* To be uploaded

CONTENT OF THE ASIAN IBIS OPEN FORUM SUMMIT MEETING
November 9, 2010
Shenzhen, China

   .zip  Compressed
   .ppt, .pps  Power Point
   .doc  Word
   .ps   Postscript
   .pdf  Acrobat
   .txt  Text
   .jpg  Pictures

ADMINISTRATIVE DOCUMENTS:

00readme.txt      This Document

a110910.txt        Agenda
m110910.pdf        Minutes
* survey.pdf       Pictures, Survey Report
                   Wang, Lance (IO Methodology, USA)

announcement_chinese.pdf  Announcement, Traditional Chinese

CONFERENCE RECORD:

cover.pdf          Cover Page
booklet.pdf        Conference booklet of presentations

PRESENTATIONS AND ACTUAL TITLES (IN ACTUAL ORDER OF PRESENTATION):

wang_l.pdf   Point Reduction Method for IBIS Curves
             Wang, Lance (IO Methodology, USA)

wang_h.pdf   IBIS for SSO Analysis
             Wang, HaiSan; Luo, Joshua, Lin, Jack; and Zhong, ZhangMin
             (Sigrity, China)   
             [Presented by Wang, HaiSan (Sigrity, China)]

luo.zip      PDN Design and Analysis Methodology in SI&PI Co-design (.ppt)
luo.pdf      Luo, ZiPeng and Liu, SuYao (Huawei Technologies, China)
             [Presented by Lou, ZiPeng, (Huawei Technologies, China)]

wolff.zip    Correlating C_pin Capacitance with Measurements (.ppt)
wolff.pdf    Wolff, Randy (Micron Technology, USA)

pino.pdf     Automated AMI Model Generation & Validaton
             Pino, Jose Luis*; Badesha, Amalak*; Luschas, Manuel**;
             Orpahanou, Antonis**; and Civit, Halil**, 
             (*Agilent Technologies, USA and **NetLogic Microsystems, USA)
             (Presented by Yuan, XuLiang (Agilent Technologies, China))

dong.pdf     Spice Subcircuit Support for Serial Link Channel Design
             Using IBIS [External Model]
             Dong, XiaoQing*: Zhong, ZhangMin**#; and Willis, Ken**##
             (*Huawei Technologies, China and **Sigrity, #China, and ##USA)
             [Presented by Dong, XiaoQing (Huawei Technologies, China)]

lin.pdf      Extending/Leveraging IBIS Constructs to Model High-Speed
             I/Os and Packages using AMI, Spice, and S-Parameters
             (Lin, John*, Al-Hawari, Feras**##, Kukal, Taranjit**#, and
             Varma, Ambrish**##, *Flextronic, China, and
             **Cadence Design Systems, #India and ##USA)
             [Presented by Dai, WenLiang (Cadence Design Systems, China)]

mirmak.zip   IBIS-ISS: What Is It and What It Means to You (.pptx)
mirmak.pdf   Mirmak, Michael (Intel Corporation, USA)

guan.pdf     Modeling Methods for Complex S-parameters in Touchstone 2.0
             Guan, JinKu and Zhu, ShunLin (ZTE Corporation, China)
             [Presented by Guan, JinKu (ZTE Corporation, China)]

kukal.pdf    Model Connection Protocol Extensions for Mixed Signal SiP
             Kukal, Taranjit*#; Dai, WenLiang*##; Brim, Brad**; and
             Fujine, Eiji***
             (*Cadence Design Systems, #India, ##China, **Sigrity, USA and
              ***Fujitsu VLSI Limited, Japan)
             [Presented by Dai, WenLiang (Cadence Design Systems, China)]