Dear ALL, Here, I have some concern to build a INBIS model for a MCP (multi chip package). If let say, I have a product C that stacking-up A and B. That mean there are some pin from these 2 chip are join together and share a same buffer. Now, I want to build a IBIS model for this new product that have A and B together. But I just have the IBIS model for A and B seperately. And I just have schematic for A but not B. Now, can I build the IBIS model for C by using only the IBIS model for A and B? Or Can someone show me the way to get the IBIS model for C? Or Can someone show me some texts for references to solve this problem ? Thanks Rdgs Y.Y. LAU |------------------------------------------------------------------ |For help or to subscribe/unsubscribe, email majordomo@eda.org |with just the appropriate command message(s) in the body: | | help | subscribe ibis <optional e-mail address, if different> | subscribe ibis-users <optional e-mail address, if different> | unsubscribe ibis <optional e-mail address, if different> | unsubscribe ibis-users <optional e-mail address, if different> | |or email a written request to ibis-request@eda.org. | |IBIS reflector archives exist under: | | http://www.eda.org/pub/ibis/email_archive/ Recent | http://www.eda.org/pub/ibis/users_archive/ Recent | http://www.eda.org/pub/ibis/email/ E-mail since 1993Received on Wed Apr 27 17:22:01 2005
This archive was generated by hypermail 2.1.8 : Wed Apr 27 2005 - 17:22:19 PDT