Subject: [IBIS-Users] Shared pin modelling in MCM
From: Angulo, John (john_angulo@mentorg.com)
Date: Wed Feb 05 2003 - 11:58:21 PST
The following is posted on behalf of Michael Sendrove at Globespanvirata. Please send any private replies to msendrove@globespanvirata.com only.
-----------------------
Hi:
I am trying to find information on how I should specify a pin which is bonded to 2 different pads in an MCM. The information I have is the IBIS model from the two different fabs for the 2 different technologies.
For the first cut model, I will be neglecting substrate and package effects on the electrical charateristics of the pins. This means that I can replicate the IBIS modelling information from the Fabs. That's fine for IO which is directly mapped to 1 bond pad on either die.
However - in this particular MCM, there are several pins bonded to more than 1 pad, and often the pads are on different die. Anyone got any idea what I should do in this case?
Any help much appreciated,
Thanks,
Mike
Mike Sendrove,
IC Design Engineer,
msendrove@globespanvirata.com
DDI: +44 1223 707380
www.globespanvirata.com
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