Re: [IBIS-Users] Re: How and where Alternate Package Models of IBIS Version 4.x gets used?

From: Siva Nageswara Rao Borra <siva_at_.....>
Date: Fri Sep 08 2006 - 02:57:32 PDT
Michael,
            Thank you for correcting me.
Now it is clear.
Please help me in clarification regarding the  Golden waveforms and  
[test  data]  ,  [test load],
and external models which I posted earlier.

Thanks and regards,
Siva Borra.

Mirmak, Michael wrote:

> Siva,
>  
> In your comments, you imply that you are including the package when 
> extracting the [Model] I-V and transient waveform information for your 
> buffers.  I would hope that this is not the case. 
>  
> The IBIS structure assumes that the buffer information is extracted 
> separately from the package.  Multiple package model sets, through the 
> [Alternate Package Model] keyword, therefore enable users of the IBIS 
> file for the component to use one set of buffer models with multiple 
> package designs.
>  
> - Michael Mirmak
>   Intel Corp.
>   Chair, EIA IBIS Open Forum
>
> ------------------------------------------------------------------------
> *From:* Siva Nageswara Rao Borra [mailto:siva@india.nsc.com]
> *Sent:* Thursday, September 07, 2006 01:32
> *To:* Mirmak, Michael
> *Cc:* Siva Borra; ibis-users@eda.org; deepti@india.nsc.com
> *Subject:* Re: [IBIS-Users] Re: How and where Alternate Package Models 
> of IBIS Version 4.x gets used?
>
> Hi Michael,
>
>                  Thank you very much.
> While obtaining data for Pullup,Pulldown and waveform data,
> we can consider only one package,  the how would be the  extra package 
> information is useful to the user?
>
> Regards,
> Siva Borra.
>
> Mirmak, Michael wrote:
>
>>Siva,
>>
>>The alternate package keywords simply enable model authors to reference
>>different package electrical descriptions for components that feature
>>identical buffer designs.  For example, a component that is available in
>>both DIP and surface-mount packages could be represented using one IBIS
>>file.  This file would contain the buffer information in the appropriate
>>[Model] keywords and include one set of package information under the
>>[Package Model] keyword.  Electrical data for any other available
>>package designs could be referenced under the [Alternate Package Model]
>>keyword.
>>
>>- Michael Mirmak
>>  Intel Corp.
>>  Chair, EIA IBIS Open Forum 
>>
>>-----Original Message-----
>>From: owner-ibis-users@server.eda.org
>>[mailto:owner-ibis-users@server.eda.org] On Behalf Of Siva Nageswara Rao
>>Borra
>>Sent: Tuesday, September 05, 2006 00:20
>>To: ibis-users@server.eda.org
>>Cc: Siva Nageswara Rao Borra; deepti@india.nsc.com
>>Subject: [IBIS-Users] Re: How and where Alternate Package Models of IBIS
>>Version 4.x gets used?
>>
>>Hi Expert,
>>
>>  
>>
>>>               Can anybody give a clarity on how the 
>>>additional/alternate package models are helpful
>>>and also how they can be supplied?
>>>This is regarding the [Alternate Package]/[End Alternate] Package 
>>>models, available on IBIS version 4.x.
>>>
>>>Thanks in advance for your support.
>>>
>>>With best regards,
>>>Siva Borra.
>>>
>>>
>>>    
>>>
>>
>>
>>
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Received on Fri Sep 8 02:54:13 2006

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