Ogawa-san:
Thank you for going over in detail IBIS Version 2.1. You have revealed
some inconsistent usages of words in the text. Per you permission, I am
sending your comments to the IBIS reflector for information. I have also
given my suggestions along with your suggestions in the column "Bob".
I encourage anyone else who is interested to help us resolve some of these
terms.
Some major inconsistencies are related to using "part", "device", and
"component"; "manufacturer", "silicon vendor", and "semiconductor vendor"; and
"pin name" and "pin number".
I have also copied the response I gave you for the first three comments:
Thank you very much for you input and suggested clarifications
regarding IBIS. Your review is extremely valuable to us because
I and others are too familar with IBIS to catch the details you
have presented. I will review each of your text comments and
get back with you with a detailed response.
Regarding your [Notes] comment, you are correct to note that IBIS
does not have any statement that restricts the location of [Notes].
There is an IMPLIED (but UNSTATED) organization that the keywords above
the first [Component] keyword should appear before [Component]. IBIS
did not break out the "header" keywords in the text. There are
other problems as well - IBIS does not specify whether any of
these can appear more than once (it would be meaningless for [Date],
as an example). We actually had to modify the parser to allow
two [Disclaimer]s because it was inadvertantly entered twice on
some stored, acceptable models. I hope there is some correction
in IBIS.
Regarding the "GND" pin, you have discovered a problem. Thank you
for reporting this. Someone else also reported this problem late last
year (it also applies to the "nc", "na", and "power" reserved words).
Furthermore, we discovered that this problem also had existed in the orginal
ibis_chk for Version 1.1 of IBIS. We have decided that this is a MISTAKE in
both ibis_chk and ibis_chk2, but also decided not to fix it in these
parsers. Rather, we plan to make the correction as part of the
ibischk3 parser development project to be used with the future
IBIS Version 3.0.
I was not able to locate the [Temperature] keyword problem. Upon
review, I can see some historically based lack of clarity. The
intention is that the DEFAULT assumed settings (and measurement
or Spice extraction conditions) for CMOS is typ 50 deg, min 100 deg,
and max 0 deg. BIPOLAR technology assumes typ 50 deg, min 0 deg,
and max 100 deg.
I have to review and think about each of your suggested text changes
and give you a detailed response later. I will try to do this within
one week. Some of your suggestions seem very reasonable to me at this
time (for example, to change all references
of "part" to "component"). In other cases, there may be some differences
in context (e.g., and actual "pin" and the reference to its "pin name").
There also may be some English implications that may not be apparent to
you. However, it is very useful for me to examine in detail EACH of
you suggestions, because you have really revealed some inconsistencies
or needless usage of an alternative word. Thank you very much.
Best Regards,
Bob Ross
Interconnectix
Date: Thu, 24 Apr 1997 18:58:30 +0900
From: =?ISO-2022-JP?B?GyRCPi5AbiEhRkY7VhsoQg==?= <FYT46205@biglobe.ne.jp>
To: bob@icx.com
Subject: about_IBIS_V21
Hallow Mr. Bobb Ross
This is first e-mail to you.
My name is Atsushi Ogawa, belong to Memory Engineering Department
Semiconductor Solution Engineering Division of NEC Corporation.
My mission is technical user support. We distributing some IBIS
models.
But starting time( about one year ago ), obtained IBIS file was
.ppt/.xls file!
(Naturally my section converted it into .ibs file with handmade.)
Several of modeling engineer is a little increases currently.
Recently, I may look some illegal .ibs files.
ex. [Notes] keyword is used after [Component] keyword.
(This case was rejected by parser program.)
"GND","VCC" were used as pin name in [Pin] section.
("GND" was rejected by parser program.)
[Pin] signal_name model_name R_pin L_pin C_pin
IO Io1 Buffer1
AJ In2 Input2
GND GND GND
GND1 GND GND
GND2 GND GND
VCC1 VCC POWER
|
[Temperature] keyword of CMOS device becomes typ:50 ,
min:0 , max:100.
To solve these problems, I just started a translation into
Japanese of IBIS Ver.2.1 Spec. now.
Because I discovered lack of unity of expression, I show it
in the following.
