IBIS Open Forum Minutes Meeting Date: November 22, 2013 Meeting Location: Yokohama, Japan VOTING MEMBERS AND 2013 PARTICIPANTS Agilent Technologies Radek Biernacki, Pegah Alavi, Heidi Barnes, Fangyi Rao, Colin Warwick, Tarun Kalwani, Ming Yan, Xingdong Xue, Zaokai Yuan, Xianzhi Zhao, Ming-Chih Lin, Peter Lin, Hiroaki Sasaki*, Toshinori Kageura* Altera David Banas, Hsinho Wu ANSYS [Luis Armenta], Ben Franklin, Dan Dvorscak, Steve Pytel, Lan Chen, Timothy (Gang) Chen, Minggang Hou, Jianbo Liu, Roger Luo, Peng Wang, Shulong Wu, Guoli Yi, Daniel Chang, Richard Chen, Naijen Hsuan, Charlotte Wang, Jean Wang, Jerry Wang, Benson Wei, Shigeru Sano* Applied Simulation Technology Fred Balistreri, Norio Matsui Cadence Design Systems [Terry Jernberg], Joy Li, Yingxin Sun, Ambrish Varma, Kevin Yao, Brad Brim, Aileen Chen, Lanbing Chen, Raymond Y. Chen, Heiko Dudek, Jiayuan Fang, Zhiqiang (Johnny) Fang, Henry He, Jinsong Hu, Li Li, Maofeng Li, Ping Liu, Yubao Meng, Zuli Qin, Aaron Tang, Haisan Wang, Yun Wang, Yitong Wen, Janie Wu, Yanrui (Clark) Wu, Dingru Xiao, Benny Yan, Wenjian Zhang, Zhangmin Zhong, Tric Chiang, Thunder Lay, Jack (Wei-Chang) Lin, Paddy Wu, Candy Yu, Yukio Masuko*, Takuya Moriya*, Morihiro Nakazato*, Watanabe Yasuyuki* Ericsson Anders Ekholm*, Martina Fiammengo, Markus Janis* Foxconn Technology Group Leo Cheng, Po-Chuan (Eric) Hsieh, Alex Tang Huawei Technologies Yu Chen, Xiaoqing Dong, Jing Fu, Chen Han, Peng Huang, Jinjun Li, Lingfei Li, Luya Ma, Xiao Peng, Xinlu Peng, Haili Wang, Shengli (Victory) Wang, Zhengrong Xu, Hongxian Yi, Gezi Zhang, Zhengyi Zhu IBM Greg Edlund, Adge Hawes, Dale Becker Infineon Technologies AG (Christian Sporrer) Intel Corporation Michael Mirmak*, Mohammad Bapi, Stewart Gilbert, Ravindra Rudraraju, Kang Nan, Weifeng Shu, Ming Wei, Jimmy Hsu, Thomas (YiRen) Su IO Methodology Lance Wang LSI Brian Burdick, Sarika Jain, Xingdong Dai, Anaam Ansari, Min Huang Maxim Integrated Products Hassan Rafat, Mahbubul Bari, Ron Olisar Mentor Graphics Arpad Muranyi, Ed Bartlett, Vladimir Dmitriev- Zdorov Micron Technology Randy Wolff Signal Integrity Software Walter Katz, Mike LaBonte, Mike Steinberger, Todd Westerhoff Synopsys John Ellis, Ted Mido, Scott Wedge, Rinsha Reghunath, Xuefeng Chen, Jinghua Huang, Yu Wang Teraspeed Consulting Group Bob Ross, Tom Dagostino Toshiba Yuui Shimizu*, Yoshinori Fukuba* Xilinx (Raymond Anderson) Zuken Masaud Raeisi, Reinhard Remmert, Michael Schaeder, Alfonso Gambuzza, Kiyohisa Hasegawa* OTHER PARTICIPANTS IN 2013 Abeism Corp Nobuyuki Kiyota* Accton Technology Group Ching-Hwei Tsend, Xian-Wei Wang AET Norihide Taguchi* AMD Tadashi Arai* ASE Group Hink Chung, Jarris Kuo Astrodesign Nishi Yoshiaki* ASUSTek Computer Vincent Lu AU Optronics Corp Jason Kuo, Joe Shih Avant Technology Elvis Li, Linda Sun, Jyam Huang, Enson Lee Bayside Design Elliot Nahas C-Tech Hideki Inada* Canon Yuji Ishikawa*, Takamasa Sakuragi* Canon Components Hisayuki Tamura* Casio Computer Yasuhisa Hayashi*, Ikuo Imada* Celestica Lei Liu, Fei Xue Chinese Electronics Technology Shujun Wei, Tianjiao Wu Company Institute #52 (CETC52) Chino Akio Nakanishi* Cisco Systems Biao Chen, Feng Wu, Iris Zhao Computer Simulation Technology Heiko Grubrich Compal Electronics Scott C.H. Li Contech Zheng Tang Coriant Bruce (Zhenshui) Qin Cybernet Systems Takayuki Tsuzura*, Wataru Nakagawa* Delta Networks Skipper Liang Eastwell Xuanjiang Shen, Xiuqing Ye ECL Advantage Thomas Iddings Elpida Memory Toshio Oki* Etrain