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       A S I A N   I B I S   S U M M I T    I N F O R M A T I O N

Time/Date:  8:15 - 17:30, Friday, November 14, 2014

Location:   Parkyard Hotel Shanghai
            699 Bibo Road
            Zhangjiang Hi-Tech Park
            Shanghai 201203
            P.R. China

Rooms:      Ballroom ABC (Look for signs)

Sponsors:   Huawei Technologies (Primary)
            ANSYS
            Intel Corporation
            IO Methodology
            Keysight Technologies
            Synopsys
            Teledyne LeCroy
            ZTE Corporation

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          I B I S  S U M M I T  M E E T I N G  A G E N D A

8:15    SIGN IN
         - Vendor Tables Open at 8:30

8:45    Welcome
          - Li, JinJun
            (Huawei Technologies, China)
          - Mirmak, Michael (Chair IBIS Open Forum)
            (Intel Corporation, USA)

9:00    Activities and Direction of IBIS
          Mirmak, Michael (Intel Corporation, USA)

9:25    Handling of Overclocking Caused by Delay in Waveform
        Tables
          Biernacki, Radek*; Yan, Ming*; Wolff, Randy**;
          Butterfield, Justin**
          (*Keysight Technologies, **Micron Technology, USA)

9:55    An Effective Solution to Simulate Composite Current When
        Over-clocking
          Chen, XueFeng (Synopsys, China)

10:25   BREAK (Refreshments and Vendor Tables)

10:45   True Differential IBIS Model for SerDes Analog Buffer
          Sharma, Shivani; Malik, Tushar; Kukal, Taranjit
          (Cadence Design Systems, India)

11:20   Best Practices for High-Speed Serial Link Simulation
          Hou, MingGang (ANSYS, China)

12:00   FREE BUFFET LUNCH (Hosted by Sponsors)
          - Vendor Tables

13:30   Connector Via Footprint Optimization for 25Gbps Channel
        Design
          Dai, WenLiang; Su, ZhouXiang
          (Xpeedic Technology, China)

14:00   Using IBIS-AMI Model for 25Gbps Retimer Simulation
          Wei, MaoXian; Yin, ChangGang; Zhu, ShunLin
          (ZTE Corporation, China)

14:30   IBIS AMI Validation
          Mahmod, Zilwan; Ekholm, Anders (Ericsson, Sweden)

15:00   BREAK (Refreshments and Vendor Tables)

15:20   Signing IBIS Model Against DDR4 Spec
          Malik, Tushar; Kukal, Taranjit
          (Cadence Design Systems, India)

15:55   Corner Considerations
          Ross, Bob (Teraspeed Labs, USA)

16:30   Ad Hoc Presentations and Discussion

        Skew Effect Analysis Using IBIS-AMI Model
          Dong, XiaoQing (Huawei Technologies, China)

17:20   CONCLUDING ITEMS

17:30   END OF IBIS SUMMIT MEETING

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