IBIS Open Forum Minutes Meeting Date: December 9, 2011 Meeting Location: Teleconference VOTING MEMBERS AND 2011 PARTICIPANTS Agilent Radek Biernacki*, Fangyi Rao, Amolak Badesha, Hiroaki Sasaki, Sho Okuyama, Toshinori Kageura Altera Hui Fu, Zhuyuan Liu, Julia Nekrylova, David Banas AMD Nam Nguyen, Tadashi Arai ANSYS (Ansoft) Samuel Mertens, YanJun (Yuki) Chen, Minggang Hou, Rui Li, Eiji Nakamoto, Miyo Kawata, Kazuhiro Kadota, Toru Watanabe, Yuji Saeki, Nai-Jen Hsuan, Benson Wei, Jack (ChunKun) Wu Apple Computer (Matt Herndon) Applied Simulation Technology Norio Matsui, Osamu Nakamura Cadence Design Systems Terry Jernberg*, Ambrish Varma*, Dennis Nagle, Martin Biehl, Yukio Masuko, Aileen Chen, Lanbing Chen, Yubao Meng, Liu Ping, Yitong Wen, Dingru Xiao, Benny Yan, Jinhui Zhang, Rong Zhang, Weijan Zhang, Alex Zhao, Zhangmin Zhong, Zhongyoung Zhou, Morihiro Nakazato, Joseph Kao Charlie Shih, Feras Al-Hawari* Cisco Systems [Syed Huq], [Mike LaBonte], Luis Boluna, Ashwin Vasudevan, Zhiping Yang, Greg (Guan) Fu, Xinyi Hu, Jiang Wang, Zhongfu Gu, Lihua Yuan, Xinghai Tang, Yang Wu, Chunyuan Zhou Ericsson Anders Ekholm* Foxconn Technology Group Gina Chen, Eric Hsieh, Gerald C.J. Hsu, Scott C.S. Li, Delbert Liao, Mandy Su, Joyce C.Y. Yeh Freescale Takahiro Sato Green Streak Programs Lynne Green Huawei Technologies Xiaoqing Dong, Yu (Jeff) Chen, ZhenXing Hu, Chunxing Huang, Peng Huang, Randy Zhao, Hongxing Jiang, Qiang Lin, Longfang Lv, Zhengrong Xu, Zhou Yi, Hongcheng Yin, Tinghou Chen, Luyu Ma, Gezi Zhang, Iris Lou, Tuhua Yu, Ying Zhang IBM Adge Hawes*, Greg Edlund, Evelyn Kuo, David Lai Kent Dramstad* Infineon Technologies AG (Christian Sporrer) Intel Corporation Michael Mirmak*, Udy Shrivastava, Heather Monigan, Jinsong Hu, Y.L. Li, Yinglei Zheng, Long Yang, Weifeng Shu, Kevin Daverin, Jimmy Hsu, Morgan Tseng IO Methodology Lance Wang* LSI Brian Burdick* Mentor Graphics Arpad Muranyi*, Ed Bartlett, Vladimir Dmitriev- Zdorov, Steve Kaufer, Chuck Ferry, Kenji Kushima, Minoru Ishikawa Micron Technology Randy Wolff*, Andrea Spiezia, Roberto Izzi, Aniello Viscardi, Giovanni Guerra, Francesco Madonna, Giuseppe Fusillo Nokia Siemens Networks GmbH Eckhard Lenski*, Xiaoguang Cai, Hongwei Fu, Bruce (Zhenshui) Qin, Xiaoping Yang, Xiangpeng Yao, Jieping Zhang, Xianzhao Zhao QLogic David Choe, James Zhou Signal Integrity Software Walter Katz, Todd Westerhoff, Mike Steinberger, Barry Katz, Mike LaBonte* Sigrity Raymond Chen, Kumar Keshavan, Yingxin Sun* Li Li, Kezhou Li, Jing Wang, Xingfeng Li, Haisan Wang, Zuli Qin, Lily Luo, Polin Chi, Joshua Luo, Jack W.C. Lin, Thunder Lui Synopsys Andy Tai, Ted Mido, Scott Wedge, Xuefeng Chen, Maggie Dai, Zerui Fan, Wenyun Gu, Jianghua Huang, Bo Liu Teraspeed Consulting Group Bob Ross*, Kellee Crisafulli, Tom Dagostino, Scott McMorrow Texas Instruments Casey Morrison, Alfred Chong (National Semiconductor - [Hsinho Wu], Pegah Alavi, John Goldie merged with TI) Toshiba Kenji Ito, Shigeo Kida, Yasuki Torigoshi, Yasutaka Oodake Xilinx (Raymond Anderson) ZTE Bi Yi, HuaZheng Cao, Fenling Gao, Xiaolin Ghen, Mai Hu, Wei Jia, Hui Jiang, Ganghui Li, Wanming Mao, Baofei Qian, Anbing Sun, Hao Tian, Junfeng Wang, Yingxin Wang, Yunfeng Wang, Meihua Xu, Changgang Ying, Qiang Zhang, Wei Zhou, Zhi Zhou, Jiangrong Xiao, Xiaobing Zhang, Zhiwei Yang, Shenghu Wang, Dawei Sun, Cheng Li, Lu Li, Li Wang, Renjie Wang, Jie Yu, Shunlin Zhu Zuken Hirohiko Matsuzawa, Hironari Kibe, Makiko Shimizu, Yuichi Nakajima OTHER PARTICIPANTS IN 2011 3M Kylin Chen, Shiang Yao Accton Technology Daniel Lin, Stu Tsai, Rolf Wu Advantech Kalyuan Cheng Advantest Cassity Chao, Ashley Huang AET Mikio Kiyono, Chihiro Ueda Alchip Technologies John Chou, Adam Su ALi (Alitech) Allfor Chen, Yigong Lu Altek Randy Hsiao Amphenol TCS Kenneth Cheng Anymid Group Charles Zhou Apache Design Solutions Shulong Wu Apollo Giken Mitsuo Kaetsu, Naoyata Iisaka, Satoshi Endo Arrow Electronics Ian Dodd ASE Group Joey Huang ASUSTek Computer David