Re: [IBIS-Users] IBIS Interconnect Modeling Specification - Request for Feedback


Subject: Re: [IBIS-Users] IBIS Interconnect Modeling Specification - Request for Feedback
From: Lieby David (DLieby@acuson.com)
Date: Tue Jul 08 2003 - 08:53:52 PDT


Hi,

I have one comment about the draft. Under
Keyword: [Begin ICM Model],
Usage Rules:

'The name must be one of the model names listed under
the "model name" column of the preceding [ICM Model List]
keyword.'

If the specification allowed for additional models, not
included in the model name column, it would allow for
configuration of different connectors using the same
body of models. I presently use IBIS models for FPGA
designs where all the possible models for the chip are
included and use the Pin Mapping section. It may be a
minor usage but the flexibility may be nice to have.

dav0

Mirmak, Michael wrote:
> The IBIS Open Forum has completed and is now reviewing a new draft
> document called the IBIS Interconnect Modeling Specification (ICM).
> In brief, the ICM specification permits model authors to represent a
> wide variety of interconnects, including connectors, cables and
> packages, using a regular, ASCII-based, human-readable format.
> Interconnect topologies can be described using implicit (tree) or
> explicit (nodal) connections, and conductor swathing is supported.
> Coupling can be represented through RLGC matrices or S-parameter data
> in Touchstone(R) format.
>
> This new specification is a significant improvement on the current
> IBIS EBD and PKG formats. In order to help make it as useful as
> possible to the industry, the IBIS Open Forum requests your input.
> Please take a moment to review the draft specification, available
> at the following location:
>
> http://www.eda.org/pub/ibis/connector/
>
> Comments may be sent to the IBIS reflector, to me or to any IBIS
> Open Forum officer. Your feedback is important! The Open Forum
> intends to vote on approving or disapproving the specification on
> or before August 29.
>
> Thank you in advance for your support.
>
> - Michael Mirmak
> michael.mirmak@intel.com
> Intel Corp.
> Chair, EIA/IBIS Open Forum
>
>
>
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-- 
David Lieby, SI Engineering
Siemens Medical Solutions USA, Inc.
Ultrasound Division
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