In my opinion transmission line models will not be adequate for what
happens to the bonding wire. The bonding wire is a weak link in signal
integrity circuit and it is unlikely that it is a TEM structure
which is essential
in order to model it as transmission line. Even distributed transmission line
model as Eric suggests may not do the job. Since the propeties of these structures are not well known , a lumped RLGC model may do as good or "bad" job as
a transmission line model.
Acutally this is very good topic for universities because these structures
can be studied in isolation and the validity and accuracy of a circuit model
representation can be assessed
properly if the right questions are asked.`
- kumar
Received on Tue Mar 8 07:50:42 1994
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