------------------------------------------------------------------ AGENDA, EUROPEAN IBIS SUMMIT MEETING Wednesday, May 13, 2015 Seminaris Campus Hotel Berlin/ Dahlem Cube Takustraße 39, 14195 Berlin, Germany Room: Cambridge (Check at Entrance) ------------------------------------------------------------------ 13:00 SIGN IN 13:15 WELCOME AND INTRODUCTIONS Randy WOLFF, Micron Technology, IBIS Secretary, USA 13:30 Physics and Modeling of Vias in Printed Circuit Boards Jan PREIBISCH and Christian SCHUSTER, Technische Universitat Hamburg-Harburg, Germany [Presented by Jan PREIBISCH] 14:30 Chair's Status Report Michael MIRMAK, Intel Corporation USA [Presented by Randy WOLFF, Micron Technology, USA] 15:00 IBIS Model Formulation and Extraction for SPI Evaluation Wael DGHAIS, Kevin F.G. PINTO, and Jonathan RODRIGUEZ; University of Averio, Institute of Telecommunications, Portugal [Presented by Wael DGHAIS] 15:30 BREAK (15 Minutes) 15:45 [Define Package Model] Proposed Extension Arpad MURANYI*, Randy WOLFF**, Radek BIERNACKI***, and Bob ROSS****, *Mentor Graphics Corp., **Micron Technology, ***Keysight Technology, and ****Teraspeed Labs, USA [Presented by Randy WOLFF] 16:15 Interconnect Task Group Update - Package Modeling Randy WOLFF, Micron Technology, USA 16:45 Time Response Utility (.pptx) Bob ROSS, Teraspeed Labs, USA [Presented by Anders EKHOLM, Ericsson, Sweden] 17:15 DISCUSSION AND CLOSING REMARKS Randy WOLFF, Micron Technology, USA 18:00 END OF MEETING ------------------------------------------------------------------ REGISTRATION INFORMATION People involved in IBIS Model development, EDA tool development, and digital circuit design are invited to participate to the Summit meeting. If you plan to participate, please register with the information below: Name: E-mail address: Company: Send to: Lance WANG (lwang@iometh.com) SPONSORS: ANSYS, CST, Mentor Graphics Corporation, Synopsys, Zuken SPI CONFERENCE INFORMATION AND TRAVEL DIRECTIONS See http://www.spi2015.org/ for travel directions, IBIS meeting hotel and other information. ------------------------------------------------------------------