I feel it wonderful if have you examine these at the time of
next version up.
Line Current Own idea Bob
(I prefer to use "pin name" because of its usage for pin grid array
pin designation.)
258 pins and signal names pin numbers and signal names
pin names and signal names
261 pin name pin number pin name
1207 pin name pin number pin name
1209 pin name pin number pin name
1458 pin name pin number pin name
8 place pin number pin number pin name
8 place [Pin Numbers] [Pin Numbers] agree
(I agree, except where noted. I have added a change.)
4 integrated circuit integrated circuit agree
208 integrated circuit integrated circuit agree
6 place [Component] [Component] agree
25 component component agree
113 component component agree
201 component component agree
210 component component agree
212 Component Name component component name
223 components manufacturer silicon vendor manufacturer's name
223 Manufacturer's Name manufacturer's name
235 component component agree
257 component component agree
260 component component agree
564 component component agree
711 into the component into the component agree
737 component component agree
(I like your suggestion to elimnate "device". However, I would substitue
"model" EXCEPT when it refers to the PHYSICAL device versus a model for it
(such as real device measurement versus extraction from a Spice model)
694 TTL and CMOS device TTL and CMOS component
TTL and CMOS models
695 device component model
706 device [Model] model
748 ECL device ECL component ECL models
874 device [Model] model
1629 weak device weak component weak device
1630 strong device strong component strong device
1633 typical device typical component typical device
1656 bipolar device bipolar component bipolar device
1657 CMOS device CMOS component CMOS device
1731 ECL type device ECL type component ECL type device
1756 packaged device packaged component packaged device
(I agree to eliminate "part".)
318 part component component
1098 part component component
1163 part component components(s)
1702 part component device
1807 part component delete - see 1806 below
(I prefer "semiconductor vendor" over silicon vendor" because other material
such as GaAs can be used. In some cases, manufacturer can be used.)
6 place [Manufacturer] [Manufacturer]
310 company name silicon vendor name
semiconductor vendor name
10 silicon vendor silicon vendor semiconductor vendor
21 silicon vendor silicon vendor semiconductor vendor
1705 silicon vendor silicon vendor semiconductor vendor
1818 silicon vendor silicon vendor semiconductor vendor
1180 semiconductor vendor silicon vendor semiconductor vendor
196 manufacturer's data book silicon vendor's data book
semiconductor vendor's data book
223 components manufacturer silicon vendor manufacturer's name
224 manufacturer silicon vendor manufacturer's name
226 manufacturer silicon vendor semiconductor vendor
561 manufacturer silicon vendor semiconductor vendor
564 manufacturer silicon vendor semiconductor vendor
1163 manufacturer of the part silicon vendor manufacturer ...
1167 manufacturer silicon vendor semiconductor vendor
1701 manufacturer of the part silicon vendor manufacturer ...
1744 manufacturer's suggested silicon-vendor-suggested
semiconductor vendor's suggested
1806 manufacturer of the part silicon vendor semiconductor vendor
1636 vendor-proprietary silicon silicon-vendor-proprietary
semiconductor-vendor proprietary
1772 vendor-suggested silicon-vendor-suggested
semiconductor vendor suggested
1773 vendor-suggested silicon-vendor-suggested
semiconductor vendor suggested
1778 vendor-suggested silicon-vendor-suggested
semiconductor vendor suggested
1779 vendor-suggested silicon-vendor-suggested
semiconductor vendor suggested
1175 manufacturer of the package manufacturer of the package agree
1176 manufacturer's name name manufacturer's name
1178 manufacturer manufacturer semiconductor vendor
1181 manufacturers package-manufacturers
package manufacturers
(I agree with your change here.)
10 simulation software vendor simulation tool vendor agree
13 simulation vendor simulation tool vendor agree
22 simulation vendor simulation tool vendor agree
1789 simulation tool vendor simulation tool vendor agree
1190 less than 60 not exceed 59 (60?) should be corrected
(parser misses this)
Best regards,
Atsushi Ogawa
Manager
Memory Engineering Department
Semiconductor Solution Engineering Division
NEC Corporation
e-mail FYT46205@pcvan.or.jp
Received on Tue Apr 29 18:10:14 1997
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