Chou, Yu-Ching Liao ATE Service Yutaka Honda Avant Technology Enson Lee, Jyam Huang Avago Weiping He, Minh Quach, Sari Tocco Axell Nobumasa Iwakoshi Bayside Design Elliot Nahas Broadcom Mohammad Ali Bureau of Standards, Meterology Yentang Chang, MS Lin & Inspection (BSMI) Canon Kohji Hirai, Matsumoto Shoji,Takamasa Sakuragi, Yoshihiro Kobayashi Canon Components Syohtaro Hiramatsu Casio Computer Yasuhisa Hayashi Celestica Sophia Feng, Lily Dai, Jason Liu, Yunqiang Meng, Junwei Zhang, Harrison Xue, Van Zhu CST Martin Schauer Cybernet Systems Masahito Kobayashi, Takayuki Tsuzura Delta Network Sandy Chen, Nick Chiou, Alston Hsia, Skipper Liang, David Huay Denso Kouji Ichikawa, Takahiro Tsuda East China Normal University Mengting Liao Eastwell David Wu EDADOC Technology Hansheng Ke, Bruce Wu Electro System Kazuyuki Saijo EMC Corporation Abigail Jiang, Peng (Tony) Liu, Lynn Kong, Chambers Yin E-Train Technology Weiming (David) Lu Etron Technology Frank Cheng, Fred Hsieh, David Lin, Janice Chen Exar Corporation Helen Nguyen Farady Technology Boris Tseng, Sun Pao Flextronics Golden Qiang, Chris Pan Fujitsu Advanced Technologies Hiroyuki Kawata, Syogo Fujimori, Toshiro Sato Fujitsu Electronics Kenji Goto Fujitsu Microelectronics Solutions Daisuke Suzuki Fujitsu Semiconductor Masaaki Suzuki, Motoaki Matsumura, Shintaro Otani, Toshiki Iwai Fujitsu VLSI Hiroki Kubota, Hiroshi Miyazaki, Kyota Shimizu, Sizue Kato Gigabyte Technology Eric Chien, Andy Lee, Johnson Tsai Giga Hertz Technology Ryuji Kawamura Global Unichip Peter Lai, Darren Hsu, Nicholas Huang Granite River Labs Johnson Tan, Mike Engbretson, Quintin Anderson H3C Technologies Huanyang Chen, Haitao Zhang, Xiaoqun Li Hakkao Denshi Eiji Mita Hewlett-Packard Corey Huay High Speed Design Center Ben Chia Hino Jisso Design Sigekazu Hino Hitachi Makoto Okumura, Ritsurou Orihashi, Shingo Suzuki Hitachi Global Storage Takayuki Imai Technologies Hitachi Information and Control Hiroyuki Tayama Systems Hitachi ULSI Systems Hiroshi Uematsu, Kazuhiko Sugisaki, Sadahiro Nonoyama IBITECH Hitoshi Miwa, Kiyohisa Hasegawa ICT-Lanto Steven Wong ILI Technology Chia-Cheng (Trevor) Wu IMU Runjong Zhou Industrial Technology Research Peng Chen Institute (ITRI) Inventec Zhong Peng, Ian Chen, Paul Chu, Jim Lai Japan Futec Kenji Ishida JEITA Atsushi Ishikawa JVC Kenwood Hidetoshi Suzuki Kawasaki Microelectronics Hajime Kinugasa, Yoshimasa Yahata KEI Systems Shinichi Maeda King Yuan Electronics Co. (KYEC) Bernard Hsu, Vincent Hung, Hung Chan Lin Kyoden Hiroshi Hohga, Katsuhiro Ota, Sinichi Mochida, Takao Saito, Takehiko Murata Lapis Semiconductor Kenji Arai Lecroy Derek Hu Lite-On Technology Skylar Shin Marvell Semiconductor Fang Lv, Guobing Han, Yuyang Wang, Liang Wu, Michael Wang, Xike Liu, Zhiqiang Li Maxim Integrated Products Hassan Rafat*, Mahbubul Bari* MD Systems Hidetoshi Ogawa Mediatek Wayne Tseng, Dean Yang Micro-Star International Cliff Lin, Mindspeed Jeff Li, Lyn Wang Mitsubishi Electric Engineering Toshio Ueda Nanya Technology K.W. Chao, Benton (Yu Wei) Chen, Roger Chen, Argy Cheng, Yumin Cheng, Aidan Hsu, Benedict Hu, Supon Huang, Wen-Ming Lee, Benson Lin, Chinghuei Tseng, Vincent Yan, Andre Huang Ching-Feng Chen, Jordon Hsu National Taiwan University Chung-Kuan Cheng, Chiu-Chih Chou NEC Hiroshi Yamaguchi, Tomohiro Hayashi, Tomokazu Tokoro, Toshihiko Nakano NEC Communication Systems Tsuneo Kikuchi NEC Toppan Circuit Solutions Kiyohiko Kaiya, Masanori Naito, Toshiyuki Kaneko NetLogic Ryan Coutts, Antonis Orphanou Nikon Kazuomi Tominaga, Manabu Matsumoto, Toshiyuki Kobayashi Nisoul Fumio Tazaki, Toshio Hoshi Novatek Microelectronics Group Frank Y.C. Pai Nvidia David Chen, Chia Yuan Hsieh, Chih Wei (Jason) Tsia Oki Electric Industry Atsushi Kitai Olympus Kazuhiro Sakamoto Olympus Medical Systems Hiroshi Tamai Oracle Gustav Blando Panasonic Yoshiyuki Saito Pegatron Stanley Chu, Gavin Lin Pericom Semiconductor Zhangqi Guo, Jun Li, Qing Mao Phison Electronics Dageai Liu