[IBIS-Users] Asian IBIS Summit (Shanghai) - Fourth Announcement

From: Bob Ross <bob@teraspeed.com>
Date: Tue Oct 22 2013 - 16:23:22 PDT
To All:

 

The IBIS Open Forum is holding an Asian IBIS Summit Meeting in

Shanghai, China on Friday, November 15, 2013.

 

Several companies listed below are co-sponsoring this large event

to be held again at the Parkyard Hotel, Shanghai.

 

Some expected contributions are listed below.

 

For travel consideration, two other Asian IBIS Summits follow this

event:

 

  Taipei, Taiwan, Tuesday, November 19, Sherwood Hotel

  Yokohama, Japan, Friday, November 22, Pacifico Yokohama

 

Lance Wang

IO Methodology Inc.

 

Bob Ross

Teraspeed Consulting Group

 

----------------------------------------------------------------------

                       ASIAN IBIS SUMMIT (SHANGHAI)

                      FOURTH CALL FOR PARTICIPATION

----------------------------------------------------------------------

http://www.eda.org/ibis/summits/nov13a/announcement_chinese.pdf

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

 

           A S I A N   I B I S   S U M M I T   ( S H A N G H A I )

 

Time/Date:  Friday, November 15, 2013, 8:00 AM to 5:30 PM

            Meeting starts at 9:00 AM

 

Location:   Parkyard Hotel Shanghai

            699 Bibo Road

            Zhangjiang Hi-Tech Park

            Shanghai 201203

            P.R. China

 

      http://www.parkyard.com/en/hotel_index.aspx?currenthotelid=6

 

Content:    Presentations and Discussions

 

Purpose:    Solicit and exchange IBIS and interconnect model related

            information and ideas.

 

Primary Sponsor:

            Huawei Technologies

 

Co-sponsors (in alphabetical order):

            Agilent Technologies

            ANSYS

            Cadence Design Systems

            Intel Corporation

            IO Methodology

            Synopsys

            Teledyne LeCroy

 

Cost:       FREE, including refreshments and buffet lunch

 

Vendors:    Some vendors will have information tables

 

            Contact us for details regarding sponsorship.

 

BACKGROUND

 

   We have held seven successful meetings in Shenzhen, Shanghai and

   Beijing. This year we are meeting again in Shanghai where many

   Chinese and foreign high technology companies operate.  These

   events are archived along with all our other Summits:

 

     http://www.eda.org/pub/ibis/summits/

 

   Our objective is to reach out internationally to communicate with

   the local experts and to learn of regional concerns.

 

CONFERENCE LANGUAGE

 

   The conference language is English, but we will plan for technical

   translations in English and Mandarin.  So presenters can optionally

   deliver in Mandarin as long as an English version of the material 

   is available.

 

IBIS SUMMIT

 

   This meeting will be conducted as a formal IBIS Summit Meeting.

   Presentations will be archived in an electronic format on our

   Summits site, and minutes of the meeting will be issued.  However,

   no formal decisions requiring votes will be planned.

 

CALL FOR PARTICIPANTS

 

   People involved in IBIS and interconnect model development, EDA

   tool development, and digital circuit design are invited to

   participate in the Summit meeting.  If you plan to participate,

   please register using the information below (in English):

 

     Name:

     E-mail address:

 

     Company:

     Top-level Web Link:

 

     Country:

 

   Send to BOTH:

 

     Lance Wang, IO Methodology Inc.         lwang@iometh.com

     Bob Ross, Teraspeed Consulting Group    bob@teraspeed.com

 

   SIGNUP DEADLINE: November 8, 2013

 

AGENDA

 

   8:15 -   9:00  Vendor table setup and tables

   8:30 -   9:00  Sign in

   9:00 -  12:00  Presentations

   12:00 - 13:30  Free buffet lunch, vendor tables

   13:30 - 17:00  Presentations

 

TENTATIVE PROGRAM

 

   Intel Corporation

     "Introducing IBIS 6.0"

 

   Teraspeed Consulting Group

     "IBIS Summary Documents"

 

   IO Methodology

     "More on IBIS Modeling for Load-Dependent Current-Mode

     Differential Drivers"

 

   Teraspeed Consulting Group and Cadence Design Systems

     "Combined I-V Table Checking Problem"

 

   Huawei Technologies

     "When Could PCB and PKG PDN Lumped Loop be Extracted

     Separately?"

 

     Second Presentation to be determined

 

   Agilent Technologies

    "Modeling, Extracting and Verification of VCSEL Model for

    IBIS AMI"

 

   Cadence Design Systems

     "Adative Crosstalk Cancellation Block for SERDES and its

     AMI Implementation"

 

     "An Advanced Behavioral Buffer Model with Over-Clocking

     Solution"

 

     "Composite IBIS Model for IO-SSO Analysis"

 

   Spreadtrum and Cadence Design Systems

     "DDRn Interface Signoff Analysis with Distributed Chip IO

     Interconnect Model"

 

   ANSYS

     Presentation to be determined

 

 

LIST OF NEARBY HOTELS AND TRAVEL RULES

 

   Hotels in all price ranges can be found through internet searches.

 

   Comply with your travel rules, such as indicated in the link

   below to China and Shanghai.  Work with your travel agent.  Notify

   us as a sign-up comment if you need assistance.  Visas, if needed,

   should fall in the visit/business category:

 

     http://travel.state.gov/travel/cis_pa_tw/cis/cis_1089.html

 

-----------------------------------------------------------------

 

 

 

--

Bob Ross

Teraspeed Consulting Group, LCC

http://www.teraspeed.com

bob@teraspeeed.com

Direct : 503-246-8048

Teraspeed Labs: 971-279-5325

Headquarters: 401-284-1827

 

Teraspeed is a registered service mark of Teraspeed Consulting Group LLC

 


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Received on Tue Oct 22 16:24:19 2013

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