FILE: a111414.txt
TITLE: Agenda
TYPE: .txt
AUTHORLAST: 
AUTHORFIRST: 
COMPANY: IBIS Open Forum
DATE: Nov 14 2014
LOCATION: Shanghai, P.R. China

FILE: m111414.pdf
TITLE: Minutes
TYPE: .pdf
AUTHORLAST: 
AUTHORFIRST: 
COMPANY: IBIS Open Forum
DATE: Nov 14 2014
LOCATION: Shanghai, P.R. China

FILE: mirmak.pdf
TITLE: Activities and Direction of IBIS
TYPE: .pdf
AUTHORFIRST: Michael
AUTHORLAST: Mirmak
COMPANY: Intel Corporation
DATE: Nov 14 2014
LOCATION: Shanghai, P.R. China

FILE: mirmak.zip
TITLE: Activities and Direction of IBIS
TYPE: .pptx (.zip)
AUTHORFIRST: Michael
AUTHORLAST: Mirmak
COMPANY: Intel Corporation
DATE: Nov 14 2014
LOCATION: Shanghai, P.R. China

FILE: biernacki.pdf
TITLE: Handling Of Overclocking Caused by Delay in Waveform Tables
TYPE: .pdf
AUTHORLAST: Biernacki*, Ming Yan*, Randy Wolff**, and Justin Butterfield**
AUTHORFIRST: Radek
COMPANY: Keystone Technologies* and Micron Technology**
DATE: Nov 14 2014
LOCATION: Shanghai, P.R. China

FILE: chen.pdf
TITLE: An Effective Solution to Simulate Composite Current When Over-clocking
TYPE: .pdf
AUTHORLAST: Chen
AUTHORFIRST: Xuefeng  
COMPANY: Synopsys
DATE: Nov 14 2014
LOCATION: Shanghai, P.R. China

FILE: sharma.pdf
TITLE: True Differential IBIS Model for SerDes Analog 
TYPE: .pdf
AUTHORLAST: Sharma, Tushar Malik and Kukal Taranjit
AUTHORFIRST: Shivani  
COMPANY: Cadence Design Systems
DATE: Nov 14 2014
LOCATION: Shanghai, P.R. China

FILE: hou.pdf
TITLE: Best Practices for High-Speed Serial Link Simulation
TYPE: .pdf
AUTHORLAST: Hou
AUTHORFIRST: Minggang
COMPANY: ANSYS
DATE: Nov 14 2014
LOCATION: Shanghai, P.R. China

FILE: dia.pdf
TITLE: Connector Via Footprint Optimization for 25Gbps Channel Design
TYPE: .pdf
AUTHORLAST: Dia and Zhouxiang Su
AUTHORFIRST: Wenliang
COMPANY: Xpeedic Technology
DATE: Nov 14 2014
LOCATION: Shanghai, P.R. China

FILE: wei.pdf
TITLE: Using IBIS-AMI Model for 25Gbps Retimer Simulation
TYPE: .pdf
AUTHORLAST: Wei, Changgang Yin, and Shunlin Zhu
AUTHORFIRST: Maoxiang
COMPANY: ZTE Corporation
DATE: Nov 14 2014
LOCATION: Shanghai, P.R. China

FILE: mahmod.pdf
TITLE: IBIS AMI Validation
TYPE: .pdf
AUTHORLAST: Mahmod and Anders Ekholm
AUTHORFIRST: Zilwan
COMPANY: Ericsson
DATE: Nov 14 2014
LOCATION: Shanghai, P.R. China

FILE: malik.pdf
TITLE: Signing IBIS Model Against DDR4 Spec
TYPE: .pdf
AUTHORLAST: Malik and Taranjit Kukal
AUTHORFIRST: Tushar  
COMPANY: Cadence Design Systems
DATE: Nov 14 2014
LOCATION: Shanghai, P.R. China

FILE: wang.pdf 
TITLE: Inter-pair Skew Effect Analysis Using IBIS-AMI Simulation
TYPE: .pdf 
AUTHORFIRST: Jianhua
AUTHORLAST: Wang and Xiaoqing Dong
COMPANY: Huawei Technologies
DATE: Nov 14 2014 
LOCATION: Shanghai, P.R. China 

FILE: ross.pdf
TITLE: Corner Consideratons
TYPE: .pdf
AUTHORFIRST: Bob
AUTHORLAST: Ross
COMPANY: Teraspeed Labs
DATE: Nov 14 2014
LOCATION: Shanghai, P.R. China

FILE: ross.zip
TITLE: Corner Consideratons
TYPE: .pptx (.zip)
AUTHORFIRST: Bob
AUTHORLAST: Ross
COMPANY: Teraspeed Labs
DATE: Nov 14 2014
LOCATION: Shanghai, P.R. China