Politecnico di Torino Igor Stievano, Stefano Grivet-Talocia Portwell Michael Chang, Phil Gu Pristine Signals AbdulRahman (Abbey) Rafiq Propogate Group Corp. (PGC) Wayne Tsai Quanta Computer Fu-Chieh Chang, Eriksson Chuang, Allen Kuo, York Wang, Lengren Wei Realtek Semiconductor Jerry Chien, Erlang Wang, Tina Wu Renesas Electronics Takuji Komeda, Masafumi Mituishi, Mikiko Sode, Naho Hokoiwa, Osamu Takeuchi, Soji Sunairi, Tatsuaki Tsukuda Renesas Micro Systems Munehisa Okita, Yoshihiro Kikuchi Ricoh Shigeru Isobe, Toshihiko Makino, Yasuhiro Akita Rohm Yutaka Okui Samsung Electronics Il Seong Samsung Yokohama Research Toshiyuki Hasegawa Institute Sanritz Automation Masamichi Yahara Shimadzu Kazuo Nakajima Siemens Manfred Maurer Signal Khobho Atsuhito Noda Signal-Lab Sei Shida Silicon Motion Technology Louis Chuang, Star Wang Singatron Enterprise Norman Wu Simberian Yuriy Shlepnev Sony EMCS Shigeru Sana Spreadtrum Communications Xianyu Meng ST Microelectronics Fabio Brina, Alan Smith Sunplus Technology Forest Hsu, Yitzeng Lin Taiwan Semiconductor Philip Way Chang Manufacturing Corp. (TSMC) Taiyo Yuden Masayuki Satou TDK Katsufumi Ehata, Yoshikazu Fujishiro TechAmerica (Chris Denham) Teradyne Makoto Kikuchi, Takeshi Shimabukuro Tellabs Yuehui Zhu Thales Communication Alexandre Amedeo, Cyrip Chastang Tianma Micro-electronics Xiaoyan Lai, Shengjie Yang Tokyo Cathode Laboratory Akitoshi Nishimura Tokyo University of Scence Yohtaroh Yasu Graduate School Toshiba Digital Media Engineering Kouji Yasutake Trident Microsystems Andy (Zhiguang) Li University of Illinois Jose Schutt-Aine University of L'Aquila Danilo di Febo VIA Labs Sheng-Yuan Lee VIA Technologies Cherry Hung, Jonathan Wei Vitesse Semiconductor Siris Tsang WADOW Kazuhiko Kusunoki Wens Heien Hirokawa Wistron Ryan Chang, Denis Chen, Jesse Chen, Yo An Chen, Joseph Chong, Will Chung, Passor Ho, Sindy Ho, Soin Huang, Allen Lo, Josh Wu WonderMedia Technologies Terence Hsien Xpeedic Technology Feng Ling, Wenliang Dai, Shisheng Wu Yazaki Kazuki Hattori YDC Yoshiaki Manabe YDK Yoshio Takemura Independent Yoichi Niioka, [Mike LaBonte], Mingwei Chen, Liping Wang In the list above, attendees at the meeting are indicated by *. Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS The bridge numbers for future IBIS teleconferences are as follows: Date Meeting Number Meeting Password January 6, 2012 205 475 958 IBIS For teleconference dial-in information, use the password at the following website: https://ciscosales.webex.com/ciscosales/j.php?J=205475958 All teleconference meetings are 8:00 AM to 9:55 AM US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. When calling into the meeting, follow the prompts to enter the meeting ID. For new, local international dial-in numbers, please reference the bridge numbers provided by Cisco Systems at the following link: http://www.cisco.com/web/about/doing_business/conferencing/index.html NOTE: "AR" = Action Required. ---------------------------------------------------------------------------- --------------------------------------------------- INTRODUCTIONS AND MEETING QUORUM Feras Al-Hawari introduced himself. He has worked for Cadence for over 16 years in the high speed group and is a senior member of the consulting staff. He is working on simulation and high speed flows. Mahbubul Bari of Maxim introduced himself. He is working in simulation modeling in the lab at Maxim. His recent focus has been on IBIS-AMI modeling, and he has been doing IBIS modeling for awhile. He has experienced a wide variety of implementation issues with AMI and is looking to learn more about AMI issues. Kent Dramstad of IBM introduced himself. He is working with SerDes modeling. He is interested in learning about problems with AMI modeling to help solve customer issues. Yingxin Sun of Sigrity introduced himself. He is working at on simulation tools using IBIS models. CALL FOR PATENTS Michael Mirmak called for any patents or pending patents