IBIS Open Forum Minutes Meeting Date: November 16, 2012 Meeting Location: Yokohama, Japan VOTING MEMBERS AND 2012 PARTICIPANTS Agilent Heidi Barnes, Radek Biernacki, Yoji Sekine, Fangyi Rao, Jing-Tao Liu, Zhengpeng Zhu, Xuliang Yuan, Yi Wang, Ming-Chih Lin, Peter C.B. Lin, Isabella Wan, Hideki Aoki*, Kageura Toshinori*, Hiroaki Sasaki*, Hiroyuki Shimada* Altera David Banas, Hsinho Wu, Masashi Shimanouchi ANSYS (Ansoft) Flavio Calvano, Luis Armenta, Dan Dvorscak, Baolong Li, Kezhou Li, Daniel Chang, Naijen Hsuan, Steve Pytel, Jean Wang, Jerry Wang, Yachin Wang, Peishen Wei, Jack Wu, Tinghao Yeh, Miyo Kawata* Applied Simulation Technology Norio Matsui ARM (Nirav Patel) Cadence Design Systems Brad Griffin, Terry Jernberg, Jilin Tan, Dennis Nagle Ambrish Varma, Aileen Chen, Lanbing Chen, Li Chen, Raymond Y. Chen, Jonny Fang, Zhiyu Guo, Henry He, Li Li, Xianlai Li, Lavia Liu, Peng Liu, Yabao Meng, Fang Sun, Haishan Wang, YiTong Wen, Janie Wu, Dingru Xia, Benny Yan, Jenny Zhang, Jinhui Zhang, Rong Zhang, Zhangmin Zhong, Steven Chen, Kent Ho Joseph Kao, Tom Kao-Lo, Thunder Lay, Jack (Wei-Chang) Lin, Paddy Wu, Candy Yu, Yukio Masuko*, Norikazu Takada*, Hirotsugu Ueno* Ericsson Anders Ekholm*, Zilwan Mahmod, Mattias Lundquist, Wenyan Xie Foxconn Technology Group Po-Chuan (Eric) Hsieh, Chih-Jung (Gerald) Hsu, Mandy (Hsiao-Yun) Su Freescale Takahiro Satoh* Huawei Technologies Xiaoqing Dong, Chunxing Huang, Peng Huang Hongxin Jiang, Wenjin Luo, Longfang Lv, Luya Ma, Xiao Peng, Huichao Weng, Zhengrong Xu, Juhua Yu, Fangfang Zhang IBM Adge Hawes, Greg Edlund Infineon Technologies AG (Christian Sporrer) Intel Corporation Michael Mirmak, Subas Bastola, Udy Shrivastava, Stewart Gilbert, Eddie Frie, Jinsong (Jason) Hu Weifeng Shu, Ming Wei, Jimmy Hsu IO Methodology Lance Wang* LSI Brian Burdick Maxim Integrated Products Hassan Rafat, Mahbubul Bari Mentor Graphics Arpad Muranyi, Vladimir Dmitriev-Zdorov, Kenji Kushima* Micron Technology Randy Wolff, Aniello Viscardi, Francesco Madonna Antonio Prisco, Justin Butterfield Nokia Siemens Networks GmbH Eckhard Lenski, Evis Minga, Bruce (Zhenshui) Qin, Feiqin Shen, Yuanzhi Xu, Jieping Zhang, XiuYing (Echo) Zhou QLogic (James Zhou) Signal Integrity Software Walter Katz, Mike LaBonte, Todd Westerhoff Akalu Lentiro Sigrity [Raymond Chen], Yingxin Sun, Sam Chitwood Ben Franklin, Srdjen Djordjevic Synopsys Andy Tai, Scott Wedge, Hany Elhak, Ted Mido, Xuefeng Chen, Jinhua Huang, Huihuang Li Teraspeed Consulting Group Bob Ross, Tom Dagostino Texas Instruments Casey Morrison, Pegah Alavi, Valerie Chang Modesto Garcia, Karl Muth Toshiba Masatoshi Abe, Yoshinori Fukuba*, Masato Kanie* Katsuki Matsudera*, Motochika Okano*, Yui Shimizu* Atsushi Tomishima*, Yasuki Torigoshi* Xilinx Harry Fu ZTE Huifeng Chen, Xiaolin Chen, Fengling Gao, Hui Jiang, Wan Ming, Qi Ni, Anbing Sun, Lili Wei, Shunlin Zhu Zuken Michael Schaeder, Fujise Kazunori*, Hironan Kibe* Yuichi Nakajima* OTHER PARTICIPANTS IN 2012 3M Qiling Chen, Yao Li AET Chihiro Ueda* Alchip Technologies Lynus Han, Sean Huang, Trent Lee AMD Tadashi Arai* Apache Design Jianbo Liu, Shulong Wu, Mengfei Xu, Wei Yang Apollo Giken Co. Satoshi Endoh*, Naoya Iisaka* Apple Computer (Matt Herndon) Aruba Networks Amir Motamedi ASE Alex Wang Astrodesign* Yoshiaki Nishi* ATE Service Corporation Yutaka Honda*, Sin Suminaga* Avago Technologies Sanjeev Gupta, Amolak Badesha Avant Technology Yi-Ching Chu, Elvis Li, Yao-Chang