IBIS TREE

Ogawa-san and IBIS community:

I am forwarding part of a private note because it contains a nice
outline of the IBIS keywords in a tree configuration. This should
be useful when reading IBIS Version 2.1 to understand where the
keywords fit in.

Best Regards,
Bob Ross
Interconnectix

Date: Thu, 01 May 1997 22:28:24 +0900
From: =?ISO-2022-JP?B?GyRCPi5AbiEhRkY7VhsoQg==?= <FYT46205@biglobe.ne.jp>
To: bob@icx.com
Subject: Re:IBIS Version 2.1 Terminology Suggestions

Dear Mr. Bob Ross

snip ...
 
In this vacation, I make tree figure of .ibs file. (Show last section.)
I have a plan of IBIS explanation meeting. I may use this tree at the time.

I know some problems in the tree. One is [Comment char].
IBIS template said "The [Comment char] keyword can be used throughout the
file, as desired".

But I think that, limitted use makes a few problems.

I can't find a advantage of free use of [Comment char] keyword.
I can find a advantage of free use of comment character(pipe).

Mr. Bob , If you feel some advantege of this tree figure, please use this
format to the next version.

Best Regards,
Atsushi Ogawa at my house

e-mail FYT46205@pcvan.or.jp (I can use at my house)

.ibs FILE
---------
  |-- File date section
  | -----------------
  | |-- [IBIS Ver]
  | |-- [Comment char]
  | |-- [File name]
  | |-- [File Rev]
  | |-- [Date]
  | |-- [Source]
  | |-- [Notes]
  | |-- [Disclaimer]
  | |-- [Copyright]
  |
  |-- [Component]
  | -----------
  | |-- [Manufacturer]
  | |-- [Package]
  | |-- [Pin]
  | |-- [Package Model]
  | |-- [Pin Mapping]
  | |-- [Diff Pin]
  | |-- [Model]
  | | -------
  | | |-- [Temperature Range]
  | | |-- [Voltage Range]
  | | |-- [Pullup Reference]
  | | |-- [Pulldown Reference]
  | | |-- [POWER Clamp Reference]
  | | |-- [GND Clamp Reference]
  | | |-- [Pulldown]
  | | |-- [Pullup]
  | | |-- [GND Clamp]
  | | |-- [POWER Clamp]
  | | |-- [Rgnd]
  | | |-- [Rpower]
  | | |-- [Rac]
  | | |-- [Cac]
  | | |-- [Ramp]
  | | |-- [Rising Waveform]
  | | |-- [Falling Waveform]
  | |
  | |-- [Model]
  |
  |
  |-- [Component]
  |
  |
  |-- [Define Package Model]
  | ----------------------
  | |-- [Manufacturer]
  | |-- [OEM]
  | |-- [Description]
  | |-- [Number of Pins]
  | |-- [Pin Numbers]
  | |-- [Model Data]
  | | ------------
  | | |-- [Resistance Matrix]
  | | | -------------------
  | | | |-- [Bandwidth]
  | | | |--[Row]
  | | | |--[Row]
  | | | | ｜
  | | |-- [Inductance Matrix]
  | | | -------------------
  | | | |-- [Bandwidth]
  | | | |--[Row]
  | | | |--[Row]
  | | | | ｜
  | | |-- [Capacitance Matrix]
  | | | --------------------
  | | | |-- [Bandwidth]
  | | | |--[Row]
  | | | |--[Row]
  | | | | ｜
  | | |-- [End Model Data]
  | |-- [End Package Model]
  |
  |-- [Define Package Model]
  |
  |-- [End]

SHORT TYPE

.ibs FILE
---------
  |-- File date section
  | -----------------
  | |-- [IBIS Ver], [Comment char], [File name], [File Rev], [Date]
  | |-- [Source], [Notes], [Disclaimer], [Copyright]
  |
  |-- [Component]
  | -----------
  | |-- [Manufacturer], [Package], [Pin], [Package Model], [Pin Mapping]
  | |-- [Diff Pin]
  | |-- [Model]
  | | -------
  | | |-- [Temperature Range], [Voltage Range], [Pullup Reference]
  | | |-- [Pulldown Reference], [POWER Clamp Reference]
  | | |-- [GND Clamp Reference], [Pulldown], [Pullup], [GND Clamp]
  | | |-- [POWER Clamp], [Rgnd], [Rpower], [Rac], [Cac], [Ramp]
  | | |-- [Rising Waveform], [Falling Waveform]
  | |
  | |-- [Model]
  |
  |
  |-- [Component]
  |
  |
  |-- [Define Package Model]
  | ----------------------
  | |-- [Manufacturer], [OEM], [Description], [Number of Pins]
  | |-- [Pin Numbers]
  | |-- [Model Data]
  | | ------------
  | | |-- [Resistance Matrix]
  | | | -------------------
  | | | |-- [Bandwidth]
  | | | |--[Row]
  | | | |--[Row]
  | | | | ｜
  | | |-- [Inductance Matrix]
  | | | -------------------
  | | | |-- [Bandwidth]
  | | | |--[Row]
  | | | |--[Row]
  | | | | ｜
  | | |-- [Capacitance Matrix]
  | | | --------------------
  | | | |-- [Bandwidth]
  | | | |--[Row]
  | | | |--[Row]
  | | | | ｜
  | | |-- [End Model Data]
  | |
  | |-- [End Package Model]
  |
  |-- [Define Package Model]
  |
  |-- [End]

Atsushi Ogawa
Manager
Memory Engineering Department
Semiconductor Solution Engineering Division
NEC Corporation

e-mail FYT46205@pcvan.or.jp

p.s. Please correction [Temperature] to [Temperature Range] in
     "NOTES ON DATA DERIVATION METHOD" section. (2-points)
     I'm sorry. I can't show the line number, because of my house
     personal computer haven't line number counter program!

 
Received on Thu May 1 15:17:50 1997