related to the IBIS 3.2, IBIS 4.2, IBIS 5.0, Touchstone 2.0 or ICM 1.1 specifications. No patents were declared. REVIEW OF MINUTES AND ARS Randy Wolff called for comments regarding the minutes of the October 28, 2011 IBIS Open Forum teleconference. Bob Ross noted that the next meeting was to be held December 9, not December 2 as indicated in the minutes. Minutes were approved with the noted change. MEMBERSHIP STATUS AND TREASURER'S REPORT Bob Ross reported that we are now listing Foxconn as a new IBIS member. We are at 31 members now, but we have no report from TechAmerica to confirm all membership payments. We will need to address funding at the next meeting and potentially any increases in membership dues. WEB PAGE UPDATES Mike LaBonte reported that he made updates to the Summits page. He is looking for ways to use scripting to generate better views and readme information for the Summits page. MAILING LIST ADMINISTRATION Mike LaBonte reported that he has had some trouble with the mailing list. There are 5 different SMTP servers at Stanford, and one of those servers every few years has a problem where it is used for spam. So, some member’s email servers pay attention to spam server scores and start blocking emails from the Stanford server. Mike has contacted eda.org support people, but apparently nothing can be done to remedy the situation. MODEL LIBRARY UPDATE Anders Ekholm reported that he has no update this meeting, but he is planning to go through links to look for broken ones before the next teleconference. MISCELLANY/ANNOUNCEMENTS None. OPENS FOR NEW ISSUES None. INTERNATIONAL/EXTERNAL ACTIVITIES - IEEE DASC Michael Mirmak reported that efforts are ongoing to form a group within DASC so that IBIS has a path through IEEE for international standardization. IBIS was tentatively granted 1852 as the working group number. Group approval is not official yet, because some documentation has to be signed by TechAmerica related to copyright issues. We should see some announcements from DASC in the near future. This group is formed specifically for reviewing IBIS 4.2, but the same group should be able to work with future specifications. - VHDL-AMS Table-Driven Models Arpad Muranyi noted that the last meeting was cancelled. The next meeting is next Monday. Hassan Rafat asked if Verilog-AMS was supported. Arpad confirmed that IBIS supports both languages, and Verilog already supports table driven modeling. More information can be found at: http://www.eda.org/twiki/bin/view.cgi/P10761/ProjectsArea#Table_driven_ Modeling_Champion_J - Conferences EDAPS (Electrical Design of Advanced Packaging & Systems) will be held December 12-14 in Hangzhou, PRC. More information can be found at: http://www.edaps2011.org SPI2012 (18th IEEE Workshop on Signal and Power Integrity) will be held May 13-16, 2012 in Sorrento, Italy. We are offered a free room on Wednesday afternoon for hosting an IBIS Summit meeting. More information can be found at: http://www.spi2012.org Official IBIS participation is not planned for all of the events above, though individual papers and discussion on IBIS are encouraged. These are events with refereed submissions, with deadlines either pending or already passed. - Press Update Bob Ross noted an article by Lynne Green that discusses IBIS models. The article is “Top 10 Issues in IBIS Models”, October 19, 2011 on the PCB Design 007 site. See the article at: http://www.pcbdesign007.com/pages/zone.cgi?a=79617 IEC APPROVAL ACTIVITIES Randy Wolff reported that the IEEE DASC announced approval of the IBIS PAR on October 26 with a 15-0 vote tally among eligible DASC voters and 22-0-1 among all DASC members who voted. See the IEEE DASC topic for further information. SUMMIT STATUS - Asian IBIS Summits Report Michael Mirmak reported that all three events were very successful. There was significant sponsorship and presentation material. All presentations are found on the IBIS Summits page. We had 131 