CONTENT OF THE ASIAN IBIS OPEN FORUM SUMMIT MEETING
November 20, 2014
Yokohama, Japan

   .zip  Compressed
   .ppt, .pps  Power Point
   .doc  Word
   .ps   Postscript
   .pdf  Acrobat
   .txt  Text
   .jpg  Pictures

ADMINISTRATIVE DOCUMENTS:

00readme.txt      This Document

a112014.txt        Agenda
m112014.pdf        Minutes


PRESENTATIONS AND ACTUAL TITLES (IN ACTUAL ORDER OF PRESENTATION):

mirmak.zip    Activities and Direction of IBIS
mirmak.pdf    Michael MIRMAK (Intel Corporation, USA)
              [Presented by Lance WANG (IO Methodology, USA)]

fujimori1.pdf Introduction of IBIS Promotion Working Group
              Shogo FUJIMORI (Fujitsu Advanced Technologies, Japan)

fujimori2.pdf Inconsistency of EBD (Electrical Board Description)
              Specification in DDR3 DIMM
              Shogo FUJIMORI (Fujitsu Advanced Technologies, Japan)

maeda.pdf     IBIS Package Model (Past, Present, What's Next)
              Shinichi MAEDA (KEI Systems, Japan)

wang.pdf      Differential Buffer Using IBIS Models for PDN
              Simulations
              Lance WANG (IO Methodology, USA)

sharma.pdf    True Differential IBIS Model for SerDes Analog Buffer
              Shivani SHARMA, Tushar MALIK, and Taranjit KUKAL
              (Cadence Design Systems, India)
              [Presented by Morihiro Nakazato
              (Cadence Design Systems, Japan)]

mahmod.pdf    IBIS AMI Validation
              Zilwan MAHMOD and Anders EKHOLM (Ericsson, Sweden)
              [Presented by Zilwan MAHMOD (Ericsson, Sweden)]

kusunoki.pdf  IBIS Model Engineering Application Possibility
              Kazuhiko KUSUNOKI (Wadow, Japan)

fukuba.pdf    Introduction of P2401 LSI-Package-Board Standard Format
              Yoshinori FUKUBA (Toshiba Semiconductor & Storage, Japan)