Re[2]: January Face to Face

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Arpad,

Thanks. It is a fifth category, and should be addressed. I posted my
question/suggestion to call attention to the fact that a whole class of issues
never addressed by the forum, the IC vendors' test problem, needs addressing
and could benefit from mutual discussion.

I hope you don't mind that I posted this reply to the reflector.

>Will

>Which category would "what goes into IBIS3 and when will it happen" belong to?
>I feel we will need some time for those topics also.

Arpad
===============================================================================

IBISians,

At our January summit, I would like to suggest an organization to the
meeting: we've generally mixed the presentations between model
providers, EDA vendors, and others. I'd like to make the divisions a
bit more crisp, so we can pursue some common themes that various groups
might have. I suggest we divide the meeting into the following sections:

1. Semiconductor Vendors and their plans and concerns, such as:
    - Model generation
    - Model guarantee
    - Test issues
    - ...
2. Other Model Providers (same issues)
3. Users and their concerns
    - Obtaining models they need
    - Trusting the models
    - Getting the information in the model that is critical (what do
      they use/need the models for and when?)
    - ...
4. EDA vendors and their plans and concerns

Finally, leave room for several open session topics.

Any comments or amplifications to this?

Will Hobbs
Chair, EIA IBIS Committee
Intel Corp.

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Subject: January Face to Face
To: ibis@vhdl.org
Message-Id: <Mon, 06 Nov 95 17:01:05 PST_9@ccm.jf.intel.com>
From: Will Hobbs <Will_Hobbs@ccm.jf.intel.com>
Date: Mon, 06 Nov 95 16:57:00 PST
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