attendees in Shanghai, 152 in Yokohama and 131 in Taipei. Minutes have been released for all meetings. Power delivery and AMI were dominant topics in the Summits. - DesignCon 2012 Planning The IBIS Summit is tentatively scheduled for Thursday, February 2, 2012. The tentative contract is very similar to last year. Announcements will go out soon. Michael Mirmak encouraged people to start thinking about presentations. Lance Wang will be the official contact for sign-ups. Sponsorship opportunities for all upcoming IBIS summits are available, with sponsors receiving free mentions in the minutes, agenda, and other announcements. This includes upcoming events in Asia. Contact the IBIS Board for further details. QUALITY TASK GROUP Mike LaBonte reported that the group is discussing additions of quality checks for AMI models in the Quality specification. Progress has been slow, partly due to all the changes in the AMI specification. Until certain clarifications are approved, some checks that could be in the ibischk parser have been withheld. The group might start looking at ibischk to see what further checks could be included. The group meets weekly on Tuesdays at 8:00AM Pacific time. The Quality Task Group checklist and other documentation can be found at: http://www.eda.org/ibis/quality_wip/ MODEL REVIEW TASK GROUP No update. ADVANCED TECHNOLOGY MODELING TASK GROUP Arpad Muranyi reported that the group is now meeting on its regular schedule after the Summits. They have finished all the small correction BIRDs. There has been a lot of discussion on a jitter BIRD and the analog BIRDs. Task group material can be found at: http://www.eda.org/ibis/macromodel_wip/ EDITORIAL TASK GROUP Michael Mirmak reported that there have been no regular meetings since before the Summits. The group is waiting on a request from TechAmerica about using the technical writer for some further editorial work. Michael thinks that we will need to start the editorial work of stitching together the IBIS 5.1 document ourselves if we do not hear from TechAmerica in the next day. The group will resume meetings next week hopefully. The current IBIS 5.0 reformatting documentation can be reviewed at the following new location: http://www.eda.org/ibis/editorial_wip/ SPECIFICATION RELEASE SCHEDULE DISCUSSION Michael Mirmak noted that we need a faster way to update IBIS more regularly so that new features get into industry more quickly. A period of two years or so between major updates is too slow. Anders Ekholm brought up at the Summits the idea of going to regular release schedules of every 6 months so that everyone can plan more easily to implement new features. IBIS 5.1 is the next scheduled release, but after that, more minor releases could be done every 6 months on May 1 and November 1. Michael plans to have more details in future meetings and Summits. Bob Ross noted that IBIS 5.1 is close to completion. He added that we need to limit how many changes go out with each minor release. NEW ADMINISTRATIVE ISSUES None. BIRD127.4: IBIS-AMI TYPOGRAPHICAL CORRECTIONS Arpad Muranyi noted that there have been no new comments or questions related to the BIRD127.4 revision. Bob Ross noted this is a critical BIRD for moving ahead with IBIS-AMI. Bob said that there is a leaf/value pair terminology that may need to be changed in the editorial process when wrapping into IBIS 5.1. Radek Biernacki commented that he thought the BIRD was ready for a vote. Arpad moved to vote on the BIRD. Radek Biernacki seconded. The vote passed with the following vote tally: Agilent – yes Cadence – yes Ericsson – yes IBM – yes Intel – yes IO Methodology – yes LSI – yes Mentor – yes Micron – yes Nokia Siemens Networks – yes SiSoft – yes Sigrity – yes Teraspeed – yes BIRD146: CLARIFY SAMPLE_INTERVAL FOR IBIS-AMI There were no comments on the BIRD. Arpad Muranyi moved to vote on the BIRD. Bob Ross seconded. The vote passed with the following vote tally: Agilent – yes Cadence – yes