CICC (Papers on interconnects and packages)

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From: dileep%contec.COM%contec@netcom.com at SMTPGATE
Date: 9/20/94 12:16PM
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*cc: dileep@contec.COM at SMTPGATE
Subject: CICC (Papers on interconnects and packages)
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IBIS-oids,

FYI. Forwarded from the si-list reflector.

Will Hobbs
Intel Corp.

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Subject: CICC (Papers on interconnects and packages)
Author: dileep%contec.COM%contec@netcom.com at SMTPGATE
Date: 9/20/94 12:16 PM

Custom Integrated Circuits Conference will be held in
Santa Clara Convention Center, Santa Clara, CA from May 1-4, 1995.
We are trying to put together a session on simulation and modeling
of IC interconnects and packages. In addition to original work,
papers can be of tutorial or instructional nature.
The contents should be useful for IC designers and should not have been
published before. Papers from IC designers are also solicited covering
their needs in this area.
The papers will have to pass the normal review process.
If you are planning to submit a paper for this session, please let me
know. The papers have to be submitted in a camera-ready form by December 14.
If you have not received the Call For Papers and need more information
about obtaining author's kit and detailed instructions, please contact:
Melissa Widerkehr, CICC, 1545 18th Street, NW, Suite 610, Washington,
DC 20036. Phone (202)-986-2166 Fax (202)-986-1139.
My e-mail address is given below. Thanks.
dileep@contec.com

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Cc: dileep@contec.COM
Subject: CICC (Papers on interconnects and packages)
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