China Weichun Lu FiberHome Technologies Group Shengyao Wan, Xuanjun Xia Freescale Semiconductor Jon Burnett, Takahiro Sato* Fuji Xerox Tadamasa Sakamaki* Fuji Xerox Manufacturing Rumi Maeda* Fujitsu Advanced Technologies Yoshiyuki Iwakura*, Kazuhiro Kanai*, Hikoyuki Kawata*, Ryo Mizutani*, Syougo Fujimori*, Hidenobu Shiihara*, Kumiko Teramae* Fujitsu Interconnect Technologies Hiromi Hayasaka* Fujitsu Laboratories Toshiki Iwai*, Satoshi Matsubara* Fujitsu Microelectronics Solutions Saharu Kamimura*, Jyun Uchita*, Yutaka Ide* Fujitsu Semiconductor Hirokazu Yamazaki*, Yu Kamata*, Motoaki Matsumura*, Shintaro Ohtani*, Megumi Oono* Fujitsu VLSI Shizue Katoh*, Hiroki Kubota* Giga Hertz Technology Ryuji Kawamura* Granite River Labs Vamshi Kandalla, Miki Takahashi H3C Lichen Li, Xiaoxiang Li Hewlett-Packard Yongjin Choi, Ting Zhu Himax Technologies Falco Chuang, Lee Renee, Austin Wang, Josh Wu Hisense Aofeng Qian Hitachi Ritsurou Orihashi* Hitachi Information & Yoshifumi Takada* Communication Hitachi Kokusai Electric Kunihito Seguchi* Hitachi ULSI Systems Co. Hiroshi Uematsu*, Sadahiro Nonoyama* ILI Technology Corp Tieyan Chang, Chia-Chen (Trevor) Wu Inventec Zhong Peng Innotech Corporation Tasuku Kanomata* Japan Aviation Electronics Industry Norihiro Andou* Japan Radio Co. Takashi Satoh* JEITA Atsushi Ishikawa* JVC Kenwood Corporation Takuo Fujimura*, Hidetoshi Suzuki* KEI Systems Shinichi Maeda* Kyocera Circuit Solutions Kiyohiko Kaiya*, Toshiyuki Kaneko* Kyoden Co. Shinichi Mochida* Lapis Semiconductor Yuki Akyama* Lenovo John Lin, Alan Sun Marvell Technology Group Weizhe Li, Fang Lv, Banglong Qian, Yuyang Wang Mediatek Gerald Hsu, Fandy Huang MD Systems Hidetoshi Ogawa* Megachips Corporation Yoshimasa Yahata* Meidensha Corporation Ryu Neruson* Mitsubishi Electric Corporation Suzuki Yusuke*, Takumi Kurihara* Micro-Star International Ethan Huang, Anthony Liang, PeterTsai, Cloud Tseng Molex Davi Correia, Greg Fu, Satish National Instruments Lee Mohrmann Nikon Corporation Kazuomi Tominaga*, Manabu Matsumoto* Nisoul Co. Kaoru Tazaki* Nokia Siemens Networks Xuhui (Helen) Chen, Gino Guo, Gang Zheng Novatek Microelectronics Corp Jasper Cheng, Willy Lin, Frank Pai Nvidia Eric Hsu, David Chen, Alan (Chia Yuan) Hsieh, MT Lin, Chih Wei Tsai Oki Electric Industry Co. Atsushi Kitai*, Kenichi Saitou* Open Silicon Norman Chang Pegatron Corp Lawrence Ting Polar Instruments Tetsuya Koizumi* Qualcomm Scott Powers QLogic James Zhou RDA Microelectronics Ke Cao Ricoh Company Daisuke Koya*, Kazuki Murata*, Kazumasa Oaki*, Mitsuo Kaibara*, Miyoko Goto*, Toshihiko Makino*, Yasuhiro Akita* Rohm Co. Noboru Takizawa* SAE (Chris Denham) Sanei Hytechs Co. Hiroyuki Kai* Seiko Epson Corporation Minoru Kozaki* Semiconductor Manufacturing Sheral Qi International Corp. Shanghai Microsystem and Chi Xu Information Technology Institute Shanghai United-Imaging Xi Huang, Yuan Liu, Jirui Lu, Chun Yuan, Yi Zhao Shibaura Institute of Technology Seiju Ichijo* Spreadtrum Communications Lily Dai, Steven Guo Shanghai Signalkhobho Atsuhito Noda* Silvaco Kunio Hitomi* Sony Corporation Haruhiro Saito*, Sachio Iida* Sony Engineering Corporation Atsushi Yoshimoto* Sony LSI Design Naoyuki Morinaga* Stanley Electric Co. Motoharu Kishi* Success International Corporation Tatsuo Futai* Sunplus Technology Forest Hsu, Yi-Tzeng Lin TDK-EPC Corporation Katsufumi Ehata* TechAmerica [(Chris Denham)] Tektronix Hitoshi Hatakeyama* Teledyne LeCroy Xuanfeng Wu, Ting Zhao