Ericsson – yes IBM – yes Intel – yes IO Methodology – yes LSI – yes Mentor – yes Micron – yes Nokia Siemens Networks – yes SiSoft – yes Sigrity – yes Teraspeed – yes BIRD140.1: FORMAT CORNER AND RANGE CLARIFICATION FOR IBIS-AMI Arpad Muranyi noted that after long discussion in the ATM group, it was decided that there is enough information in IBIS to make an association between typ/min/max corners of legacy IBIS and fast/typ/slow corners of AMI. This BIRD is tied closely to the new BIRD148 which limits allowable model types related to IBIS-AMI. Bob Ross noted that this BIRD has been discussed extensively and would be ready for a vote at the next meeting. Radek Biernacki commented that this does leave the Range format up to the user. Arpad commented that typ/min/max values in Range have no association to corners in IBIS. This is clarified in the BIRD. Radek felt like the BIRD should note if there is an implied connection between Range and corner. Bob felt Range should not have an association with corners, as it should be used for values that can be selected by the user through the EDA software. Arpad noted that there may be other parameter types besides Range and Increment that need to be included in one sentence in the BIRD. Bob felt these small editorial changes are not clear until all the BIRDs are integrated into one document for review. Radek felt that the BIRD will be ready to go with some minor editorial changes that could be done faster by working offline and not in the ATM committee. Radek and Arpad will work together to revise the BIRD. Bob moved to schedule a revised BIRD140.2 for a vote at the next meeting. Arpad seconded the motion. The motion passed without objection. BIRD148: ALLOWABLE MODEL_TYPES WITH IBIS-AMI Arpad Muranyi noted this is a new BIRD to limit the model types with which algorithmic models can be used. This helps addressing corners in BIRD140.1 as well as eliminating the possibility of weird models that don’t make sense. AMI models are now not allowed under Model_type Terminator, Series or Series_switch. Another BIRD may need to be written to clarify I/O Model_type usage, since these algorithmic models need to be split into two models for use as an RX and a TX. Bob Ross moved to schedule the BIRD for a vote at the next meeting. Arpad seconded. There were no objections. BIRD144.1: ADD TOUCHSTONE TO [EXTERNAL MODEL] AND [EXTERNAL CIRCUIT] AS A SUPPORTED LANGUAGE Feras Al-Hawari re-introduced the BIRD. It allows for a direct connection of Touchstone files in IBIS without the need to wrap and instantiate such models in a SPICE-like subcircuit such as IBIS-ISS. Arpad Muranyi noted that the BIRD was discussed in the ATM group this week. Bob Ross added that he supported the idea of a direct connection of Touchstone to IBIS. He noted that you have to be careful with handling of DC voltage when using Touchstone. Radek Biernacki felt that this was a good idea, but he wasn’t convinced that going through IBIS-ISS wasn’t the best long term solution. Arpad noted that this simplifies the model-maker’s life by removing the need for an S-element wrapper, but it can also limit the flexibility. However, he wondered if adding several options for doing the same thing adds too much complexity to the IBIS specification. Feras said that most simulators already support Touchstone directly, so why not make this easy for model makers. Ambrish Varma wondered how IBIS-ISS allows for corners. Arpad clarified that you can parameterize Touchstone file names easily when using IBIS-ISS as suggested in BIRDs 116-118, thereby implementing a mechanism for unlimited corner simulations. Michael Mirmak asked if discussions could be taken off-line. Arpad noted that this BIRD could be brought up in ATM. Also, the BIRD will need some way of defining terminations for unused ports of the Touchstone file. BIRD145.1: CASCADING IBIS I/O BUFFERS WITH [EXTERNAL CIRCUIT]S USING THE [MODEL CALL] KEYWORD Feras Al-Hawari