Chang, Judy Huang, Jyam Huang, Enson Lee Bayside Design Elliot Nahas Canon Takashi Asaka*, Yuji Ishikawa*, Syohji Matsumoto*, Kenichi Murata*, Haruka Watanabe* Casio Computer Co. Yasuhisa Hayashi*, Ikuo Imada* C-Tech Hideki Inada* Cavium Johann Nittmann Celestica Lily Dai, Jason Liu, Ivan (Yunqiang) Meng, Harrison Xue, Lobo Zhang, Van Zhu Ciena Kaisheng (Klaus) Hu Cisco Systems David Siadat, Mike Sapozhnikev, Biao Chen, Feng Wu, Liwei Zhao, Xing Zhao Cybernet Systems Masahito Kobayashi*, Takayuki Tsuzura* Dai Nippon Printing Co. Yoshihiro Sekiguchi* DS Corporation Yoshitaka Sasaki* Cypress Semiconductor Wenhe Chen Electro System Kazuo Satoh*, Kazuyuki Saijyoh* Enea Group Xiaoliang Gao Enterasys Robert Haller Etron Technology Helen Chiu, ChiuNan Pan, YeFeng Wu Exar Corporation Helen Nguyen Fuji Xerox Co. Kenta Nomura* Fujitsu Advanced Technology Syougo Fujimon*, Hikoyuki Kawata*, Takashi Kobayashi*, Toshiroh Satoh*, Hidenobu Shiihara*, Kumiko Teramae*, Daisuke Usui* Fujitsu Electronics Kenji Gotoh* Fujitsu Interconnect Technologies Syunsuke Fujisawa*, Hiromi Hayasaka*, Masato Kimura* Fujitsu Laboratories Tetsutaro Hashimoto*, Toshiaki Nagai* Futjitsu Microelectronics Solutions Yutaka Ide*, Saharu Kamimura*, Tetsuya Miwa* Futjitsu Semiconductor Atsushi Kamata*, Motoaki Matsumura*, Megumi Ohno*, Shintaroh Ohtani*, Hideaki Satoh*, Yasuyuki Watanabe*, Hirokazu Yamazai* Fujitsu VLSI Kenichi Kanbayashi*, Hiroki Kubota*, Hiroshi Miyazaki*, Yuji Nakagawa*, Kyohta Shimizu* General Electric Company Zhen Zhang Gibabyte Technology Eric Chien Granite River Labs Jiang Xu, Johnson Tan H3C Longsheng Yuan Hewlett-Packard Ting Zhu, Rick Wu HGST Takayuki Imai*, Tadayuki Tsukamoto*, High Speed Design Center Ben Chia Hino Jisso Design Shigekazu Hino* Hitachi Yutaka Uematsu Hitachi Advanced Digital Kohichi Murayama* Hitachi Consumer Electronics Yasuhiro Tomioka* Hitachi Information & Yoshifumi Takada* Communication Engineering Hitachi Kokusai Electric Kunihito Seguchi* Hitachi Mito Engineering Co. Katsuhisa Niijima*, Naoki Yokose* Hitachi ULSI Systems Co. Masahiro Hyoma*, Sadahiro Nonoyama*, Hiroshi Uematsu* Honeywell Chengzhi (Hunk) Hu Hoya Corporation Masayuki Hagiwara* Huaya Microelectronics Golden Qian IBITECH Co. Kiyohisa Hasegawa*, Hitoshi Miwa* ILI Technology Pacino Chang, Chia-Chen (Trevor) Wu IMU Yuanyuan Hao, Xue Jia, Runjing Zhou Instituto de Telecomunicações Wael Dghais, Hugo Teixeira IVIS Hiroyuki Mashima* Japan Aviation Electronics Norihiro Andoh* Industry Japan Futec Co. Kenji Ishida* Japan Radio Co. Chiaki Kuwata* JEITA Atsushi Ishikawa*, Sinichi Sano*, Seichi Yano* JVC Kenwood Takuo Fujimura*, Hidetoshi Suzuki* KEI Systems Shinichi Maeda* Kyoden Co. Hiroshi Houga*, Shinichi Mochida*, Takao Saitoh* Lenovo Aiping Li Luxshare-ICT Alan Kinningham, Steven Wong Marvell Technology Group Wei-Zhe Li, Xi-Ke Liu, Fang Lv, Yu-Yang Wang, Liang Wu Meisei University Kazuo Yuuno* NEC Toppan Circuit Solutions Kiyohiko Kaiya*, Toshiyuki Kaneko* NGK Spark Plug Co. Katsuaki Sugino* Nikkei Business Publications Ikutaroh Kojima* Nikon Manabu Matsumoto*, Kazuomi Tominaga* Nisoul Co Katsuya Tasaki*, Kaoru Tazaki* MK Resolutions Olga Chervyakova Molex Greg Fu Nuvoton Technology Chung-Chih Chang, Chien-Ming Chen NXP Semiconductors Grace Yang Nvidia Eric Hsu Oki Data Syuichi Yamanaka* Oki Electric Industry Co. Atsushi Kitai* Olympus Kazuhiro Sakamoto* Ontec Co. Yoshimasa Hayashi*, Syohichiroh