Teradyne Raymond Yakura Test Research Mike Wang TFF Corporation Katsuhiko Suzuki* Toshiba Information Systems Mari Kuroki* Toshiba Microelectronics Junya Masumi* Toshiba Semiconductor & Storage Yasunobu Umemoto* Towa Electronics Yoshikazu Suzuki* Université de Brest Mihai Telescu University of Illinois Tom Comberiate, José Schutt-Ainé, Xu Chen VeriSilicon Tina Xu VIA Labs Sheng-Yuan Lee VIA Telecom Jen-Hung (Eddie) Lin, Jacky Liu Vitesse Semiconductor Sirius Tsang Wadow Kazuhiko Kusunoki* Winbond Electronics Corp Albert (Cheng-Han) Lee, Marko (Chien- Cheng) Lin YDC Corporation Yoshiaki Manabe* YDK Co. Yoshio Takemura* Zhejiang Uniview Technologies Huanyang Chen, Fei Ye ZTE Corporation Huifeng Chen, Fengling Gao, Tao Guo, Hui Jiang, Zhi Zhou, Shunlin Zhu In the list above, attendees at the meeting are indicated by *. Principal members or other active members who have not attended are in parentheses. Participants who no longer are in the organization are in square brackets. UPCOMING MEETINGS The bridge numbers for future IBIS teleconferences are as follows: Date Meeting Number Meeting Password December 6, 2013 205 475 958 IBIS For teleconference dial-in information, use the password at the following website: https://ciscosales.webex.com/ciscosales/j.php?J=205475958 All teleconference meetings are 8:00 AM to 9:55 AM US Pacific Time. Meeting agendas are typically distributed seven days before each Open Forum. Minutes are typically distributed within seven days of the corresponding meeting. When calling into the meeting, follow the prompts to enter the meeting ID. For new, local international dial-in numbers, please reference the bridge numbers provided by Cisco Systems at the following link: http://www.cisco.com/web/about/doing_business/conferencing/index.html NOTE: "AR" = Action Required. ---------------------------------------------------------------------------- --------------------------------------------------- WELCOME AND KEYNOTE COMMENTS The IBIS Open Forum summit was held in Yokohama, Japan, co-located with the Electronics Design Solutions Fair (EDS Fair) at the Pacifico Yokohama Conference Center. About 107 people representing 74 organizations attended. The notes below capture some of the content and discussions. The meeting presentations and other documents are available at: http://www.eda.org/pub/ibis/summits/nov13c/ Michael Mirmak opened the eighth Asian IBIS Summit in Yokohama, Japan. Haruhiro Saito (JEITA EC Working Group Chair and Sony Corporation) welcomed everyone and looked forward to a productive meeting. Yoshinori Fukuba (JEITA LPB Working Group Chair and Toshiba) also provided introductions and welcomes and mentioned ongoing LPB work with IEEE. Michael provided some brief remarks, thanked JEITA for their support and providing excellent facilities. INTRODUCING IBIS 6.0 Michael Mirmak (Intel Corporation, USA) Michael Mirmak noted that IBIS 6.0 was released September 20, 2013. Major additions focus on IBIS-AMI including added support for redrivers and retimers and IBIS-ISS and Touchstone. The document is now easier to read and use. Michael gave detailed examples of modeling a mid-bus repeater. In IBIS 6.0, IBIS-ISS can be used to represent the complex analog buffer behavior of an AMI model. Multiple files in different locations are now supported for AMI models. Use of IBIS 6.0 improved analog modeling can help ensure model portability. Among issues to resolve is improving IBIS package modeling. Package