Hello Syed:
We use the following as shown below.
Regards,
Stephen Peters
Intel Corp.
[Package Model] NO
[Pin Mapping] NO
[Pullup Reference] YES
[Pulldown Reference] NO
[POWER Clamp Reference] YES
[GND Clamp Reference] NO
[Rgnd] [Rpower] [Rac] [Cac] NO
Hi,
This is an open question to ANY Model provider:
Is anyone providing model data on the parameters mentioned below ?
If yes, Can you pls send me an E-mail, I would like to understand
how they are used.
If NO reponse is received, my assumptions would be, even though these
keywords are part of the IBISv2.1 spec, they are not being used at all.
[Package Model] Defines package param in Matrix format
[Pin Mapping]
[Pullup Reference]
[Pulldown Reference]
[POWER Clamp Reference]
[GND Clamp Reference]
[Rgnd] [Rpower] [Rac] [Cac] Defines a Terminator Model
Regards,
Syed
National Semiconductor Corp.
Received on Fri Dec 6 12:04:52 1996
This archive was generated by hypermail 2.1.8 : Fri Jun 03 2011 - 09:52:29 PDT