Re: Minutes from EIA IBIS Meeting 4/7/95

> From Derrick_Duehren@ccm2.jf.intel.com Thu Apr 13 19:12:06 1995
> Return-Path: <Derrick_Duehren@ccm2.jf.intel.com>
> From: Derrick Duehren <Derrick_Duehren@ccm2.jf.intel.com>
> To: IBIS@vhdl.org
> Subject: Minutes from EIA IBIS Meeting 4/7/95
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>
> Some had concerns that many semiconductor companies won't be willing to put
> this level of package details in the models. After a lengthy discussion, we
> acknowledged that the existing capabilities in the spec are better than
> nothing. Kellee wants to keep the number of new descriptions to a minimum,
> since we already have 3 descriptions. (single rlc, rlc per pin, rlgc). The
> question is, do we need 2 additional descriptions (1. transmission line segment
> description or coupled rlgc matrix 2. full PCB description.) or will one
> additional description suffice?
>
A transmission line description is a rlgc description plus length. The only difference between lumped RLGC and transmission line RLGC is the RLGC in transmission line are per unit length parameters. RLGC per unit length + length of the transmission line is a complete description.
Received on Fri Apr 14 06:57:47 1995