modeling formats are being discussed with a target to include an update in the next major IBIS release. Developing an IBISCHK6 syntax parser is a focus now. A question was asked about whether major and minor versions will be released twice a year. Michael responded that it depends. He expects the audience to provide feedback on IBIS feature needs and schedule. IBIS SUMMARY DOCUMENTS Bob Ross (Teraspeed Consulting Group, USA) [Presented by Anders Ekholm (Ericsson, Sweden)] Anders Elkholm presented information about several documents created by Bob Ross to accompany the IBIS 6.0 specification release. IBIS 6.0 contains a keyword hierarchy tree in section 3.1. Bob updated an unofficial hierarchy document from 2007 with information from IBIS versions 5.1 and 6.0. Extra information in this document includes when items were added at major versions. Bob also created an unofficial evolution document featuring updated columns showing major version evolution, rules and changes evolution and significant subparameter selections such as the *_type subparameter choices. Anders also noted that Bob helped create four new summary tables in section 10.7 of the IBIS 6.0 specification. These tables include Usages, Types and Formats for Reserved Parameters and Types for Format values. The summary information provides quick references for IBIS and IBIS-AMI syntax. The documents are found on the IBIS website along with the IBIS 6.0 specification. ibis AMI MODEL (ALGORITHMIC mODEL INTERFACE) – THEORY & STRUCTURE Shinichi Maeda (KEI Systems, Japan) Maeda-san began by summarizing the types of SerDes interfaces that require IBIS-AMI models. He then described the theory behind statistical simulations, including the LTI system assumptions. He defined the differences between traditional IBIS models and IBIS-AMI models and gave details on AMI model syntax. He then presented an IBIS-AMI reference flow. He concluded with some concerns for IBIS-AMI including inability to check the model accuracy, simulator dependencies and minimal documentation. Someone commented that the claims on lack of interoperability with tool dependent models were mostly an IBIS 5.0 problem. Another comment was about a typo of ‘AMI’ on slide 16. Another comment was that the syntax on slide 17 showed a very sharp edge rate ramp. A survey of people in the room showed that only a few have used IBIS-AMI. CORRELATION BETWEEN IBIS5.X AND SPICE Kazuki Murata (Ricoh Company Ltd., Japan) Murata-san performed two correlation studies using IBIS models and Spice models. The first study compared an IBIS-AMI model of a Ricoh SerDes Tx with Spice and lab measurements. Simulations were performed with four different tools. Murata-san concluded that the IBIS-AMI model was highly correlative with Spice and measurements, differences between simulators were not recognized and simulation time was much shorter than typical transient simulation time. Murata-san then showed the results of a correlation study comparing an IBIS 5.1 power-aware model to Spice. He simulated a DDR3 system with 70 I/Os to show SSO conditions. ISSO and Composite Current keywords were used. Simulating the system using Spice models took 24 hours. The IBIS 5.1 power- aware models were used in two simulators. At 533 MHz, one simulator appeared to have low accuracy due to overclocking issues. He also showed that SSO noise correlated better with Spice when a voltage controlled capacitor was used to model the on-die power