt http://www.eda.org/ibis/bugs/s2iplt/bugsplt.txt Information on IBIS technical contents, IBIS participants and actual IBIS models are available on the IBIS Home page: http://www.eda.org/ibis Check the IBIS file directory on eda.org for more information on previous discussions and results: http://www.eda.org/ibis/directory.html To create an account on the TechAmerica KAVI workspace, check out: http://workspace.techamerica.org/kwspub/join/ Other trademarks, brands and names are the property of their respective owners. IBIS CURRENT MEMBER VOTING STATUS I/O Buffer Information Specification Committee (IBIS) |Organization |Interest |Standar|October|October|Novembe|Novembe| | |Category |ds |7, 2011|28, |r 15, |r 18, | | | |Ballot | |2011 |2011 |2011 | | | |Voting | | | | | | | |Status | | | | | |Advanced Micro |Producer |Active |X |X |- |X | |Devices | | | | | | | |Agilent |User |Active |- |X |- |X | |Technologies | | | | | | | |Altera |Producer |Inactiv|X |- |- |- | | | |e | | | | | |ANSYS |User |Active |- |- |X |X | |Apple Computer |User |Inactiv|- |- |- |- | | | |e | | | | | |Applied |User |Inactiv|- |- |- |X | |Simulation | |e | | | | | |Technology | | | | | | | |Cadence Design |User |Active |- |X |X |X | |Systems | | | | | | | |Cisco Systems |User |Inactiv|- |- |X |- | | | |e | | | | | |Ericsson |Producer |Active |- |X |X |X | |Foxconn |Producer |Inactiv|- |- |- |- | |Technology Group | |e | | | | | |Freescale |Producer |Inactiv|- |- |- |X | | | |e | | | | | |Green Streak |General |Inactiv|- |- |- |- | |Programs |Interest |e | | | | | |Huawei |Producer |Inactiv|- |- |X |- | |Technologies | |e | | | | | |IBM |Producer |Inactiv|X |X |- |- | | | |e | | | | | |Infineon |Producer |Inactiv|- |- |- |- | |Technologies AG | |e | | | | | |Intel Corp. |Producer |Active |X |- |X |- | |IO Methodology |User |Active |X |- |X |- | |LSI |Producer |Inactiv|X |X |- |- | | | |e | | | | | |Mentor Graphics |User |Active |X |X |- |X | |Micron Technology|Producer |Inactiv|X |X |- |- | | | |e | | | | | |Nokia Siemens |Producer |Active |X |X |X |- | |Networks | | | | | | | |QLogic |Producer |Inactiv|- |- |- |- | | | |e | | | | | |Signal Integrity |User |Inactiv|X |X |- |- | |Software | |e | | | | | |Sigrity |User |Inactiv|- |- |X |- | | | |e | | | | | |Synopsys |User |Inactiv|- |- |X |- | | | |e | | | | | |Teraspeed |General |Active |X |X |X |X | |Consulting |Interest | | | | | | |Texas Instruments|Producer |Inactiv|- |- |- |- | | | |e | | | | | |Toshiba |Producer |Inactiv|- |- |- |X | | | |e | | | | | |Xilinx |Producer |Inactiv|- |- |- |- | | | |e | | | | | |ZTE |User |Inactiv|- |- |X |- | | | |e | | | | | |Zuken |User |Inactiv|- |- |- |X | | | |e | | | | | Criteria for Member in good standing: • Must attend two consecutive meetings to establish voting membership • Membership dues current • Must not miss two consecutive Meetings Interest categories associated with TechAmerica ballot voting are: • Users - Members that utilize electronic equipment to provide services to an end user. • Producers - Members that supply electronic equipment. • General Interest - Members are neither producers nor users. This category includes, but is not limited to, Government, regulatory agencies (state and federal), researchers, other organizations and associations, and/or consumers.