> ... The I/O is tristated, and then AC analysis is used to > get the ZIN with that gives you "j x omega x Cin" with Cin = C_comp. This would work if the die has no package. If there is any C_pin, you'd need to subtract that from the measurement and leave the remainder to C_comp. And depending on frequency, the effect of L_pin may alter how C_comp becomes part of the total Cin. As a first try, it would probably be better to construct a passive SPICE circuit consisting of package parasitics and C_comp, and figure out how much C_comp is needed to get the Cin that you had extracted. Regards, Andy |------------------------------------------------------------------ |For help or to subscribe/unsubscribe, email majordomo@eda.org |with just the appropriate command message(s) in the body: | | help | subscribe ibis <optional e-mail address, if different> | subscribe ibis-users <optional e-mail address, if different> | unsubscribe ibis <optional e-mail address, if different> | unsubscribe ibis-users <optional e-mail address, if different> | |or email a written request to ibis-request@eda.org. | |IBIS reflector archives exist under: | | http://www.eda.org/pub/ibis/email_archive/ Recent | http://www.eda.org/pub/ibis/users_archive/ Recent | http://www.eda.org/pub/ibis/email/ E-mail since 1993Received on Thu Mar 3 07:02:44 2005
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