supply decoupling. Murata-san noted that jitter due to SSO was smaller using the IBIS models than in Spice. AN ADVANCED BEHAVIORAL BUFFER MODEL WITH OVER-CLOCKING SOLUTION Yingxin Sun and Raymond Y. Chen (Cadence Design Systems, USA) [Presented by Morihiro Nakazato (Cadence Design Systems, Japan)] Morihiro Nakazato began by describing the mechanisms related to overclocking of IBIS models. A simulator that does not properly window V-T data will give incorrect results, sometimes showing missing bits. V-T windowing works well for IBIS 4.2 models. However, for IBIS 5.0 models that include I-T data, using the same V-T windowing algorithm will cut off the pre-driver current seen in the composite current I-T data. Nakazato- san proposed an advanced over-clocking solution, where a pre-driver stage was added to the driver stage. With this model, the composite current could be broken into two portions, the contribution from the driver and the contribution from the pre-driver. The proposed over-clocking solution could be implemented into an advanced IBIS simulator to automatically handle the windowing of both V-T and I-T data. With this solution, very good correlation was seen between IBIS and the original transistor model for real SSO simulation, even under over-clocking scenarios. Michael Mirmak asked if we were to accomplish this in the specification, we would need a new keyword for pre-driver Composite Current, correct? Nakazato-san responded that yes, that would be one solution for the next IBIS version. COMBINED I-V TABLE CHECKING PROBLEM Bob Ross*, Yingxin Sun** and Joy Li** (*Teraspeed Consulting Group, **Cadence Design Systems, USA) [Presented by Anders Ekholm (Ericsson, Sweden)] Anders Ekholm began by describing BUG140, where unexpected non-monotonic warnings are issued for combined I-V tables. There is no specification requirement that individual or combined I-V tables be monotonic. Combined table checks were added to the IBIS parser following BUG94. Non- monotonicity often occurs outside of normal simulation regions (clamp regions) and is not a problem for simulation software. Anders walked through a simple example to demonstrate how piecewise linear interpolation methods can cause non-monotonicities when combining two data sets. Anders then showed two test case examples from BUG140. The Quality task group discussed several options for fixes including using more complicated SPLINE fitting algorithms. The final resolution was to change the warning to a note. IBIS MODEL FOR IO-SSO ANALYSIS Thunder Lay and Jack W.C. Lin (Cadence Design Systems, Taiwan) [Presented by Takuya Moriya (Cadence Design Systems, Japan)] Takuya Moriya began by defining Simultaneous Switching outputs Noise (SSN). SSN impacts timing and noise margin and becomes a bigger problem as voltages decrease and data rates increase. Traditional SSN simulations can be pessimistic when the analysis excludes an on-die decoupling model or includes an estimated on-die decoupling model. An accurate RC or distributed chip PDN model is needed for realistic power/ground noise analysis. Moriya-san showed a method of using [External Circuit] in IBIS 5.1 to incorporate on-die and package models into the buffer. Moriya-san then showed a case study of a DDR data byte lane including a power-aware IBIS model, on-chip decoupling model and PCB and package S-parameters converted to broadband-Spice models. Without a chip PDN model, SSN is overestimated. With an on-die RC