Syed:
I believe that [Ramp] dV/dt information extracted from
actual measurements of a packaged part could have the
dt derated in some consistent manner to produce an
effective die dV/dt. Whether this is done depends on
how much the actual package degrades the response.
There may be several methods to do the adjustment. One
well-known rise time degradation approximation is
based on the 10-90% definition of rise time and
to use
2 2 2
Tmeas = Tdie + Tpkg
to solve for Tdie from Tmeas and some Tpkg derating risetme.
I do not support extending the [Ramp] definition to
provide any further detail because such detail would be
as complicated as the details needed for [Rising Waveform]
and [Falling Waveform] WITHOUT the corresponding
improved resolution that the Waveform provides. In other
words, there would be a lot of parameters for completeness
without the corresponding increase in accuracy.
Bob Ross
Interconnectix, Inc.
> Date: Wed, 10 Apr 96 16:57:35 PDT
> From: huq@rockie.nsc.com (Syed Huq)
> To: ibis-users@vhdl.org
> Subject: Ramp rate and Rising/Falling waveform
> IBISgurus:
> Ramp rate has been defined to be measured WITHOUT package information.
> Rising/Falling waveform has been defined to include the pkg and fixture
> information seperately.
> I think Ramp rate should have the same options as Rising/Falling, ie. the
> ability to add pkg and fixture parameters. This will allow an easy way
> to measure Ramp rate WITH a packaged unit and not on a 'bare die' !
> I also wonder what inaccuracies I can expect if I provide Ramp rate
> data on a packaged unit instead of a bare die.
> Regards,
> Syed
> National Semiconductor
Received on Fri Apr 12 10:42:21 1996
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