In my opinion it should be the chip substrate.
Arpad Muranyi
Intel Corporation
============================================================================
Mr,
The purpose of this message is to try to get a good understanding of the
Ccomp parameter within an IBIS model. This Ccomp capacitance is
representing, if I have well understood, the die capacitance of the chip.
Anyway, this value is referenced to a certain ground. The aim of this
e-mail is to understand from which ground is it referred to ? Is it the
reference point of the measurement device (i.e. the same ground than the
package) or the chip substrate that is considered the reference point ?
I would really appreciate any help from you. Thank you in advance.
Sincerely yours,
Julien Boullie
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AEROSPATIALE
12, rue Pasteur BP 76
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phone: (33) 1-46-97-30-40
fax: (33) 1-46-97-30-08
e-mail: julien.boullie@siege.aerospatiale.fr
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Received on Mon Oct 5 17:02:53 1998
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