PDN model, the noise is underestimated. Using a distributed broadband model of the on-die PDN gave the most realistic results. Moriya-san summarized that for tighter timing and noise budgets in LPDDR3 or DDR4, system level SSN analysis is helpful for design margin assessment. IBIS MODEL WHICH IS ACCESSIBLE TO BEGINNERS Kazuhiko Kusunoki (Wadow, Japan) Kusunoki-san began by thanking a senior IBIS simulation expert present in the audience who has been in the simulation world for 30 years. He went on to give an overview of the types of products being designed in Japan. The majority of Wadow’s projects are using existing technology, not leading edge concepts. Product issues therefore tend to be focused not on GHz+ frequency issues but on reducing PCB layer counts while increasing clock frequencies and decreasing EMI issues. He noted that the number of IBIS model beginners is increasing daily, as most products have some SI issues. However, budget and time constraints are not encouraging users to learn IBIS in-depth. Kusunoki-san called for IBIS users to join a Facebook group called “CROSSTALKS” which discusses IBIS issues. CONCLUDING ITEMS Michael Mirmak thanked the attendees and co-sponsors and JEITA for sponsoring and arranging the meeting. The meeting adjourned at approximately 5:30 PM. NEXT MEETING The next IBIS Open Forum teleconference will be held December 6, 2012 from 8:00 to 10:00 AM US Pacific Time. ======================================================================= NOTES IBIS CHAIR: Michael Mirmak (916) 356-4261, Fax (916) 377-3788 michael.mirmak@intel.com Data Center Platform Applications Engineering Intel Corporation FM5-239 1900 Prairie City Rd., Folsom, CA 95630 VICE CHAIR: Lance Wang (978) 633-3388 lwang@iometh.com President/CEO, IO Methodology, Inc. PO Box 2099 Acton, MA 01720 SECRETARY: Randy Wolff (208) 363-1764, Fax: (208) 368-3475 rrwolff@micron.com Principal Engineer, Modeling Engineering Lead, Micron Technology, Inc. 8000 S. Federal Way Mail Stop: 01-711 Boise, ID 83707-0006 LIBRARIAN: Anders Ekholm (46) 10 714 27 58, Fax: (46) 8 757 23 40 ibis-librarian@eda.org Digital Modules Design, PDU Base Stations, Ericsson AB BU Network Färögatan 6 164 80 Stockholm, Sweden WEBMASTER: Mike LaBonte mikelabonte@eda.org IBIS-AMI Modeling Specialist, Signal Integrity Software 6 Clock Tower Place Maynard, MA 01754 POSTMASTER: Mike LaBonte mikelabonte@eda.org IBIS-AMI Modeling Specialist, Signal Integrity Software 6 Clock Tower Place Maynard, MA 01754 This meeting was conducted in accordance with ANSI guidance. The following e-mail addresses are used: majordomo@eda.org In the body, for the IBIS Open Forum Reflector: subscribe ibis In the body, for the IBIS Users' Group Reflector: subscribe ibis-users Help and other commands: help ibis-request@eda.org To join, change, or drop from either or both: IBIS Open Forum Reflector (ibis@eda.org) IBIS Users' Group Reflector (ibis-users@eda.org) State your request. ibis-info@eda.org To obtain general information about IBIS, to ask specific questions for individual response, and to inquire about joining the IBIS Open Forum as a full Member. ibis@eda.org To send a message to the general IBIS Open Forum Reflector. This is used mostly for IBIS Standardization business and future IBIS technical enhancements. Job posting information is not permitted. ibis-users@eda.org To send a message to the IBIS Users' Group Reflector. This is used mostly for IBIS clarification, current