Hi,
Some questions about the IBIS parameters:
When we specify R_pkg, Do we really mean the Resistance of the pin or
the Impedence of the pin. This makes a lot of difference
in calculation of R_pkg. Impedence is an easy calculation(based on L & C)
but something like Resistance needs Bond wire length, Area of wire,
resistivity of the wire etc to get R_pkg.
Any idea how someone gets these R_pkg numbers. Don't say from the
packaging group !!
Also, the C_comp. How does one measure this ? I know of measuring this
using TDR method and comparing with known capacitance curves but that
is not too straight forward. Any ideas !!
Regards,
Syed Huq
National Semiconductor Corp.
Received on Wed Jul 6 09:25:09 1994
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