noted that this BIRD augments the [External Circuit] format with a way to connect a regular IBIS buffer to other [External Circuit] blocks. This BIRD adds a new keyword [Model Call]. This allows cascading of Models. Bob Ross noted that he supported the idea, but it needs more discussion to look at an integrated solution with AMI, AMS, etc. BIRD133: MODEL CORNER C_COMP Bob Ross moved to schedule the BIRD for a vote at the next meeting. Mike LaBonte seconded the motion. The motion passed with no objections. BIRD116: ADD IBIS-ISS TO [EXTERNAL MODEL] AND [EXTERNAL CIRCUIT] AS A SUPPORTED LANGUAGE Discussion was tabled. BIRD117.3: PARAMETERIZE A_TO_D AND D_TO_A CONVERTERS Discussion was tabled. BIRD118.2: ANALOG PARAMETER ASSIGNMENTS Discussion was tabled. BIRD121.1: IBIS-AMI NEW RESERVED PARAMETERS FOR DATA MANAGEMENT Discussion was tabled. BIRD122: IBIS-AMI NEW RESERVED PARAMETERS FOR ANALOG MODELING Discussion was tabled. BIRD123.1: IBIS-AMI NEW RESERVED PARAMETERS FOR JITTER/NOISE Discussion was tabled. BIRD124: IBIS-AMI NEW RESERVED PARAMETERS FOR DEPENDENCY TABLES Discussion was tabled. BIRD125.1: MAKE IBIS-ISS AVAILABLE FOR IBIS PACKAGE MODELING Discussion was tabled. BIRD128: ALLOW AMI_PARAMETERS_OUT TO PASS AMI_PARAMETERS_IN DATA ON CALLS TO AMI_GETWAVE Discussion was tabled. BIRD129: ADD “POLARITY” ARGUMENT TO D_TO_A CONVERTERS Discussion was tabled. BIRD 131: IBIS-AMI REPEATERS Discussion was tabled. BIRD147: BACK-CHANNEL SUPPORT Discussion was tabled. IBISCHK5 BUG STATUS Discussion was deferred due to time limitations. TSCHK2 BUG STATUS Discussion was deferred due to time limitations. NEW TECHNICAL ISSUES None. NEXT MEETING The next IBIS Open Forum teleconference will be held January 6, 2011 from 8:00 to 10:00 AM US Pacific Time. Votes on BIRD133, BIRD140.2 and BIRD148 are scheduled. ======================================================================== NOTES IBIS CHAIR: Michael Mirmak (916) 356-4261, Fax (916) 377-3788 michael.mirmak@intel.com Data Center Platform Applications Engineering Intel Corporation FM5-239 1900 Prairie City Rd., Folsom, CA 95630 VICE CHAIR: Lance Wang (978) 633-3388 lwang@iometh.com President/CEO, IO Methodology, Inc. PO Box 2099 Acton, MA 01720 SECRETARY: Randy Wolff (208) 363-1764, Fax: (208) 368-3475 rrwolff@micron.com SI Modeling Manager, Micron Technology, Inc. 8000 S. Federal Way Mail Stop: 01-711 Boise, ID 83707-0006 LIBRARIAN: Anders Ekholm (46) 10 714 27 58, Fax: (46) 8 757 23 40 ibis-librarian@eda.org Digital Modules Design, PDU Base Stations, Ericsson AB BU Network Färögatan 6 164 80 Stockholm, Sweden WEBMASTER: Mike LaBonte mikelabonte@eda.org IBIS-AMI Modeling Specialist, Signal Integrity Software 6 Clock Tower Place Maynard, MA 01754 POSTMASTER: Mike LaBonte mikelabonte@eda.org IBIS-AMI Modeling Specialist, Signal Integrity Software 6 Clock Tower Place Maynard, MA 01754 This meeting was conducted in accordance with the TechAmerica Legal Guides and TechAmerica Manual of Organization and Procedure. The following e-mail addresses are used: majordomo@eda.org In the body, for the IBIS Open Forum Reflector: subscribe ibis In the body, for the IBIS Users' Group Reflector: subscribe ibis-users Help and other commands: help ibis-request@eda.org To join, change, or drop from either or both: IBIS Open Forum Reflector (ibis@eda.org) IBIS Users' Group Reflector (ibis-users@eda.org) State your request. ibis-info@eda.org To obtain general information about IBIS, to ask specific questions for individual response, and to inquire about joining the IBIS Open Forum as a full Member. ibis@eda.org To send a message to the general IBIS Open Forum Reflector. This is used mostly for IBIS Standardization business and future IBIS technical enhancements. Job posting information is not permitted. ibis-users@eda.org To send a message to the IBIS Users' Group Reflector. This is used mostly for IBIS clarification, current modeling issues, and general user concerns. Job posting