Toku* Paltek Nobuyouki Sasaki* Panasonic Ryuichi Yamaguchi* Pegatron Corporation Stanley Chu, Lawrence Ting PFU Kohhei Shimazu* Pioneer Yutaka Fukuhara* Politecnico di Torino Stefano Grivet-Talocia Renesas Electronics Mikiko Sode*, Hiroyuki Uchida*, Kazunon Yamada* Research In Motion Yi Cao Ricoh Company Yasuhiro Akita*, Kazumasa Aoki*, Masahiko Banno*, Shigeru Isobe*, Takuya Kitsukawa*, Daisuke Koya*, Kazuki Murata*, Shigeru Toyazaki* Rohm Co. Yutaka Okui* Ruijie Networks Ye Tao Sanei Hytechs Co. Hiroyuki Kai* Seiko Instruments Takayuki Okamoto* Semiconductor Technology Hiroshi Nishijima* Academic Research Center Sendai Nikon Kohsuke Aoyama* Shimadzu Kazuo Nakjima* Silicon Motion Technology Star Wang Sony Kenji Yasoda, Haruhiko Saitoh* Sony EMCS Naotaka Tachibana* Southwest Electronics Wei Hu Telecommunication Technology Research Institute Spreadtrum Communications Steven Guo, Xianyu Meng, John Rowland Shanghai ST Microelectronics Davide Pandini Success International Tatsuo Futai* Sunplus Technology Forest Hsu, Yi-Tzeng Lin SWIEE Electronics Chen Gao TDK-EPC Katsufumi Ehata* TechAmerica (Chris Denham) Teledyne LeCroy Fachun Li, Derek Wu Tokyo Electron Device Takayuki Yamazaki* Toshiba Digital Media Engineering Yuji Yasutake* Toshiba I.S. Masatoshi Abe* Toshiba Microlectronics Masahiro Ishibashi*, Jyunya Masumi* Toshiba Semiconductor & Storage Masahiko Kashima*, Shigeo Kida*, Toshihiro Tsujimura* Company Yasunobu Umemoto* Towa Electronics Co. Yoshikazu Suzuki* Université de Brest Mihai Telescu, Cherif Diouf University of Illinois Thomas Comberiate, José Schutt-Ainé Vitesse Semiconductor Sirius Tsang Wadow Kazuhiko Kusunoki* Yamaha Masahiro Tsukuda* Yamaichi Electronics Co. Masahi Iwata* Yazaki Kazuki Hattron* YDC Yoshiaki Manabe* YDK Co. Yoshio Takemura* Zhejiang United Electronic Gang Xu Industry Zhejiang Uniview Technologies Sunny (Huanyang) Chen, Phil (Fei) Ye Zuiki Seikoh Go* In the list above, attendees at the meeting are indicated by *. Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS The bridge numbers for future IBIS teleconferences are as follows: Date Meeting Number Meeting Password November 30, 2012 205 475 958 IBIS For teleconference dial-in information, use the password at the following website: https://ciscosales.webex.com/ciscosales/j.php?J=205475958 All teleconference meetings are 8:00 AM to 9:55 AM US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. When calling into the meeting, follow the prompts to enter the meeting ID. For new, local international dial-in numbers, please reference the bridge numbers provided by Cisco Systems at the following link: http://www.cisco.com/web/about/doing_business/conferencing/index.html NOTE: "AR" = Action Required. ---------------------------------------------------------------------------- --------------------------------------------------- WELCOME AND KEYNOTE COMMENTS The IBIS Open Forum summit was held in Yokohama, Japan, co-located with the Electronics Design Solutions Fair (EDS Fair) at the Pacifico Yokohama Conference Center. About 156 people representing 86 organizations attended. The notes below capture some of the content and discussions. The meeting presentations and other documents are available at: http://www.eda.org/pub/ibis/summits/nov12c/ Lance Wang opened the seventh Asian IBIS Summit in Yokohama, Japan. Haruhiko Saitoh (JEITA EC Working Group Chair and Sony Corporation) welcomed