* TO BE UPLOADED

CONTENTS OF THE EUROPEAN IBIS OPEN FORUM SUMMIT MEETING
February 20, 2004
Paris, France

   .zip  Compressed
   .ppt, .pps  Power Point
   .doc  Word
   .ps   Postscript
   .pdf  Acrobat
   .txt  Text

ADMINISTRATIVE DOCUMENTS:

00readme.txt     This Document
a022004.txt      Agenda
m022004s.txt     Minutes

PRESENTATIONS AND ACTUAL TITLES (IN ACTUAL ORDER OF PRESENTATION):

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agenda.zip       Agenda (.ppt)
agenda.pdf


haller.zip       IBIS Quality (.ppt)
haller.pdf       Robert Haller, Single Integrity Software, USA
                 (Originally Given at the February 2, 2004 IBIS
                 Summit Meeting in Santa Clara, California)
                 (Presented by Eckhard Lenski, Siemens AG, Germany)

klos.zip         Verification of IBIS Models (.ppt)
klos.pdf         Hans Klos, Sintec BV, The Netherlands

maurer.pdf       Sensitivity Analysis of IBIS-Parameters with HSPICE
                 Manfred Maurer, Siemens AG, Germany

lenski.zip       IBIS Models, Current Status (4.1) and Some Notes on
lenski.pdf       Version 4.0 Parameters (.ppt)
                 Eckhard Lenski, Siemens AG, Germany
 
bruening.pdf     IBIS & Modelling Needs for a Fast EMI & Power
                 Integrity Analysis of PCB's
                 Ralf Bruening, Markus Buecker, Michael Schaeder,
                 Zuken, Germany
                 (Presented by Ralf Bruening, Zuken, Germany)

sicard.zip       IC-Emit: Comparing Simulated/Measured IC Emission
sicard.pdf       Spectrum (.ppt)
                 Etienne Sicard, INSA, Toulouse, Amaury Soubeyran,
                 EADS, France
                 (Presented by Etienne Sicard)

rousseau.zip     The Benefits of Multi-Lingual Extensions to
rousseau.pdf     IBIS (.ppt)
                 Stephane Rousseau, Mentor Graphics, France

stievano.zip     Parametric Models in IBIS Multilingual Framework (.ppt)    
stievano.pdf     F.G. Canavero, I.A. Maio, B. Ross*,  I.S. Stievano,
                 Politecnico di Torino, Italy,
                 Teraspeed Consulting Group*, USA
                 (Presented by Igor Stievano)

engin.pdf        Lumped Skin Effect Model for Package Leads
                 A. Ege Engin, Fraunhofer Institute Reliability and
                 Microintegration, University of Patterborn, Germany