Re: Enhanced package modeling for V3 IBIS

>To: Will Hobbs <Will_Hobbs@ccm2.jf.intel.com>
>From: kellee@nwlink.com
>Subject: Re: Enhanced package modeling for V3 IBIS
>
>>
>>
>>Just a thought, how does DIE handle traces in their MCM description? Are we
>>trying to reinvent a wheel?
>>
>>Will
>>
>
>Good question. Any ideas on who to ask? Do you know how to get ahold of
Randy?
>
>I am following up with the EIA folks and have contacted Patty about getting
a copy
>of the PCB format so I can report to the group about what the MCM people at
EDIF
>are doing.
>
>Perhaps someone else would be interested in following up with the DIE spec.
>
>
Have a great day...Kellee Crisafulli, HyperLynx Inc.
Received on Mon Apr 10 13:47:42 1995