everyone and looked forward to a productive meeting. Lance Wang provided some brief remarks, thanked JEITA for their support and providing excellent facilities. IBIS 5.1: An Overview Michael Mirmak (Intel Corporation, USA) [Presented by Lance Wang (IO Methodology, USA)] Lance Wang announced that IBIS 5.1 was approved on August 24, 2012. It has been reformatted based on Microsoft Word for ease of editing, changes (BIRDs), readability, and cross-referencing with hyperlinks. ASCII figures and tables are replaced with graphics and actual tables. The terminology has been made more consistent. Lance showed a list of 25 BIRDs that have been incorporated to support new features and changes. The AMI parameter discussion that was in Section 6C has been moved to a new section 10A. While old AMI files will still work, there are some flow changes to support non-LTI models in TX AMI_GetWave. Use_Init_Output is deprecated for AMI_Ver 5.1 files depicted by using the AMI_Version parameter. Lance showed some of the format changes and also announced the ibischk5 parser, Version 5.1.2 was released October 6, 2012 to support checking IBIS Version 5.1 and .ami files. The next steps for specification updates include renumbering the sections and incorporating new BIRDs written in the new format. The next major Version is 6.0, but Version 5.2 might be issued for standardization only. IBIS Parser Update Bob Ross (Teraspeed Consulting Group, USA) [Presented by Anders Ekholm, Ericsson Sweden)] Anders Ekholm showed the valid IBIS Version numbers through 5.1 and also the latest ibischk versions through Version 5.1.2. Specifications are upgraded to the last major version. Downward compatibility is maintained for features and syntax so that existing models remain valid. IBIS-AMI started supporting sub-version distinctions in the .ami format. AMI_Version is required for “5.1” files and Use_Init_Output is not legal. Anders gave a brief overview of ibischk5 Version 5.1.2 and showed its flags. There are over 1150 unique numbered error message strings. The source code package has 44 new test case files since Version 5.0.7. Ibischk Version 5.1.2 checks many more errors than the older Version 5.0.7 as a result of 23 BIRDs and 13 BUG reports that impact the parser. Anders described briefly the tschk2 parser that checks both Touchstone Version 1.0 and Touchstone Version 2.0 files. Anders concluded that the parsers officially check files for specification compliance and are critical to IBIS success. S-PARAMETER: WHAT YOU CAN READ, WHAT YOU HAVE TO READ Shinichi Maeda (KEI Systems, Japan) Shinichi Maeda presented an overview of S-parameter models including their definition and examples of gain and phase information. He showed gain and phase plots for a capacitor, and inductor, and two different length transmission lines. He noted that phase information is important because two networks could have very similar gain but very different phase. S- parameters can be n-Port models to represent large systems. Shinichi showed an example of a 4-port model of two single ended lines and defined forward and backwards crosstalk. S-parameters can also be in a differential format that shows the common mode, differential mode and common-to-differential mode characteristics. Common problems of S- parameter data include not defining the DC point and dealing with extrapolation when a higher frequency range is needed for simulation. Chip