information is not permitted. ibis-bug@eda.org To report ibischk parser BUGs as well as tschk2 parser BUGs. The BUG Report Form for ibischk resides along with reported BUGs at: http://www.eda.org/ibis/bugs/ibischk/ http://www.eda.org/ibis/bugs/ibischk/bugform.txt The BUG Report Form for tschk2 resides along with reported BUGs at: http://www.eda.org/ibis/tschk_bugs/ http://www.eda.org/ibis/tschk_bugs/bugform.txt icm-bug@eda.org To report icmchk1 parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/icm_bugs/ http://www.eda.org/ibis/icm_bugs/icm_bugform.txt To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which reside at: http://www.eda.org/ibis/bugs/s2ibis/bugs2i.txt http://www.eda.org/ibis/bugs/s2ibis2/bugs2i2.txt http://www.eda.org/ibis/bugs/s2iplt/bugsplt.txt Information on IBIS technical contents, IBIS participants and actual IBIS models are available on the IBIS Home page: http://www.eda.org/ibis Check the IBIS file directory on eda.org for more information on previous discussions and results: http://www.eda.org/ibis/directory.html To create an account on the TechAmerica KAVI workspace, check out: http://workspace.techamerica.org/kwspub/join/ Other trademarks, brands and names are the property of their respective owners. IBIS CURRENT MEMBER VOTING STATUS I/O Buffer Information Specification Committee (IBIS) |Organization |Interest |Standa|Novembe|Novembe|Novembe|Decembe| | |Category |rds |r 15, |r 18, |r 21, |r 9, | | | |Ballot|2011 |2011 |2011 |2011 | | | |Voting| | | | | | | |Status| | | | | |Advanced Micro |Producer |Inacti|- |X |- |- | |Devices | |ve | | | | | |Agilent |User |Active|- |X |- |X | |Technologies | | | | | | | |Altera |Producer |Inacti|- |- |- |- | | | |ve | | | | | |ANSYS |User |Active|X |X |X |- | |Apple Computer |User |Inacti|- |- |- |- | | | |ve | | | | | |Applied Simulation|User |Inacti|- |X |- |- | |Technology | |ve | | | | | |Cadence Design |User |Active|X |X |X |X | |Systems | | | | | | | |Cisco Systems |User |Inacti|X |- |- |- | | | |ve | | | | | |Ericsson |Producer |Active|X |X |X |X | |Foxconn Technology|Producer |Inacti|- |- |X |- | |Group | |ve | | | | | |Freescale |Producer |Inacti|- |X |- |- | | | |ve | | | | | |Green Streak |General |Inacti|- |- |- |- | |Programs |Interest |ve | | | | | |Huawei |Producer |Inacti|X |- |- |- | |Technologies | |ve | | | | | |IBM |Producer |Active|- |- |X |X | |Infineon |Producer |Inacti|- |- |- |- | |Technologies AG | |ve | | | | | |Intel Corp. |Producer |Active|X |- |X |X | |IO Methodology |User |Active|X |- |X |X | |LSI |Producer |Inacti|- |- |- |X | | | |ve | | | | | |Mentor Graphics |User |Active|- |X |- |X | |Micron Technology |Producer |Inacti|- |- |- |X | | | |ve | | | | | |Nokia Siemens |Producer |Inacti|X |- |- |X | |Networks | |ve | | | | | |QLogic |Producer |Inacti|- |- |- |- | | | |ve | | | | | |Signal Integrity |User |Inacti|- |- |- |X | |Software | |ve | | | | | |Sigrity |User |Active|X |- |X |X | |Synopsys |User |Inacti|X |- |- |- | | | |ve | | | | | |Teraspeed |General |Active|X |X |X |X | |Consulting |Interest | | | | | | |Texas Instruments |Producer |Inacti|- |- |- |- | | | |ve | | | | | |Toshiba |Producer |Inacti|- |X |- |- | | | |ve | | | | | |Xilinx |Producer |Inacti|- |- |- |- | | | |ve | | | | | |ZTE |User |Inacti|X |- |- |- | | | |ve | | | | | |Zuken |User |Inacti|- |X |- |- | | | |ve | | | | | Criteria for Member in good standing: • Must attend two consecutive meetings to establish voting membership • Membership dues current • Must not miss two consecutive Meetings Interest categories associated with TechAmerica ballot voting are: • Users - Members that utilize electronic equipment to provide services to an end user. • Producers - Members that supply electronic equipment. • General Interest - Members are neither producers nor users. This category includes, but is not limited to, Government, regulatory agencies (state and federal), researchers, other organizations and associations, and/or consumers.