RE: Mutual coupling in package IBIS model

All,

I just finished the Interconnect Modeling course with
Gigatest Labs in Sunnyvale, CA. and, from that, I can't
think of a situation where such an effort would be
useful except where it's known the pkg resonances and
coupling effects are above the application BW. As you say,
only the single-line characteristics are modeled.
Also see the si-list (don't have the URL; search it at
google.com).

The pkg resonances can be especially pernicious; only
known through 3D field solving.

(The Gigatest http://www.gigatest.com/ courses are 1st
rate. Eric Bogatin has merged with them.)

John Lipsius
Sr. Hardware Engineer
Terawave Communications
510-401-6690

> -----Original Message-----
> From: Yaping Zhou [mailto:y.zhou@motorola.com]
> Sent: 24 July, 2001 6:44 AM
> To: ibis-users@eda.org
> Subject: Mutual coupling in package IBIS model
>
>
> All:
>
> I am writing a program to generate IBIS package model using
> Len and per
> length LRC values. Since coupling between signals is not
> included in the
> model, I alway face a question about the applicability of the
> model. What I
> can say is that thus-obtained model is not good for crosstalk
> and ground
> bounce simulation (in packages), but it's still valid for
> simulating delay,
> reflection etc. Could anyone give me a more comprehensive and
> "official"
> answer or reference article?
>
> Thanks in advance.
>
> --
> **************************************
> Yaping Zhou (r3aadv)
> (512) 933-5803
> Motorola Semiconductor Products Sector
> Final Manufacturing Technology Center
> Ed Bluestein, Austin, Texas
> **************************************
>
>

 
Received on Thu Jul 26 11:26:58 2001