pdn model for Power aware signal integrity analysis Jack W.C. Lin#, and Raymond Y. Chen## (Cadence Design Systems, #China, ##USA) [Presented by Yukio Masuko (Cadence Design Systems, Japan)] Yukio Masuko described traditional SSO analysis with traditional IBIS and showed artificially large power/ground fluctuations. On die RC decoupling capacitors reduce the fluctuations. A chip PDN helps identify mid- frequency resonance. This could add to larger power ground noise and worse digital quality. IBIS Version 5.0 is currently limited because it lacks a direct RC decoupling network. Some chip PDN capacitance comes from the driver transistors and another part comes from outside of the transistors. For example, MIMCAPs on an interposer can contribute sizable capacitance. Yukio showed how to generate a chip PDN model (as proposed earlier by Sigrity) for the driver transistors. Outside the transistors, the PDN capacitance can be extracted by I/O circuit bus groups. This can be modeled as an RC model or a distributed Spice model. Yukio showed a case study using PDN in SSO analysis (with an RC model and distributed Spice model) that showed realistic power/ground noise versus artificially high noise for the case without a PDN. Yukio also illustrated a BIRD proposal that uses the [Pin Mapping] busses to map bus name to subcircuit nodes through a [Define Chip PDN Model] keyword and [External Model]. THE VOICE FROM PRACTICAL DESIGNING WITH SI SIMULATION Hironari Kibe (Zuken, Japan) Hironari Kibe noted that it is more common for layout designers to consider Signal Integrity and to increase their usage of IBIS models. His presentation introduced frequently asked questions of an EDA vendor support center related to IBIS models. The first question defined flight time and when it begins and ends. The second question he answered was why flight time can be negative. The third question clarified the relationship between [Package], [Pin] and [Package Model] keyword data. The fourth question answered how a simulator uses more than one set of [Rising Waveform] and [Falling Waveform] data. The fifth question clarified what to do when two simulators show different results. Hironari noted that the problems come from different options settings between the simulators about 60% of the time. There is also an “IBIS Quality Framework” provided by the JEITA/EC Center that is helpful to follow before calling a support center. Hironari concluded that we need to create for “frameworks” to educate users and to enhance IBIS models. ibis validation method review Lance Wang (IO Methodology, USA) Lance Wang described how system design engineers need validated IBIS models to analyze high speed designs. The IBIS Accuracy Specification was originally released in 1998. In 2007, the IBIS Quality task group was formed. This group has released IBIS Quality specifications and a Quality checklist. In recent years, many system companies started to ask their device vendors to supply quality control documents for their IBIS models. The goal of IBIS validation is to correlate IBIS model simulation results with golden sources (measurements and simulations) for specific test loads. Commonly used correlation/comparison methods include the quality checklist, curve overlay or envelope metrics, threshold based metrics and differential index based metrics. Lance detailed pros and cons of each of the methods and presented