modeling issues, and general user concerns. Job posting information is not permitted. ibis-bug@eda.org To report ibischk parser BUGs as well as tschk2 parser BUGs. The BUG Report Form for ibischk resides along with reported BUGs at: http://www.eda.org/ibis/bugs/ibischk/ http://www.eda.org/ibis/bugs/ibischk/bugform.txt The BUG Report Form for tschk2 resides along with reported BUGs at: http://www.eda.org/ibis/tschk_bugs/ http://www.eda.org/ibis/tschk_bugs/bugform.txt icm-bug@eda.org To report icmchk1 parser BUGs. The BUG Report Form resides along with reported BUGs at: http://www.eda.org/ibis/icm_bugs/ http://www.eda.org/ibis/icm_bugs/icm_bugform.txt To report s2ibis, s2ibis2 and s2iplt bugs, use the Bug Report Forms which reside at: http://www.eda.org/ibis/bugs/s2ibis/bugs2i.txt http://www.eda.org/ibis/bugs/s2ibis2/bugs2i2.txt http://www.eda.org/ibis/bugs/s2iplt/bugsplt.txt Information on IBIS technical contents, IBIS participants and actual IBIS models are available on the IBIS Home page: http://www.eda.org/ibis Check the IBIS file directory on eda.org for more information on previous discussions and results: http://www.eda.org/ibis/directory.html Other trademarks, brands and names are the property of their respective owners. IBIS – SAE STANDARDS BALLOT VOTING STATUS I/O Buffer Information Specification Committee (IBIS) |Organization |Interest |Standar|Novembe|Novembe|Novembe|Novembe| | |Category |ds |r 1, |r 15, |r 19, |r 22, | | | |Ballot |2013 |2013 |2013 |2013 | | | |Voting | | | | | | | |Status | | | | | |Agilent |User |Active |X |X |X |X | |Technologies | | | | | | | |Altera |Producer |Inactiv|X |- |- |- | | | |e | | | | | |ANSYS |User |Active |- |X |X |X | |Applied Simulation|User |Inactiv|- |- |- |- | |Technology | |e | | | | | |Cadence Design |User |Active |X |X |X |X | |Systems | | | | | | | |Ericsson |Producer |Active |- |X |X |X | |Foxconn Technology|Producer |Inactiv|- |- |X |- | |Group | |e | | | | | |Huawei |Producer |Inactiv|- |X |- |- | |Technologies | |e | | | | | |IBM |Producer |Inactiv|X |- |- |- | | | |e | | | | | |Infineon |Producer |Inactiv|- |- |- |- | |Technologies AG | |e | | | | | |Intel Corp. |Producer |Active |X |X |X |X | |IO Methodology |User |Active |- |X |X |- | |LSI |Producer |Inactiv|X |- |- |- | | | |e | | | | | |Maxim Integrated |Producer |Inactiv|- |- |- |- | |Products | |e | | | | | |Mentor Graphics |User |Inactiv|X |- |- |- | | | |e | | | | | |Micron Technology |Producer |Inactiv|X |- |- |- | | | |e | | | | | |Signal Integrity |User |Inactiv|X |- |- |- | |Software | |e | | | | | |Synopsys |User |Inactiv|- |X |- |- | | | |e | | | | | |Teraspeed |General |Inactiv|X |- |- |- | |Consulting |Interest |e | | | | | |Toshiba |Producer |Inactiv|- |- |- |X | | | |e | | | | | |Xilinx |Producer |Inactiv|- |- |- |- | | | |e | | | | | |Zuken |User |Inactiv|- |- |- |X | | | |e | | | | | Criteria for Member in good standing: • Must attend two consecutive meetings to establish voting membership • Membership dues current • Must not miss two consecutive Meetings Interest categories associated with SAE ballot voting are: • Users - Members that utilize electronic equipment to provide services to an end user. • Producers - Members that supply electronic equipment. • General Interest - Members are neither producers nor users. This category includes, but is not limited to, Government, regulatory agencies (state and federal), researchers, other organizations and associations, and/or consumers.