Subject: [IBIS-Users] IBIS Package Model with Multiple Ground Planes and Redundant Port s
From: Lamson, Mike (m-lamson@ti.com)
Date: Mon Nov 11 2002 - 12:44:30 PST
How can an IBIS package model be constructed with multiple ground planes
that have the same input ports at the chip and the same output ports at the
package ball? That is, there are two current paths starting at the same
chip bump and going to the same package ball but on different planes. Does
anyone have an example?
Mike Lamson
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