several common mistakes in the validation process. Lance concluded that validation is best done by IBIS model vendors. Comparison methods vary and must be used wisely to fit buffer model needs. IBIS users should ask their vendors for reasonable validation reports. Over-clocking model validation Yasuki Torigoshi (Toshiba Corporation, Japan) Yasuki Torigoshi defined overclocking of an IBIS model as a simulation where the bit length is shorter in time duration than the [Rising Waveform] and/or [Falling Waveform] data. Overclocking of models can create waveform problems, and the IBIS Cookbook recommends avoiding the situation. Yasuki showed simulation results comparing many model variations with different length V-t curves. Removing initial delays and cutting the V-t waveform tails showed varying results comparing IBIS simulations to Spice simulations. Yasuki concluded that we need to improve the IBIS specification as it relates to waveform overclocking. This is especially true since IBIS 5.0 models that include [Composite Current] data will have long waveforms. He recommended leaving waveform cutting up to simulators. designing ddr3 system using static timing analysis in conjunction with ibis simulation Taranjit Kukal#, Zhangmin Zhong##, and Heiko Dudek### (Cadence Design Systems, #India, ##China, and ###Germany) [Presented by Hirotsugu Ueno (Cadence Design Systems, Japan)] Hirotsugu Ueno described how DDR3 board design requires exploration of a large solution space including timing budgets, signal quality, component selection and stack-up and layout constraints. There are multiple constraints across timing and signal integrity. Timing closure across reads, writes and address is challenging. Signal integrity (SI) also affects timing. Ad-hoc analysis and verification leads to non-optimal designs. A unified static timing analysis and SI flow produces better designs. SI simulations feedback into the static timing analysis. Hirotsugu presented several use cases. Hirotsugu concluded that DDR3 compliance requires multiple specifications to be met covering timing and SI measurements. Timing models should be able to handshake data with IBIS simulations at pre-route exploration and post-route verification stages to ensure that both SI and timing constraints are met. THE APPLICATION OF SIMULATION KIT USING USB3.0 IBIS-AMI MODEL Motoaki Matsumura (Fujitsu Semiconductor, Japan) Motoaki Matsumura detailed the process used to design, build and verify a USB3.0 interface. His conclusion was that using IBIS-AMI models enabled high accuracy and short turnaround time. Using IBIS-AMI models allowed for simulation of one million bits in ½ hour. This compares to only 1000 bits of simulation using Spice models. Using a simulation test kit with his EDA software also improved the process. He noted that model makers should verify the quality of their own IBIS-AMI models (on different OS’s and EDA tools), since users can not correct or modify IBIS-AMI black-box models. He also had an issue with some EDA tools when the Continuous Time Linear Equalizer (CTLE) circuit characteristics were represented with an S- parameter model instead of inside of the IBIS-AMI model. Tool dependences with Samples Per Bit also caused problems. Sometimes the recommended value is not the default value in the model. Motoaki showed good correlation between simulation and measurement results. He also was able to examine cost reduction of the product by using the simulation kit and IBIS-AMI models due to the short simulation times. Motoaki concluded that IBIS-AMI is a key technology for USB3.0 analysis at 5Gbps. IBIS-AMI model makers need to solve various problems between the models and the EDA tool before model release. He also expects to see more information about IBIS-AMI including documents such as a cookbook and troubleshooting guide, more samples of simulation results accompanying models, and visualization of EQ characteristics. CONCLUDING ITEMS Lance Wang thanked the attendees and co-sponsors and JEITA for sponsoring and arranging the meeting. The meeting adjourned at approximately 6:00 PM. NEXT MEETING The next IBIS Open Forum teleconference will be held November 30, 2012 from 8:00 to 10:00 AM US Pacific Time. ======================================================================= NOTES IBIS CHAIR: Michael Mirmak (916) 356-4261, Fax (916) 377-3788 michael.mirmak@intel.com Data Center Platform Applications Engineering Intel Corporation FM5-239 1900 Prairie City Rd., Folsom, CA 95630 VICE CHAIR: Lance Wang (978) 633-3388 lwang@iometh.com President/CEO, IO Methodology, Inc. PO Box 2099 Acton, MA 01720 SECRETARY: Randy Wolff (208) 363-1764, Fax: (208) 368-3475 rrwolff@micron.com SI Modeling Manager, Micron Technology, Inc. 8000 S. Federal Way Mail Stop: 01-711 Boise, ID 83707-0006 LIBRARIAN: Anders Ekholm (46) 10 714 27 58, Fax: (46) 8 757 23 40 ibis-librarian@eda.org Digital Modules Design, PDU Base Stations, Ericsson AB BU Network Färögatan 6 164 80 Stockholm, Sweden WEBMASTER: Mike LaBonte mikelabonte@eda.org IBIS-AMI Modeling Specialist, Signal Integrity Software 6 Clock Tower Place Maynard, MA 01754 POSTMASTER: Mike LaBonte mikelabonte@eda.org IBIS-AMI Modeling Specialist, Signal Integrity Software 6 Clock Tower Place Maynard, MA 01754 This meeting was conducted in accordance with the TechAmerica Legal Guides and TechAmerica Manual of Organization and Procedure. The following e-mail addresses are used: majordomo@eda.org In the body, for the IBIS Open Forum Reflector: subscribe ibis In the body, for the IBIS Users' Group Reflector: subscribe ibis-users Help and other commands: help ibis-request@eda.org To join, change, or drop from either or both: IBIS Open Forum Reflector (ibis@eda.org) IBIS Users' Group Reflector (ibis-users@eda.org) State your request. ibis-info@eda.org To obtain general information about IBIS, to ask specific questions for individual response, and to inquire about joining the IBIS Open Forum as a full Member. ibis@eda.org To send a message to the general IBIS Open Forum Reflector. This is used mostly for IBIS Standardization business and future IBIS technical enhancements. Job posting information is not permitted. ibis-users@eda.org To send a message to the IBIS Users' Group Reflector. This is used mostly for IBIS clarification, current modeling issues, and general user concerns. Job posting information is not permitted. ibis-bug@eda.org To report ibischk parser BUGs as well as tschk2 parser BUGs. The BUG Report Form for ibischk resides along with reported BUGs at: http://www.eda.org/ibis/bugs/ibischk/ http://www.eda.org/ibis/bugs/ibischk/bugform.txt The BUG Report Form for tschk2 resides along with reported BUGs at: http://www.eda.org/ibis/tschk_bugs/ http://www.eda.org/ibis/tschk_bugs/bugform.txt icm-bug@eda.org To report icmchk1 parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/icm_bugs/ http://www.eda.org/ibis/icm_bugs/icm_bugform.txt To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which reside at: http://www.eda.org/ibis/bugs/s2ibis/bugs2i.txt http://www.eda.org/ibis/bugs/s2ibis2/bugs2i2.txt http://www.eda.org/ibis/bugs/s2iplt/bugsplt.txt Information on IBIS technical contents, IBIS participants and actual IBIS models are available on the IBIS Home page: http://www.eda.org/ibis Check the IBIS file directory on eda.org for more information on previous discussions and results: http://www.eda.org/ibis/directory.html To create an account on the TechAmerica KAVI workspace, check out: http://workspace.techamerica.org/kwspub/join/ Other trademarks, brands and names are the property of their respective owners. IBIS CURRENT MEMBER VOTING STATUS I/O Buffer Information Specification Committee (IBIS) |Organization |Interest |Standar|October|Novembe|Novembe|Novembe| | |Category |ds |26, |r 9, |r 13, |r 16, | | | |Ballot |2012 |2012 |2012 |2012 | | | |Voting | | | | | | | |Status | | | | | |Agilent |User |Active |X |X |X |X | |Technologies | | | | | | | |Altera |Producer |Inactiv|- |- |- |- | | | |e | | | | | |ANSYS |User |Active |- |X |X |X | |Applied Simulation|User |Inactiv|- |- |- |- | |Technology | |e | | | | | |ARM |Producer |Inactiv|- |- |- |- | | | |e | | | | | |Cadence Design |User |Active |X |X |X |X | |Systems | | | | | | | |Ericsson |Producer |Active |X |X |X |X | |Foxconn Technology|Producer |Inactiv|- |- |X |- | |Group | |e | | | | | |Freescale |Producer |Inactiv|- |- |- |X | | | |e | | | | | |Huawei |Producer |Inactiv|- |X |- |- | |Technologies | |e | | | | | |IBM |Producer |Inactiv|X |- |- |- | | | |e | | | | | |Infineon |Producer |Inactiv|- |- |- |- | |Technologies AG | |e | | | | | |Intel Corp. |Producer |Active |X |X |X |- | |IO Methodology |User |Active |X |X |X |X | |LSI |Producer |Inactiv|- |- |- |- | | | |e | | | | | |Maxim Integrated |Producer |Inactiv|- |- |- |- | |Products | |e | | | | | |Mentor Graphics |User |Inactiv|X |- |- |X | | | |e | | | | | |Micron Technology |Producer |Inactiv|X |- |- |- | | | |e | | | | | |Nokia Siemens |Producer |Inactiv|- |X |- |- | |Networks | |e | | | | | |QLogic |Producer |Inactiv|- |- |- |- | | | |e | | | | | |Signal Integrity |User |Inactiv|X |- |- |- | |Software | |e | | | | | |Sigrity |User |Inactiv|- |- |- |- | | | |e | | | | | |Synopsys |User |Inactiv|- |X |- |- | | | |e | | | | | |Teraspeed |General |Inactiv|X |- |- |- | |Consulting |Interest |e | | | | | |Texas Instruments |Producer |Inactiv|- |- |- |- | | | |e | | | | | |Toshiba |Producer |Inactiv|- |- |- |X | | | |e | | | | | |Xilinx |Producer |Inactiv|- |- |- |- | | | |e | | | | | |ZTE |User |Inactiv|- |X |- |- | | | |e | | | | | |Zuken |User |Inactiv|- |- |- |X | | | |e | | | | | Criteria for Member in good standing: • Must attend two consecutive meetings to establish voting membership • Membership dues current • Must not miss two consecutive Meetings Interest categories associated with TechAmerica ballot voting are: • Users - Members that utilize electronic equipment to provide services to an end user. • Producers - Members that supply electronic equipment. • General Interest - Members are neither producers nor users. This category includes, but is not limited to, Government, regulatory agencies (state and federal), researchers, other organizations and associations, and/or consumers.